SemiMedia

July 17, 2026 / SemiMedia / — Micron Technology has signed long-term strategic customer agreements with Qualcomm, HARMAN, Visteon, JOYNEXT, DENSO, Astemo and Hyundai Mobis to support the supply of memory and storage products for next-generation connected and AI-enabled vehicles. As vehicle architectures become increasingly software-defined, digital cockpits, advanced driver assistance systems,…

July 17, 2026 / SemiMedia / — Powertech Technology Inc. said its board has approved a plan to establish a panel-level advanced packaging joint venture with Broadcom Technologies in Singapore, with Powertech planning to invest $400 million in the project. The investment will be made in stages according to the construction schedule and funding requirements of the Singapore facility. Powertech said…

July 17, 2026 / SemiMedia / — Mitsubishi Electric aims to reach an agreement with Toshiba and Rohm by September on a plan to combine their semiconductor operations, Mitsubishi Electric CEO Kei Uruma said. The companies are discussing detailed terms for a proposed joint venture that would integrate sales, manufacturing and research and development. Uruma said the parties have reached a…

July 16, 2026 / SemiMedia / — ROHM has expanded its 600V Super Junction MOSFET portfolio with the R60xxXNx and PrestoMOS™ R60xxWNx series, adding DFN8080-5L and TOLL surface-mount packages for high-density power supplies used in AI servers, data centers and industrial equipment. Increasing processing loads in AI and industrial systems are raising power requirements while placing tighter limits…

July 16, 2026 / SemiMedia / — South Korean prosecutors have raided the local offices of Montage Technology, Renesas Electronics and Rambus as part of an investigation into alleged price fixing involving semiconductor components supplied to major memory manufacturers. The Fair Trade Investigation Department of the Seoul Central District Prosecutors’ Office carried out search and seizure…

July 16, 2026 / SemiMedia / — Mainland China, Taiwan region and South Korea are expected to remain the world’s three largest semiconductor equipment markets through 2028 as investment in artificial intelligence, high-performance computing and advanced memory continues to reshape chip manufacturing expenditure. Mainland China is projected to retain its position as the largest equipment market…

July 15, 2026 /SemiMedia/ — Vishay Intertechnology has introduced the VOMHA43A, an automotive 1 MBd high speed optocoupler in a new SOP-5 package with a narrow width of 3.6 mm. The device is designed for automotive, industrial, home and building control, and telecom applications requiring compact size, high isolation voltage and strong noise immunity. Vishay said the VOMHA43A combines a…

July 15, 2026 /SemiMedia/ — Powerchip Semiconductor Manufacturing Corp. said it has raised DRAM wafer prices by about 40% to 45% in July as demand from artificial intelligence applications continues to tighten memory supply. PSMC General Manager Frank Huang said during the company’s earnings conference that both memory and mature-node foundry markets are becoming tighter because of strong…

July 15, 2026 /SemiMedia/ — Tower Semiconductor said it will invest $3 billion to strengthen its chip manufacturing operations in Japan, including $1 billion in support from the Japanese government. The investment is aimed at expanding production of silicon photonics and silicon germanium technologies as demand grows from artificial intelligence and data center applications. Tower’s U.S.-listed…

July 14, 2026 /SemiMedia/ — Bosch has started sample production at its first semiconductor manufacturing facility in the United States and finalized a $225 million funding agreement with the U.S. Department of Commerce to expand domestic silicon carbide chip capacity. The facility is located in Roseville, California. Bosch acquired the site from TSI Semiconductors in 2023 and began converting…

July 14, 2026 /SemiMedia/ — Intel said it has launched a €5 billion, or about $5.7 billion, capital investment plan to expand its semiconductor manufacturing operations in Leixlip, Ireland. The investment is intended to meet growing global demand for processors used in artificial intelligence and high-performance computing systems. Intel said the funding will be used to increase production at…

July 13, 2026 /SemiMedia/ — Infineon Technologies has introduced the SECORA ID Key S USB, a Java Card-based security solution with USB and NFC connectivity for passwordless authentication, digital signatures and public key infrastructure applications. Infineon said the SECORA ID Key S USB is the first solution to receive FIDO Level 3+ certification and is compliant with CTAP 2.1. The…

July 13, 2026 /SemiMedia/ — Samsung Electronics said it plans to bring forward the start of production at its first chip manufacturing facility in Yongin, south of Seoul, to 2029 as demand for memory chips used in artificial intelligence infrastructure continues to grow. The facility had previously been scheduled to begin production between 2030 and 2031. Yongin is one of South Korea’s key…

July 13, 2026 /SemiMedia/ — Samsung Electronics has decided to raise foundry prices for selected manufacturing processes by about 15%, according to South Korean media reports. The increases reportedly cover its high-demand 4nm and 5nm advanced nodes, as well as selected 8nm processes used for automotive chips. The adjustment reflects changing pricing conditions in the global semiconductor…

July 10, 2026 /SemiMedia/ — Micron Technology said it will accelerate its U.S. fab and technology investment plan, raising its expected cumulative capital spending through 2035 to more than $250 billion. The new figure marks a significant increase from the company’s previous $200 billion investment plan. Micron said the additional spending is intended to deepen its domestic semiconductor…

July 9, 2026 /SemiMedia/ — Vishay Intertechnology has introduced four new 40 V TrenchFET Gen IV standard-level n-channel power MOSFETs designed for noisy motor control environments. The Vishay Siliconix SIR5402DP, SIR5404DP, SIR5406DP and SIR5408DP are offered in the 6.15 mm by 5.15 mm PowerPAK SO-8 single package. The devices combine a high minimum gate-source threshold voltage of more than…

July 9, 2026 /SemiMedia/ — Supply chain sources said memory contract prices could rise sharply over the next several quarters, with increases potentially exceeding earlier market expectations. Third-quarter 2026 memory contract prices are still being finalized. The market had previously expected price increases to slow because of a higher base, but supply chain sources said DRAM and Flash memory…