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The world of optoelectronics continues to evolve rapidly, demanding packaging solutions that deliver precision, durability, and uncompromised performance. As industries increasingly depend on advanced sensing technologies, high-speed communication systems, and ruggedized electronic assemblies, the importance of reliable optical and optoelectronic packaging has become more critical than ever.

Electronic Products (EPI) delivers innovative optical packaging solutions designed to meet the complex demands of modern applications. With extensive expertise in glass-to-metal sealing and ceramic package manufacturing, EPI provides highly engineered solutions that support a broad range of optical and optoelectronic devices. From standard package configurations to fully customized designs, EPI offers manufacturing capabilities that help customers achieve exceptional device performance in even the harshest operating environments.

Advanced Optical Packaging Built for Performance

Optical packaging serves as the protective and functional enclosure for sensitive electronic and photonic components. These packages do much more than simply house devices. They provide mechanical stability, environmental protection, thermal management, and electrical connectivity, all while ensuring optimal optical performance.

At EPI, every optical package is engineered with precision to support exact fit, form, and function requirements. Whether the application involves laser diodes, LEDs, photodetectors, VCSELs, or specialized sensing elements, EPI designs packages that maximize reliability and operational efficiency.

The company’s in-house engineering capabilities allow customers to select from proven standard package designs or collaborate on fully customized solutions tailored to specific device requirements. This flexibility enables design optimization across multiple performance parameters, including thermal dissipation, signal integrity, hermeticity, and size constraints.

Specialized Glass-to-Metal Seal Technology

One of EPI’s core manufacturing strengths lies in its advanced glass-to-metal seal technology. This process creates hermetic seals that protect internal components from moisture, contaminants, and environmental exposure.

Glass-to-metal sealing remains a preferred solution for many optical and electronic applications because of its exceptional durability and long-term reliability. These seals provide stable electrical insulation while maintaining strong mechanical bonds between metallic and glass components.

For optical device manufacturers, this technology offers several critical advantages. It enhances package longevity, supports operation in extreme temperatures, and ensures dependable performance in environments where conventional packaging methods may fail.

EPI’s extensive experience in glass-to-metal manufacturing allows the company to produce optical TO headers and custom package configurations that consistently meet strict industry standards for performance and reliability.

Compact Hermetic Pill Packages for Space-Constrained Applications

As electronic systems become smaller and more sophisticated, compact packaging solutions are essential. EPI manufactures some of the industry’s smallest footprint hermetic ceramic-based Pill packages for advanced optoelectronic devices.

These miniature packages are particularly well-suited for applications involving VCSELs, LEDs, and precision sensing elements where compact integration is necessary without sacrificing performance.

The hermetic construction protects sensitive components from external environmental factors while ensuring stable operation in challenging conditions. This makes Pill packages an ideal choice for applications requiring miniaturization alongside rugged reliability.

Their compact design also enables seamless integration into next-generation sensing systems where board space is limited and packaging efficiency directly impacts overall system performance.

Custom Optical TO Header Solutions

Traditional TO-header packages continue to play a significant role in optical and electronic device manufacturing. EPI offers both conventional glass-to-metal sealed TO headers and advanced ceramic-based optical TO-header solutions.

Ceramic-based optical TO headers provide greater design flexibility compared to traditional metal-can configurations. They support more intricate circuit patterns, additional interconnect options, and enhanced customization capabilities for complex optoelectronic assemblies.

These packages are especially beneficial for applications requiring higher electrical performance, tighter tolerances, and specialized optical alignment.

By combining established TO-header reliability with ceramic substrate innovation, EPI provides customers with versatile solutions capable of meeting evolving technology demands across multiple industries.

High-Performance Aluminum Nitride Substrates

For highly demanding applications such as focal plane arrays, image sensing systems, and LiDAR technologies, advanced substrate performance is essential.

EPI designs and manufactures large multilayer aluminum nitride (AlN) based substrates specifically engineered for high-performance optical and electronic systems.

Aluminum nitride offers exceptional thermal conductivity, electrical insulation, and mechanical stability. These characteristics make it an excellent material for applications where heat management and signal integrity are critical.

The multilayer construction enables high I/O density, supporting increasingly complex circuit architectures required for advanced imaging and sensing systems.

These substrate solutions are particularly valuable in applications where operational precision must be maintained under challenging thermal and environmental conditions.

