Standard Engineering Plasatic Pickup Tools Flat Tip Design are available from Oricus Semicon Solutions.

Engineering Plastics Flat Tips are a versatile design that are suitable for a wide range of applications. Flat Tip designs feature a single vacuum hole and a flat contact surface controlled to stringent flatness tolerances.

What is the Bond Test Process? | Oricus Semicon Solutions for more information.

The Bond Test Process from Oricus Semicon Solutions specifies a cutting-edge technology process and a series of processes for determining the precise conditions under which a semiconductor chip must be positioned within a die if it is to work as intended by the original design.

Introduction:-

A Bond Test Process is performed to determine the strength of an adhesive to hold together two materials while being stressed. After the bond has been applied, it is tested the strength of the bond by exerting force on the adhesive in an attempt to detach it from the material.

Purpose of Bond Test Process:-

The overall bonding of a material may be thought of as its bond strength, which is determined by the sort of stress applied to the bond and the temperature at which the test is conducted. The direction of the force applied to the bond will also affect its strength.

There are various types of Bond Testing in the semiconductor industry which are following:-

1)   Wire Pull Test

2)  Die Share Test

3)   Ball Shear Test

4)  Wedge Shear Test

5)  Wedge Bond Wire Pull Test

The Bond Test equipment such as Nordson Dage 4600 Bond Tester, Stellar 4000 Bond Tester, Dage PC 2400 Bond Tester, and Hook-pull Test gauge.

Alloy Steel Flat Tips are a versatile design that are suitable for a wide range of applications. Flat Tip designs feature a single vacuum hole and a flat contact surface controlled to stringent flatness tolerances.

Non Ferrous Groove Tips are specifically designed for thin die applications with die thickness ≤0.1mm which are primarily used for bonded devices deployed in harsh environments.

Tip designs used for thin die applications require stable vacuum force while maximizing tip to die or device surface contact area.

Our Non-Ferrous Material Group comprises of materials that provide excellent thermal transfer and even heat distribution across the tip area with the appropriate levels of hardness and toughness for precision Die Attach to be performed.

Engineering Plastics Side Contact Tips are suitable for use in applications where tip contact to the surface of the die should be limited or avoided. For these applications, we do not recommend the use of surface contact tip designs in order to safeguard the critical features on the die surface.

The design of our Side Contact Tips features tapered contact angles to contact the selected edges of the die. Our innovative tip geometries ensures the stability and performance for such critical applications during the Pick and Place process.

Engineering Plastics Matrix Tip is the superior solution for thin die applications with die thickness ≤0.1mm. Tips used for Thin die applications requires stable vacuum force while maximizing tip to die surface contact area.

The design of our Matrix Tips features multiple vacuum holes drilled on the surface of the tip, in a distributed matrix layout. This design greatly enhances surface contact and stable suction force coverage throughout the surface of the die.

Engineering Plastics Groove Tips are specifically designed for thin die applications with die thickness ≤0.1mm. Tips used for Thin die applications require stable vacuum force while maximizing tip to die or device surface contact area.

The design of our Groove Tips features a central vacuum hole, connected to multiple vacuum channeling grooves on the surface of the tip, which enhance seven and distributed suction force coverage to specific areas of the die or device. Our proprietary groove designs help to hold the thin dies gently and securely during the application process.

Plastic Vacuum Relief Tips for enhanced Vacuum Suction.

Engineering Plastics Vacuum Relief Tips are designed to avoid profiles or protrusions on your dies and devices, with a high degree of customization available. The design of our vacuum relief tips features a pocketed opening on the surface of the tip, which creates a reservoir of air to enhance the vacuum suction force during application.