Samsung Electro-Mechanics to expand FC-BGA substrate capacity for AI servers
July 1, 2026 /SemiMedia/ — Samsung Electro-Mechanics plans to expand production capacity for flip-chip ball grid array substrates used in AI servers, as demand for advanced packaging materials continues to grow. Samsung Electronics Chairman Lee Jae-yong said on June 29 that the company will increase investment in advanced package substrate manufacturing centered on Samsung Electro-Mechanics’…