Optical Packaging for Harsh Environment Applications

Many optical and optoelectronic systems operate in environments where exposure to vibration, temperature fluctuations, moisture, and mechanical stress is unavoidable.

EPI specializes in developing optical packages capable of performing reliably under these demanding conditions.

Its robust manufacturing processes and carefully selected materials ensure package integrity across harsh operational environments. This makes EPI optical packaging an ideal choice for applications in aerospace systems, defense technologies, industrial automation, and advanced commercial sensing platforms.

Reliability in these sectors is not optional. Packaging failure can compromise entire systems, making high-quality hermetic construction essential for mission-critical applications.

Supporting Military, Aerospace, and Commercial Innovation

Optical and optoelectronic packaging requirements vary significantly across industries. Military and aerospace applications often require extreme durability and stringent compliance standards, while commercial systems demand scalability, efficiency, and rapid development timelines.

EPI supports this wide range of requirements by delivering solutions tailored to specific production volumes and technical specifications.

Its engineering team works closely with customers to develop packaging strategies that align with application performance goals while maintaining cost-effectiveness and manufacturability.

This collaborative approach enables innovation while reducing development challenges for customers entering highly competitive technology markets.

Vertically Integrated Manufacturing for Quality and Efficiency

A major advantage of partnering with EPI is its vertically integrated powder-to-package manufacturing process.

This comprehensive in-house capability provides greater control over every production stage, from raw material processing through final package assembly.

Vertical integration ensures tighter quality control, improved consistency, and faster lead times compared to fragmented manufacturing models.

For customers, this means dependable product quality, responsive engineering support, and streamlined production schedules that help accelerate time to market.

Driving the Future of Optical Packaging

As sensing technologies, optical communications, and photonic systems continue to advance, packaging innovation remains central to enabling higher performance and greater reliability.

EPI continues to push the boundaries of optical package design through advanced materials, precision manufacturing, and engineering expertise.

Innovation in electronic packaging continues to shape the performance and reliability of modern devices, and the TO-5 package stands out as a proven solution in this space. Commonly referred to as TO-205AA, the TO-5 is a metal can transistor package engineered for durability, thermal efficiency, and consistent electrical performance. Its compact yet robust structure makes it an excellent choice for applications that demand both precision and resilience, especially in environments where reliability cannot be compromised.

What Makes the TO-5 Package Unique

The TO-5 package is designed with a hermetically sealed metal enclosure that protects sensitive semiconductor components from external contaminants such as moisture, dust, and gases. This level of protection ensures long-term stability and performance, even in harsh operating conditions. The circular metal can structure also contributes to effective heat dissipation, allowing the device to handle higher power levels without overheating.

Another defining feature of the TO-5 package is its flexibility in design. With configurations supporting up to 10 leads, it accommodates a wide range of circuit requirements. Engineers can tailor the package with various lead arrangements, materials, and finishes, including gold plating, to meet specific electrical and mechanical needs. This adaptability makes the TO-5 a preferred choice for both legacy system upgrades and new product development.

Explore detailed information about TO-5 packages click here.

Applications Across High-Performance Industries

TO-5 transistors and packages are widely used in applications where performance and reliability are critical. In RF and microwave systems, they deliver stable signal transmission and efficient power handling. Industrial equipment benefits from their rugged construction, ensuring consistent operation in demanding environments. Additionally, audio amplifiers rely on TO-5 components for their ability to maintain signal integrity and manage heat effectively.

Their hermetic sealing and build quality also make them suitable for aerospace, defense, and medical applications, where failure is not an option. Whether used in high-frequency communication systems or precision instrumentation, TO-5 packages provide the reliability needed to support mission-critical operations.

Hermetic Sealing for Harsh Environments

One of the most important advantages of TO-5 packages is their hermetic sealing capability. This feature ensures that internal components remain isolated from environmental factors that could degrade performance over time. By preventing the ingress of moisture and contaminants, hermetic sealing significantly extends the lifespan of the device.

Manufacturers often offer both matched seal and compression seal options to suit different design requirements. Matched seals are ideal for applications where thermal expansion compatibility is crucial, while compression seals provide strong mechanical integrity. These options allow engineers to select the most suitable sealing method based on their specific application needs.

