SemiMedia

July 14, 2026 /SemiMedia/ — Bosch has started sample production at its first semiconductor manufacturing facility in the United States and finalized a $225 million funding agreement with the U.S. Department of Commerce to expand domestic silicon carbide chip capacity. The facility is located in Roseville, California. Bosch acquired the site from TSI Semiconductors in 2023 and began converting…

July 14, 2026 /SemiMedia/ — Intel said it has launched a €5 billion, or about $5.7 billion, capital investment plan to expand its semiconductor manufacturing operations in Leixlip, Ireland. The investment is intended to meet growing global demand for processors used in artificial intelligence and high-performance computing systems. Intel said the funding will be used to increase production at…

July 13, 2026 /SemiMedia/ — Infineon Technologies has introduced the SECORA ID Key S USB, a Java Card-based security solution with USB and NFC connectivity for passwordless authentication, digital signatures and public key infrastructure applications. Infineon said the SECORA ID Key S USB is the first solution to receive FIDO Level 3+ certification and is compliant with CTAP 2.1. The…

July 13, 2026 /SemiMedia/ — Samsung Electronics said it plans to bring forward the start of production at its first chip manufacturing facility in Yongin, south of Seoul, to 2029 as demand for memory chips used in artificial intelligence infrastructure continues to grow. The facility had previously been scheduled to begin production between 2030 and 2031. Yongin is one of South Korea’s key…

July 13, 2026 /SemiMedia/ — Samsung Electronics has decided to raise foundry prices for selected manufacturing processes by about 15%, according to South Korean media reports. The increases reportedly cover its high-demand 4nm and 5nm advanced nodes, as well as selected 8nm processes used for automotive chips. The adjustment reflects changing pricing conditions in the global semiconductor…

July 10, 2026 /SemiMedia/ — Micron Technology said it will accelerate its U.S. fab and technology investment plan, raising its expected cumulative capital spending through 2035 to more than $250 billion. The new figure marks a significant increase from the company’s previous $200 billion investment plan. Micron said the additional spending is intended to deepen its domestic semiconductor…

July 9, 2026 /SemiMedia/ — Vishay Intertechnology has introduced four new 40 V TrenchFET Gen IV standard-level n-channel power MOSFETs designed for noisy motor control environments. The Vishay Siliconix SIR5402DP, SIR5404DP, SIR5406DP and SIR5408DP are offered in the 6.15 mm by 5.15 mm PowerPAK SO-8 single package. The devices combine a high minimum gate-source threshold voltage of more than…

July 9, 2026 /SemiMedia/ — Supply chain sources said memory contract prices could rise sharply over the next several quarters, with increases potentially exceeding earlier market expectations. Third-quarter 2026 memory contract prices are still being finalized. The market had previously expected price increases to slow because of a higher base, but supply chain sources said DRAM and Flash memory…

July 9, 2026 /SemiMedia/ — LG Innotek will invest $1 billion in Vietnam to build a semiconductor package substrate plant, according to local government officials. The facility has been approved for construction in Hai Phong and will cover an area equivalent to about 45 football fields. It is expected to begin operations in 2027 and enter mass production in 2028. LG Innotek said the plant will…

July 8, 2026 /SemiMedia/ — onsemi said it will sell two manufacturing facilities as part of a broader effort to reduce costs, improve efficiency and raise margins. The move is part of the company’s “Fab Right” strategy, which is designed to streamline its manufacturing footprint and focus resources on the most competitive and scalable parts of its business. onsemi produces power chips and…

July 8, 2026 /SemiMedia/ — Micron Technology is moving forward with an expansion of its Hiroshima plant in Japan as competition intensifies among global memory makers to build production capacity for artificial intelligence memory chips. The company held a groundbreaking ceremony for the Hiroshima expansion project on July 4 local time, according to reports. The investment is valued at 1.5…

July 7, 2026 /SemiMedia/ — Micron Technology has signed a long-term agreement with Ford Motor to secure the supply of memory and storage platforms for Ford’s next-generation vehicle production. The agreement comes just days after Micron signed a similar deal with General Motors. The two agreements highlight Micron’s effort to expand supply relationships with U.S. automotive customers while…

July 7, 2026 /SemiMedia/ — Infineon Technologies has completed its acquisition of ams OSRAM’s non-optical analog and mixed-signal sensor portfolio, strengthening its position in automotive, industrial, consumer and medical sensing markets. The €570 million transaction was first announced in February 2026 and has now closed after receiving all necessary regulatory approvals. The acquisition…

July 6, 2026 /SemiMedia/ — Industry sources said Samsung Foundry is in talks with Meta Platforms over a potential 10 trillion won contract to mass produce Meta’s third-generation Meta Training and Inference Accelerator. The deal, valued at about $6.54 billion, would cover production of Meta’s next-generation AI ASIC for training and inference workloads. Meta’s first- and second-generation MTIA…

July 6, 2026 /SemiMedia/ — UBS has sharply raised its memory price forecasts, saying DRAM and NAND Flash prices are likely to increase more than previously expected as supply tightness continues across the industry. The bank now expects DDR contract prices to rise 32% sequentially in the third quarter of 2026, compared with its previous forecast of 17%. Fourth-quarter prices are expected to rise…

July 3, 2026 /SemiMedia/ — Infineon Technologies has officially opened its new €5 billion smart power semiconductor fab in Dresden, Germany, marking a major step in Europe’s effort to strengthen domestic chip manufacturing capacity. The facility was completed about three months ahead of schedule and represents one of the largest single investments in Infineon’s history. The new fab will produce…

July 3, 2026 /SemiMedia/ — Kioxia is preparing to begin mass production of its 10th-generation BiCS Flash at its Kitakami plant in Iwate Prefecture, Japan, as demand for high-capacity NAND Flash rises with the expansion of artificial intelligence applications. The next-generation BiCS Flash technology was developed in cooperation with SanDisk and is expected to support data centers, AI servers,…