#cowos

Taiwan Semiconductor Manufacturing Co. (TSMC) plans to open a chip packaging plant in Arizona by 2029, an executive told Reuters. Modern artificial intelligence chips, such as those made by Apple and Nvidia, are not single chips but several chips glued together using advanced packaging technologies. This step has become a major supply bottleneck for Nvidia and other companies. In a January…

Strong demand for AI processors drives TSMC’s growth November 17, 2025 /SemiMedia/ — Taiwan Semiconductor Manufacturing Co. (TSMC) is set to benefit from another wave of AI-related chip demand as major customers including Nvidia, AMD and Broadcom continue to secure advanced-node capacity. Industry analysts say the surge in AI processors, networking ASICs and high-performance accelerators is…

November 14, 2023 /SemiMedia/ — According to reports, after NVIDIA increased its orders to TSMC in October, Apple, AMD, Broadcom, Marvell and other companies also began to increase orders. In response to the needs of the above-mentioned five major customers, TSMC will accelerate the expansion of CoWoS advanced packaging production capacity. TSMC is expected to increase its monthly production…

AMD Targets High-End Signal Processing With New Versal Premium With AI Engines

AMD introduced the Xilinx Versal Premium with AI Engines for signal processing applications AMD In the first major product announcement since the acquisition of FPGA leader Xilinx, AMD (the former Xilinx Group) announced a new Versal Premium Adaptive Compute Accelerated Platform (ACAP) with AI Engines for high-end signal processing applications like radar, wireless network testing equipment,…