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Rubber Tips

Rubber Tips are a line of replaceable Pick-Up Tools that can take care of a wide scope of various applications. One of the principles helps its capacity to assimilate the effect that the Pick and Place cycle might have on the pass-on or gadget.

Oricus' Rubber tips come in NBR (Nitrile Rubber), HPR (High-Performance Rubber), UPR (Ultra Performance Rubber), and CR (Composite Rubber) materials. All our elastic materials are created and fabricated in-house extraordinarily for our Pick Up Tools.

It tends to be made in Round, Square, Rectangular, and Custom planned external profiles. Different tip plans like Flat, Vacuum Relief, Groove, Multi-Hole, and Side Contact can be made to suit your specific kick the bucket or gadget.

Flat Tips

Rubber Flat Tip plans are flexible elastic tips that are reasonable for a wide scope of uses. Level Tip plans to highlight a solitary vacuum opening and a level contact surface controlled to tough evenness resistances.

Oricus makes a broad scope of standard Rubber Flat-Tip sizes with focal and offsets vacuum opening arrangements in different sizes. Redone Flat Tip plans with miniature slight dividers (≥0.05mm divider thickness) can likewise be created for exceptional applications.

Vacuum Relief Tips

Elastic Vacuum Relief Tips are intended to keep away from profiles or projections on your bites the dust and gadgets, with a serious level of customization accessible. The plan of our Vacuum Relief Tips highlights a stashed opening on the outer layer of the tip, which makes a repository of air to improve the vacuum pull force during application.

Oricus fabricates a wide scope of standard Rubber Vacuum Relief Tip sizes for normal applications and bite the dust sizes. Tweaked tip sizes highlighting meager dividers plans (≥0.15mm divider thickness) with focal, offset, and round alleviation setups can be planned and fabricated for your particular application.

Groove Tips

Rubber Groove Tips are explicitly intended for a dainty pass on application with bite the dust thickness ≤0.1mm. Tips utilized for Thin pass-on applications require stable vacuum force while boosting tip to bite the dust or gadget surface contact region.

The plan of our Groove Tips includes a focal vacuum opening, associated with numerous vacuum directing notches on the outer layer of the tip, which upgrades even and dispersed attractions force inclusion to the explicit region of the pass-on or gadget. Our restrictive depression plans help to hold the slim passes on delicately and safely during the application cycle.

Matrix Tips

Matrix Tip is the prevalent answer for dainty bite the dust applications with kick the bucket thickness ≤0.1mm. Tips utilized for Thin kick the bucket applications require stable vacuum force while augmenting tip to bite the dust surface contact region.

The plan of our Matrix Tips includes different vacuum openings bored on the outer layer of the tip, in a dispersed grid format. This plan enormously upgrades surface contact and stable pull force inclusion all through the outer layer of the pass on. Our Matrix Tip plans, utilized in mix with our Tri-Lock holders, offer Best-in-Class execution for slim pass on applications.

Side Contact Tips

Rubber Side Contact Tips are appropriate for use in applications where tip contact to the outer layer of the pass on ought to be restricted or kept away from. For these applications, we don't suggest the utilization of surface contact tip plans to defend the basic highlights on the pass on surface.

What is the Bond Test Process? | Oricus Semicon Solutions for more information.

The Bond Test Process from Oricus Semicon Solutions specifies a cutting-edge technology process and a series of processes for determining the precise conditions under which a semiconductor chip must be positioned within a die if it is to work as intended by the original design.

Introduction:-

A Bond Test Process is performed to determine the strength of an adhesive to hold together two materials while being stressed. After the bond has been applied, it is tested the strength of the bond by exerting force on the adhesive in an attempt to detach it from the material.

Purpose of Bond Test Process:-

The overall bonding of a material may be thought of as its bond strength, which is determined by the sort of stress applied to the bond and the temperature at which the test is conducted. The direction of the force applied to the bond will also affect its strength.

There are various types of Bond Testing in the semiconductor industry which are following:-

1)   Wire Pull Test

2)  Die Share Test

3)   Ball Shear Test

4)  Wedge Shear Test

5)  Wedge Bond Wire Pull Test

The Bond Test equipment such as Nordson Dage 4600 Bond Tester, Stellar 4000 Bond Tester, Dage PC 2400 Bond Tester, and Hook-pull Test gauge.

Engineering Plastics Side Contact Tips are suitable for use in applications where tip contact to the surface of the die should be limited or avoided. For these applications, we do not recommend the use of surface contact tip designs in order to safeguard the critical features on the die surface.

The design of our Side Contact Tips features tapered contact angles to contact the selected edges of the die. Our innovative tip geometries ensures the stability and performance for such critical applications during the Pick and Place process.

Engineering Plastics Groove Tips are specifically designed for thin die applications with die thickness ≤0.1mm. Tips used for Thin die applications require stable vacuum force while maximizing tip to die or device surface contact area.

The design of our Groove Tips features a central vacuum hole, connected to multiple vacuum channeling grooves on the surface of the tip, which enhance seven and distributed suction force coverage to specific areas of the die or device. Our proprietary groove designs help to hold the thin dies gently and securely during the application process.