SemiMedia

July 9, 2026 /SemiMedia/ — Vishay Intertechnology has introduced four new 40 V TrenchFET Gen IV standard-level n-channel power MOSFETs designed for noisy motor control environments. The Vishay Siliconix SIR5402DP, SIR5404DP, SIR5406DP and SIR5408DP are offered in the 6.15 mm by 5.15 mm PowerPAK SO-8 single package. The devices combine a high minimum gate-source threshold voltage of more than…

July 9, 2026 /SemiMedia/ — Supply chain sources said memory contract prices could rise sharply over the next several quarters, with increases potentially exceeding earlier market expectations. Third-quarter 2026 memory contract prices are still being finalized. The market had previously expected price increases to slow because of a higher base, but supply chain sources said DRAM and Flash memory…

July 9, 2026 /SemiMedia/ — LG Innotek will invest $1 billion in Vietnam to build a semiconductor package substrate plant, according to local government officials. The facility has been approved for construction in Hai Phong and will cover an area equivalent to about 45 football fields. It is expected to begin operations in 2027 and enter mass production in 2028. LG Innotek said the plant will…

July 8, 2026 /SemiMedia/ — onsemi said it will sell two manufacturing facilities as part of a broader effort to reduce costs, improve efficiency and raise margins. The move is part of the company’s “Fab Right” strategy, which is designed to streamline its manufacturing footprint and focus resources on the most competitive and scalable parts of its business. onsemi produces power chips and…

July 8, 2026 /SemiMedia/ — Micron Technology is moving forward with an expansion of its Hiroshima plant in Japan as competition intensifies among global memory makers to build production capacity for artificial intelligence memory chips. The company held a groundbreaking ceremony for the Hiroshima expansion project on July 4 local time, according to reports. The investment is valued at 1.5…

July 7, 2026 /SemiMedia/ — Micron Technology has signed a long-term agreement with Ford Motor to secure the supply of memory and storage platforms for Ford’s next-generation vehicle production. The agreement comes just days after Micron signed a similar deal with General Motors. The two agreements highlight Micron’s effort to expand supply relationships with U.S. automotive customers while…

July 7, 2026 /SemiMedia/ — Infineon Technologies has completed its acquisition of ams OSRAM’s non-optical analog and mixed-signal sensor portfolio, strengthening its position in automotive, industrial, consumer and medical sensing markets. The €570 million transaction was first announced in February 2026 and has now closed after receiving all necessary regulatory approvals. The acquisition…

July 6, 2026 /SemiMedia/ — Industry sources said Samsung Foundry is in talks with Meta Platforms over a potential 10 trillion won contract to mass produce Meta’s third-generation Meta Training and Inference Accelerator. The deal, valued at about $6.54 billion, would cover production of Meta’s next-generation AI ASIC for training and inference workloads. Meta’s first- and second-generation MTIA…

July 6, 2026 /SemiMedia/ — UBS has sharply raised its memory price forecasts, saying DRAM and NAND Flash prices are likely to increase more than previously expected as supply tightness continues across the industry. The bank now expects DDR contract prices to rise 32% sequentially in the third quarter of 2026, compared with its previous forecast of 17%. Fourth-quarter prices are expected to rise…

July 3, 2026 /SemiMedia/ — Infineon Technologies has officially opened its new €5 billion smart power semiconductor fab in Dresden, Germany, marking a major step in Europe’s effort to strengthen domestic chip manufacturing capacity. The facility was completed about three months ahead of schedule and represents one of the largest single investments in Infineon’s history. The new fab will produce…

July 3, 2026 /SemiMedia/ — Kioxia is preparing to begin mass production of its 10th-generation BiCS Flash at its Kitakami plant in Iwate Prefecture, Japan, as demand for high-capacity NAND Flash rises with the expansion of artificial intelligence applications. The next-generation BiCS Flash technology was developed in cooperation with SanDisk and is expected to support data centers, AI servers,…

July 3, 2026 /SemiMedia/ — Industry sources said Samsung Electronics is negotiating with customers to raise DRAM average selling prices by up to 20% in the third quarter of 2026 from the previous quarter. The move reflects continued tight supply across memory products as investment in AI infrastructure remains strong. Shortages are affecting not only server DRAM and high-bandwidth memory, but…

July 2, 2026 /SemiMedia/ — U.S. President Donald Trump again referred to Taiwan’s semiconductor industry on July 1, saying the world’s largest chipmaker is moving more production to the United States and has announced plans to double the scale of its Arizona fab expansion. Trump said the United States is creating more jobs and that employment is already at record levels before some of the new…

July 2, 2026 /SemiMedia/ — Supply chain sources said ASE Technology Holding has raised prices again for advanced packaging services, with increases exceeding 20% for some products. The latest adjustment covers multiple advanced packaging technologies, including CoWoS and FoCoS, and also affects major U.S. customers, according to industry sources. The price increase reflects rising material…

July 2, 2026 /SemiMedia/ —Apple is seeking to buy memory chips from Chinese suppliers including ChangXin Memory Technologies for devices sold in China, according to people familiar with the matter. The discussions are still ongoing, and no final agreement has been reached. Apple Chief Executive Officer Tim Cook has also appealed to Trump administration officials, including Treasury Secretary…

July 1, 2026 /SemiMedia/ — Supply chain sources said Yageo has notified customers that it will raise prices across its full capacitor solutions portfolio from July 1, covering multilayer ceramic capacitors, aluminum electrolytic capacitors, tantalum capacitors, polymer aluminum capacitors, film capacitors and supercapacitors. The move is viewed as one of Yageo’s broadest capacitor price…

July 1, 2026 /SemiMedia/ — Samsung Electro-Mechanics plans to expand production capacity for flip-chip ball grid array substrates used in AI servers, as demand for advanced packaging materials continues to grow. Samsung Electronics Chairman Lee Jae-yong said on June 29 that the company will increase investment in advanced package substrate manufacturing centered on Samsung Electro-Mechanics’…