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When AOI says no, the engineer says wait!!

The board didn't pass AOI. Instead of flagging it and moving on, the engineer pulled it to the rework station.

On May 16, leaders from Shaoyang University — the alma mater of our CEO, Frank — visited STHL for guidance and exchange.

It was more than just an industry-academia meeting. It was a moment to look back at where it all started.

We shared with our honored guests how STHL has grown, our production capabilities, and our journey in the PCBA industry.

Unseen Solder Joints, See Them Clearly with X-Ray

Solder balls on the bottom of BGAs, solder run-through on the sides of QFNs, tiny voids and cracks—these details invisible to the naked eye are revealed one by one by STHL using X-Ray.

STHL Workshop Daily Life | Every Moment Adds to Reliability

This is our workshop, at its most authentic.

Machines run non-stop, workers are focused and organized, and boards flow silently between production lines. —Every position, in its own way, is writing a footnote to today's quality commitment.

Moments Captured by the Camera Today

Preparation for surface mount line changeover, materials are being neatly shelved.

Colleagues are checking data at the first article inspection machine.

From the SMT workshop to the manual DIP insertion, the camera pans across every corner of the factory, recording not only the operation of the equipment, but also our daily commitment to "reliability."

We believe: True manufacturing lies in every meticulously handled detail.

In STHL's SMT workshop, reflow soldering is not just a process step, but a core technology determining soldering reliability. We use precise temperature control to ensure every solder joint reaches a perfect state.

2 x 10-zone reflow ovens + 1 x 8-zone reflow oven

Supports soldering needs from simple single-sided boards to complex HDI boards

Optional nitrogen process, oxygen concentration < 1000ppm

Oxidation rate reduced by 90%, resulting in bright and full solder joints

Stable temperature rise, safe solvent evaporation

Fluoride activation, oxide removal

Precise temperature control, achieving perfect eutectic bonding

Optimized solidification structure, improved solder joint strength

► Lateral Temperature Difference < ± 2℃

► Supports lead-free/lead-containing process switching

► Real-time temperature profile monitoring and traceability

BGA void rate controlled below 8%

Soldering defect rate reduced by 35%

Supports automotive electronics-grade reliability requirements

In STHL's SMT workshop, the loading area is the core hub ensuring efficient production. The neatly arranged feeders here are not only material carriers but also our precision arsenal for rapid line changeovers.

Intelligent Feeder Area Working Logic

✅ Pre-loading System

The trays of materials for projects about to go into production are pre-loaded into the feeders.

A unique project ID tag is generated, achieving precise material matching.

✅ Rapid Line Changeover Mechanism

The entire feeder rack is replaced directly during production line changes.

STHL Feeder Area Core Values

► Increased Capacity: Utilizing production gaps for material preparation, increasing equipment uptime by 35%.

► Zero Error Rate: Eliminating the risk of incorrect materials through dual barcode verification.

► Flexible Response: Supporting parallel material preparation for up to three urgent order insertion projects.

We make production flow as smooth as a symphony.