Selecting the correct SMT stencil thickness is one of the most important decisions in PCB assembly. The stencil controls the amount of solder paste deposited on each pad, directly affecting solder joint quality, component placement, and manufacturing yield. A stencil that's too thin may cause insufficient solder, while one that's too thick can lead to solder bridges and assembly defects. Choosing the right thickness based on component size, pitch, and PCB complexity helps ensure consistent, high-quality production.
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