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Samsung Electro-Mechanics to expand FC-BGA substrate capacity for AI servers
July 1, 2026 /SemiMedia/ — Samsung Electro-Mechanics plans to expand production capacity for flip-chip ball grid array substrates used in AI servers, as demand for advanced packaging materials continues to grow. Samsung Electronics Chairman Lee Jae-yong said on June 29 that the company will increase investment in advanced package substrate manufacturing centered on Samsung Electro-Mechanics’…
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AI Demand to Push Global Semiconductor Packaging Market to $618.9 Billion
May 11, 2025 /SemiMedia/ — Korea Printed Circuit Association (KPCA) forecast the global semiconductor packaging market will reach $618.9 billion this year, with AI infrastructure demand continuing to drive growth across advanced packaging and high-performance PCB technologies. According to the industry group, AI servers have become one of the main growth engines for the semiconductor sector.…