Customization and Manufacturing Excellence

Modern TO-5 solutions go beyond standard configurations by offering extensive customization options. From selecting housing materials to defining lead configurations and surface finishes, every aspect of the package can be tailored to meet precise requirements. This level of customization ensures seamless integration into existing systems while also supporting innovative new designs.

Advanced manufacturing techniques play a key role in delivering high-quality TO-5 packages. Precision engineering, combined with strict quality control processes, ensures that each component meets rigorous performance standards. These practices not only enhance reliability but also ensure consistency across production batches, which is essential for large-scale applications.

Thermal Efficiency and Performance Optimization

Efficient heat management is a critical factor in electronic device performance, and the TO-5 package excels in this area. Its metal construction allows for effective heat dissipation, reducing the risk of thermal stress and improving overall device longevity. This makes it particularly suitable for high-power applications where temperature control is essential.

By maintaining stable operating temperatures, TO-5 transistors can deliver consistent performance even under demanding conditions. This reliability translates into improved system efficiency and reduced maintenance requirements, making them a cost-effective choice over the long term.

A Structured Approach to Design and Support

A comprehensive approach to TO-5 package development begins with understanding the specific requirements of the application. This includes evaluating electrical, thermal, and mechanical parameters to ensure the optimal design solution. The process typically involves detailed consultation, followed by design, prototyping, and rigorous testing.

Prototyping allows for real-world validation of the design, ensuring that it meets performance expectations before full-scale production. Rigorous testing further guarantees that the final product can withstand operational stresses and deliver consistent results. This structured approach minimizes risks and ensures that the final solution aligns perfectly with the intended application.

Long-Term Reliability and Lifecycle Support

Beyond initial design and manufacturing, ongoing support plays a crucial role in maximizing the value of TO-5 packages. Continuous monitoring, maintenance, and performance evaluation help ensure that the components operate efficiently throughout their lifecycle. This long-term commitment to quality and reliability is essential for applications where downtime or failure can have significant consequences.

With proper support and maintenance, TO-5 packages can deliver dependable performance for extended periods, making them a trusted solution across various industries.

Conclusion

Microwave and radio frequency (RF) technologies power some of the most advanced systems across modern industries, yet their performance often depends on how well they withstand challenging environmental conditions. From high humidity to corrosive gases, these external factors can significantly weaken signal integrity and disrupt system reliability. This is where hermetic packaging plays a critical role, ensuring that sensitive RF and microwave components operate with precision, stability, and long-term durability.

Understanding the Need for Hermetic RF & Microwave Packaging

RF and microwave systems are highly sensitive to environmental exposure. Even minimal moisture ingress or air contamination can interfere with signal transmission, leading to performance degradation or complete system failure. In applications where accuracy is non-negotiable—such as defense systems, satellite communication, or medical imaging—this risk becomes unacceptable.

Hermetic packaging addresses this challenge by creating a completely sealed enclosure that prevents the entry of moisture, gases, and other contaminants. These packages are engineered to maintain either a vacuum or a controlled internal atmosphere, ensuring consistent performance regardless of external conditions. As a result, hermetic RF packages significantly improve signal reliability, reduce noise interference, and extend the operational lifespan of electronic components.

Advanced Engineering for High-Performance Applications

EPI specializes in designing and manufacturing high-performance RF and microwave packages that meet both industry standards and highly customized requirements. These packages are not one-size-fits-all solutions. Instead, they are carefully engineered to suit specific applications, environments, and performance expectations.

Customization options include glassless designs for enhanced durability, tailored layouts to meet unique circuit requirements, and hybrid microelectronic packaging that integrates multiple technologies into a single compact unit. This flexibility allows engineers to optimize both functionality and efficiency, even in the most demanding use cases.

By combining advanced materials and innovative design techniques, EPI ensures that each package delivers consistent electrical performance while maintaining structural integrity under stress.

Applications Across Critical Industries

Hermetic RF and microwave packages are essential in a wide range of industries where reliability and precision are paramount. In military and defense sectors, these packages are used in electronic warfare systems, radar technologies, and secure communication networks. The ability to operate flawlessly in extreme environments makes them indispensable for mission-critical operations.

In aerospace and satellite communications, hermetic packages protect sensitive electronics from the harsh conditions of space, including temperature fluctuations and vacuum exposure. They also play a vital role in uplink and downlink systems, ensuring uninterrupted data transmission.

