Jan 22, 2019
Heilind Electronics was bestowed with 2018 Excellent Passive Component Authorized Distributor by China Electronics Distribution Association (CEDA)
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Heilind Electronics was bestowed with 2018 Excellent Passive Component Authorized Distributor by China Electronics Distribution Association (CEDA)
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What does an Optical Attenuator do ?
What does an Optical Attenuator do ?
With the advancement of DWDM technology, as well as the potential to flexibly upgrade the reconfigurable optical add-drop multiplexer (ROADM), the demand for optical attenuator is sure to soar, especially for optical variable attenuator.
 Optical Attenuators, or fiber optic attenuators, are used in optical communications to reduce optical fiber power at a certain level. Generally, the attenuator…
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Global Passive Component Market Research Report 2015 - Hexareports.com
The report firstly introduced the Passive Component basics: definitions, classifications, applications and industry chain overview; industry policies and plans; product specifications; manufacturing processes; cost structures and so on. Then it analyzed the world's main region market conditions, including the product price, profit, capacity, production, capacity utilization, supply, demand and industry growth rate etc. In the end, the report introduced new project SWOT analysis, investment feasibility analysis, and investment return analysis.
 Passive component materials suppliers, including Leatec Fine Ceramics, Liton Technology and Prosperity Dielectrics, have all seen their order visibility extend to three months, assuring that that their revenues will move up steadily month by month in the third quarter, according to industry sources.
The electron technology of the whole print is brought PCB industrial change and progress
The application in PCB of printing technology of electronic ink jet of the whole print mainly behaves in three aspects: Application in the figure is shifted; In the application that is buried and inlaid in the passive component; In the whole print electron forming the circuit and connecting directly (including capsulating the respect) Application of China. The application brings improving and progress for PCB industry.
Advisor of Chinese printed circuit employer's organization The money of forest is stopped up
Look from the prospects of application and development at present and in the future, the electronic ink jet printing technology of the whole print is in mainly behaving in three major the following in application in PCB: Application in the figure is shifted; In the application that is buried and inlaid in the passive component; In the whole print electron forming the circuit and connecting directly (including capsulating the respect) Application of China. The application will bring revolutionary change and progress to PCB industry.
Employ in PCB figure is shifted: Mainly reflect it in 4 aspects
The application in PCB figure is shifted of printing technology of ink jet is mainly in 4 respects such as erosion resistance, resisting plating, solder resistance and character. Because it is basically the same to print and form the resist pattern and resist and plate the technological process of the figure in ink jet, and print formative solder resistance figure and character figure and is very close in ink jet, so, are divided into and formed erosion resistance (resist and plate) below Figure and forming solder resistance / two parts of character figure to comment briefly.
1.In the application forming erosion resistance / resisting and plating in the figure
Adopt digital ink printer directly resist (resist, etch the ink) Spray to the internal layer (or the skin) In plate making, can get acid or alkaline resisting the etchant figure, through UV (ultraviolet ray) After photo-curing, can etch and go the membrane, thus get the circuit figure that internal layer,etc. required. The same, it is basically the same to resist the course of plating the figure.
Win erosion resistance / resist and plate the figure by printing technology and craft of digital ink jet, have not only reduce the fabrication process of the photographic plate but also avoided the course exposed and developed, its advantage brought is the space saving and space, has reduced material consumption (especially film and apparatus,etc.) obviously ,Shortened products production cycle, reduced environmental contamination, lowered costs. At the same time, the more important thing is to raise position degree and inter-lamination of the figure it to the location degree (especially dispelled the dimensional change of the film and is exposed the size deflection brought to the location,etc.) obviously ,Improve quality and raise the product percent of pass as to the multi-layer pcb board, it is extremely favorable. Have imaging (LDI) more direct with laser it The same, can shorten PCB production cycle, improves product quality, it is technical important reform and progress of PCB industry.
Adopt the figure printed in digital ink jet and transfer technology, it processes the process minimumly (insufficient tradition is technical 40%) ,Used apparatuses and materials are minimum, production cycle is the shortest, therefore, energy-conserving emission reduction has the most prominent result, the environmental contamination and cost are the lowest.
2.Application in forming solder resistance / character figure
The same, adopt direct pairs of solder resist (solder resistance ink) digital ink printers Or the character ink is sprayed to PCB in plate making directly, part after UV photo-curing, get final required solder resist figure and character figure.
Obtain solder resistance and character figure by printing technology and craft of digital ink jet, have obviously improved the solder resistance of PCB products and position precision of the character figure, for improving PCB board quality and raising the product percent of pass, it is extremely favorable.
Employ in burying and inlaying the passive component: Produce more high-grade products
At present, the method to inlay passive component is buried, it is including resistance type / electric capacity type to mostly adopt and cover the copper foil board (CCL) Or screen print the method of associated ink,etc. to realize, but these methods, not merely there are many but complicated technological processes, it is long, there are many apparatuses to take a large number of spaces, and the deflection of properties of product is great, it is very difficult to produce the high-grade products. Consume energy greatly when the more important thing is to processing, it is great to produce pollution too, is unfavorable to enviromental protection, realize that the method to inlay passive component is buried by printing the technology in ink jet, will improve these situations greatly.
Print and bury the application which is inlaid the passive component in ink jet, refer to the ink printer and spray using as relevant ink such as the electrically conductive printing ink of the passive component inside the PCB on the position presumed directly, punish or dry / deal with by sintering through UV light, thus form, bury the intersection of PCB and product to inlay the passive component.
