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Supply chain sources say TSMC and Winbond are working on WoW memory stacking for AI chips
June 29, 2026 /SemiMedia/ — Supply chain sources said TSMC is accelerating efforts to build a local DRAM supply chain and is working with Winbond Electronics on wafer-on-wafer stacking technology for AI-related chip applications. The cooperation is said to focus on WoW, an advanced 3D wafer stacking technology that combines memory wafers with TSMC logic process wafers. Winbond is expected to…
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