Beyond defense and aerospace, these packages are widely used in commercial wireless infrastructure and advanced instrumentation systems. Applications extend to medical radiography, where accurate imaging is essential, as well as police radar systems and radio astronomy, where even the slightest signal distortion can impact results.

Material Expertise and Manufacturing Capabilities

One of the key strengths of EPI lies in its comprehensive in-house manufacturing capabilities. With expertise in alumina (Al₂O₃) and aluminum nitride (AlN) ceramic processing, the company produces packages that offer excellent thermal conductivity, electrical insulation, and mechanical strength. These materials are particularly well-suited for RF and microwave applications, where heat management and signal integrity are critical.

In addition to ceramic processing, EPI utilizes glass-to-metal sealing technology to create robust hermetic seals. This process ensures a reliable bond between different materials, preventing leaks and maintaining the integrity of the internal environment over time.

As a powder-to-package manufacturer, EPI controls every stage of the production process—from raw material selection to final assembly. This vertical integration allows for greater quality control, faster turnaround times, and the ability to meet highly specific customer requirements.

Supporting Legacy and Obsolete Components

In many industries, especially defense and aerospace, systems are designed for long-term use and cannot always be easily upgraded. This creates a demand for legacy components that may no longer be available from original manufacturers.

EPI addresses this challenge by offering support for discontinued or obsolete RF and microwave packages. With extensive design and manufacturing expertise, the company can replicate or redesign legacy components to ensure compatibility with existing systems. This capability helps organizations maintain operational continuity without the need for costly system overhauls.

Quality, Compliance, and Industry Experience

Reliability in RF and microwave packaging is not just about design—it also depends on strict adherence to quality and regulatory standards. EPI operates as an ITAR-registered and ISO 9001:2015 certified manufacturer, demonstrating its commitment to quality, consistency, and compliance.

With decades of experience in the microwave industry, EPI has built a reputation for delivering dependable hermetic packaging solutions. Its engineering team works closely with clients to understand their specific challenges and develop solutions that meet both technical and economic requirements.

Types of RF & Microwave Hermetic Packages

EPI offers a wide range of hermetic package types to support diverse applications. TO headers are commonly used for housing semiconductor devices and provide reliable hermetic sealing in compact designs. Diode packages are engineered to protect sensitive components while maintaining optimal electrical performance.

Component packages are designed for individual electronic elements, ensuring protection without compromising functionality. Hybrid packages integrate multiple components into a single enclosure, enabling more complex circuit designs in a compact footprint. Surface mount (SMT) devices offer compatibility with modern assembly processes, making them ideal for high-volume production environments.

Conclusion

Hermetic RF and microwave packaging is a cornerstone of modern electronic system design, enabling reliable operation in environments that would otherwise compromise performance. By preventing contamination and maintaining controlled internal conditions, these packages ensure the accuracy, efficiency, and longevity of critical systems.

Modern RF and microwave technologies are at the heart of critical systems used in defense, aerospace, communications, medical diagnostics, and scientific research. These systems are frequently deployed in environments where humidity, corrosive gases, pressure variation, and temperature extremes can compromise performance. Without adequate protection, even minor environmental exposure can degrade signal integrity and lead to premature system failure. Hermetic electronic packaging provides the level of protection required to ensure consistent and reliable RF performance in these demanding conditions.

Environmental Challenges in RF and Microwave Applications

Microwave and RF systems are especially vulnerable to environmental contamination. Moisture intrusion can alter dielectric properties, cause corrosion, and introduce signal loss. Gaseous contaminants may weaken transmission efficiency, while pressure changes can stress internal components. To address these challenges, hermetic RF packages are designed to form an airtight, contamination-resistant barrier that safeguards sensitive electronics.

In addition to environmental sealing, many applications require vacuum-rated or pressure-maintaining enclosures. Hermetic microwave packages provide this capability, enabling stable operation in aerospace, satellite, and high-altitude systems where atmospheric conditions vary significantly. By isolating internal components from external influences, hermetic solutions preserve signal accuracy and long-term system reliability.

EPI’s Leadership in RF and Microwave Electronic Packages

EPI is a trusted provider of high-performance RF and microwave electronic packages engineered for both standard and highly specialized applications. With decades of experience in hermetic packaging technology, EPI delivers solutions that meet stringent military, aerospace, and commercial requirements.

EPI’s hermetic packages are actively used in advanced programs including electronic warfare systems, radar platforms, satellite uplink and downlink equipment, and secure military communication networks. Beyond defense applications, EPI supports commercial and scientific uses such as wireless instrumentation, medical radiography, police radar systems, and radio astronomy. In each case, EPI’s microwave hermetic packaging ensures reliable performance in harsh and unpredictable environments.

Custom-Engineered Hermetic RF Solutions

Every RF and microwave system presents unique design challenges. EPI specializes in custom-engineered solutions that address specific electrical, mechanical, and environmental requirements. Customization options include glassless designs, specialized conductor layouts, and hybrid microelectronic assemblies that integrate multiple functions within a compact enclosure.

High-integrity RF hermetic seals are central to these designs, providing durable protection without compromising RF performance. By working closely with OEM customers, EPI develops packaging solutions that optimize space, improve thermal management, and support complex RF architectures.

To know more about Hermetic RF packages click here.

In-House Ceramic and Sealing Capabilities

A key differentiator for EPI is its complete in-house manufacturing capability. EPI processes both alumina (Al₂O₃) and aluminum nitride (AlN) ceramics, allowing precise control over material properties and package performance. Alumina ceramics are widely used for their excellent insulation and mechanical stability, while aluminum nitride is preferred for applications requiring high thermal conductivity.

EPI also maintains advanced glass-to-metal sealing capabilities, enabling robust hermetic interfaces between ceramic substrates and metal conductors. These seals are essential for maintaining long-term hermeticity and ensuring reliable electrical connections under thermal and mechanical stress. The result is hermetic RF packages that perform consistently throughout their operational life.

Powder-to-Package Manufacturing Excellence

As a powder-to-package manufacturer, EPI controls every stage of the production process from raw ceramic materials to finished hermetically sealed assemblies. This vertical integration allows for greater design flexibility, tighter quality control, and faster development cycles.

EPI’s hermetic electronic packaging solutions are engineered to meet and exceed environmental and performance standards while remaining cost-effective for OEM applications. By combining ceramic processing, glass-to-metal sealing, and hybrid microelectronic integration, EPI delivers packaging solutions that reduce system complexity and enhance reliability.

Supporting Mission-Critical Performance

From military and aerospace platforms to medical imaging and advanced research systems, the reliability of RF and microwave electronics is non-negotiable. Hermetic microwave packages provide the protection needed to maintain signal integrity, reduce maintenance requirements, and extend system lifespan.

EPI’s expertise in microwave hermetic packaging enables customers to deploy high-performance RF systems with confidence, even in the harshest environments. By creating sealed, controlled internal environments, EPI’s solutions help ensure consistent operation and superior performance.

Conclusion

In the world of high-reliability electronics, TO packages, TO headers, and hermetic device packaging play an indispensable role in ensuring performance, protection, and durability. Transistor Outline (TO) formats have served as industry standards for decades, giving engineers a dependable, robust foundation for building sensors, laser modules, and optoelectronic systems. As modern applications become increasingly demanding, these proven Transistor Outline packages continue to offer unmatched mechanical strength, thermal stability, and environmental protection.

Electronic Products (EPI) has been at the forefront of this technology for more than 60 years, helping manufacturers across industries achieve reliable, mission-critical operation through precision-engineered hermetic TO packages, hermetic headers, and TO metal can packages. Unlike general suppliers, EPI focuses heavily on TO styles, enabling them to deliver exceptional hermeticity, JEDEC-compliant designs, and U.S-made quality.

Why TO Packages Remain Essential for Today’s Electronics

Although semiconductor packaging technologies have evolved rapidly, the importance of TO-series packages has not diminished. Their metal can structure, circular footprint, and robust sealing options make them ideal for applications where reliability, contamination control, and thermal performance are top priorities.

Industries such as defense, aerospace, optics, medical instrumentation, and industrial automation continue to depend on hermetically sealed components to keep circuits secure in environments exposed to pressure changes, vibration, extreme temperatures, and humidity. This is where EPI’s glass-to-metal seal headers, welded hermetic packages, and industry-trusted TO footprints deliver significant advantages.

To know more about TO headers click here.

EPI’s Expertise in Hermetic Packaging and TO Headers

EPI brings decades of specialization in hermetic device packaging a level of expertise not often found in generic component suppliers. Their engineering team excels in material science, hermetic sealing technologies, and precision manufacturing, making them a reliable partner for both legacy and next-generation device designs.

Key Advantages of EPI’s TO Packages and TO Headers

Deep in-house knowledge of hermetic construction, metallurgy, and optical-grade sealing

Standard JEDEC-compliant outlines available for easy integration into existing designs

Custom configuration options that allow engineers to tailor pin counts, plating, and sealing methods

Versatile plating choices—Nickel, Silver, Copper, Gold, or combination finishes

Compression or matched seal construction, depending on application requirements

U.S.-based, ISO 9001:2015 manufacturing, ensuring quality, traceability, and consistency

RoHS / REACH compliant production, supporting global environmental and safety standards

This careful engineering makes EPI’s TO products ideal for laser diode packaging, sensor packaging TO, and high-precision optoelectronic device packaging.

Strength and Reliability of Hermetic TO Packages

High-reliability environments demand packaging that safeguards internal electronics from both environmental and operational stress. Hermetic TO packages offer several significant benefits:

1. Long-Term Hermeticity

Using advanced sealing techniques such as glass-to-metal seals and precision welding ensures a complete barrier against moisture, oxygen, dust, and chemical contaminants.

2. Superior Thermal Performance

Metal can construction helps dissipate heat efficiently, which is especially crucial for applications involving laser emitters, high-power LEDs, and temperature-sensitive sensors.

3. Electromagnetic Protection

Robust metallic shielding mitigates EMI/RFI interference, improving accuracy and stability in sensitive analog and optical systems.

4. Mechanical Strength and Longevity

TO packages withstand vibration, mechanical shock, and rapid temperature fluctuations, making them ideal for demanding industrial and defense environments.

These attributes make metal can packages for electronics a reliable choice for mission-critical designs.

Common Transistor Outline Footprints from EPI

EPI offers a wide selection of standard and custom TO-series packages, including:

TO-5

TO-8 / Jumbo TO-8

TO-18

TO-39

TO-46

These timeless formats continue to support design flexibility and proven hermetic performance. Engineers can customize plating layers, pin configurations, and sealing styles to meet the needs of modern semiconductor, sensor, and optoelectronic applications.

Plating Materials That Enhance Performance

Plating materials affect electrical interface quality, solderability, corrosion resistance, and thermal conductivity. EPI offers a wide range of finishes, including:

Nickel (Ni) for barrier and corrosion resistance

Copper (Cu) for superior conductivity

Silver (Ag) for low electrical resistance

Gold (Au) for long-term oxidation protection

Combination plating for optimized performance across multiple parameters

Such features are vital for applications like optoelectronic device packaging, photodetectors, precision sensors, and high-power laser assemblies.

Industry Applications That Rely on Hermetic TO Packages

Hermetic TO packages have applications across numerous industries where reliability, stability, and environmental protection are essential.

1. Laser and Optical Devices

For laser emitters and optical sensors, laser diode packaging utilizing TO cans ensures thermal stability and precise optical alignment.

2. Sensors and Instrumentation

Pressure, infrared, and temperature sensors rely on sensor packaging TO to maintain signal accuracy in harsh or variable conditions.

3. Aerospace and Defense Systems

Mission-critical systems demand hermetically sealed components capable of withstanding radiation, shock, vibration, and extreme temperature cycles.

4. Medical and Analytical Equipment

Hermetic TO headers support precision electronics used in diagnostic instruments, implantable devices, and monitoring systems.

5. Optoelectronics and Semiconductor Devices

Optoelectronic device packaging ensures a contamination-free environment for photodiodes, LEDs, detectors, and communication modules.

Why Manufacturers Prefer EPI for TO Packaging Solutions

EPI’s commitment to quality, engineering precision, and U.S-based manufacturing sets them apart in the hermetic packaging industry. Their dedication to TO packages, TO headers, and hermetic TO packages ensures consistent performance and reliability across all products.

Whether you're updating a legacy system or designing a new generation of optoelectronic or sensor devices, EPI delivers:

Exceptional hermeticity

Precision manufacturing

Fast turnaround

Custom engineering support

High-reliability performance

With decades of specialization in TO structures, EPI is the trusted partner for companies seeking robust and durable TO metal can packages.

Ready to upgrade your electronic packaging with industry-leading hermetic TO solutions? Contact EPI today to discuss your project, request a quote, or explore custom-engineered TO headers and packages tailored to your application.