The passive component that said herein refers to the resistance, electric capacity and inductor (have already develop to bury and inlay the active component now, if capsulate systematically) . Because of the development in high density and high frequency of the electronic product,etc., in order to try hard to reduce cross talk (inductive reactance, capacitive reactance) When distortion, noise,etc. that bring, need increasingly many passive component. Meanwhile, because there is more and more passive number of elements, the area not merely taken is larger and larger in proportion, and its bonding pad is more and more, have already become maximum factors of industry's electronic product failure rate. In addition, the passive component of surface mounting is formative the loop and two-shot interference of production,etc., these factors are threatening the reliability of the electronic product more and more seriously. So, bury and inlay the passive component in PCB to improve the electrical performance of electronic product and reduce the failure rate, have already begun to become one of the main products that PCB produces.
About principle and method to inlay passive component are buried in PCB. Generally speaking, bury and inlay the resistance, electric capacity and inductive passive component, except that the public electric capacity is put between the electricity / stratum, place multi-layer PCB on bilaminar reciprocal and bilaminar (n-1) mostly while being other Have.
Used as conducting resin of resistance (ink) of the resistance Inner laminarization (already etched) utilizing the printing unit of ink jet to spray to PCB On the position already presumed, both ends on its bottom have etched wire (open a way) Connecting, through toasting, measuring, then press in PCB board.
The same, is used as capacitive conducting resin of electric capacity (ink) Utilize the ink printer to spray on the copper foil in the preset position, drying and/or sintering, spray and have one layer and include electrically conductive printing ink such as silver, drying again and/or sintering, then laminate (inversion comes over) , etching, not only form the electric capacity but also form the circuit of internal layer.
In electronic product and electronic device, use the quantity of the inductor, much less compared with resistance and electric capacity. Same, utilize ink printer the intersection of conductivity and ink(form radial deflection terminal) , the inductance material ink forms the dielectric layer of high inductance, spray the electrically conductive printing ink to form the coil on the dielectric layer of high inductance again.
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Free to watch • No registration required • HD streaming
The electron technology of the whole print is brought PCB industrial change and progress
The application in PCB of printing technology of electronic ink jet of the whole print mainly behaves in three aspects: Application in the figure is shifted; In the application that is buried and inlaid in the passive component; In the whole print electron forming the circuit and connecting directly (including capsulating the respect) Application of China. The application brings improving and progress for PCB industry.
Advisor of Chinese printed circuit employer's organization The money of forest is stopped up
Look from the prospects of application and development at present and in the future, the electronic ink jet printing technology of the whole print is in mainly behaving in three major the following in application in PCB: Application in the figure is shifted; In the application that is buried and inlaid in the passive component; In the whole print electron forming the circuit and connecting directly (including capsulating the respect) Application of China. The application will bring revolutionary change and progress to PCB industry.
Employ in PCB figure is shifted: Mainly reflect it in 4 aspects
The application in PCB figure is shifted of printing technology of ink jet is mainly in 4 respects such as erosion resistance, resisting plating, solder resistance and character. Because it is basically the same to print and form the resist pattern and resist and plate the technological process of the figure in ink jet, and print formative solder resistance figure and character figure and is very close in ink jet, so, are divided into and formed erosion resistance (resist and plate) below Figure and forming solder resistance / two parts of character figure to comment briefly.
1.In the application forming erosion resistance / resisting and plating in the figure
Adopt digital ink printer directly resist (resist, etch the ink) Spray to the internal layer (or the skin) In plate making, can get acid or alkaline resisting the etchant figure, through UV (ultraviolet ray) After photo-curing, can etch and go the membrane, thus get the circuit figure that internal layer,etc. required. The same, it is basically the same to resist the course of plating the figure.
Win erosion resistance / resist and plate the figure by printing technology and craft of digital ink jet, have not only reduce the fabrication process of the photographic plate but also avoided the course exposed and developed, its advantage brought is the space saving and space, has reduced material consumption (especially film and apparatus,etc.) obviously ,Shortened products production cycle, reduced environmental contamination, lowered costs. At the same time, the more important thing is to raise position degree and inter-lamination of the figure it to the location degree (especially dispelled the dimensional change of the film and is exposed the size deflection brought to the location,etc.) obviously ,Improve quality and raise the product percent of pass as to the multi-layer pcb board, it is extremely favorable. Have imaging (LDI) more direct with laser it The same, can shorten PCB production cycle, improves product quality, it is technical important reform and progress of PCB industry.
Adopt the figure printed in digital ink jet and transfer technology, it processes the process minimumly (insufficient tradition is technical 40%) ,Used apparatuses and materials are minimum, production cycle is the shortest, therefore, energy-conserving emission reduction has the most prominent result, the environmental contamination and cost are the lowest.
2.Application in forming solder resistance / character figure
The same, adopt direct pairs of solder resist (solder resistance ink) digital ink printers Or the character ink is sprayed to PCB in plate making directly, part after UV photo-curing, get final required solder resist figure and character figure.
Obtain solder resistance and character figure by printing technology and craft of digital ink jet, have obviously improved the solder resistance of PCB products and position precision of the character figure, for improving PCB board quality and raising the product percent of pass, it is extremely favorable.
Employ in burying and inlaying the passive component: Produce more high-grade products
At present, the method to inlay passive component is buried, it is including resistance type / electric capacity type to mostly adopt and cover the copper foil board (CCL) Or screen print the method of associated ink,etc. to realize, but these methods, not merely there are many but complicated technological processes, it is long, there are many apparatuses to take a large number of spaces, and the deflection of properties of product is great, it is very difficult to produce the high-grade products. Consume energy greatly when the more important thing is to processing, it is great to produce pollution too, is unfavorable to enviromental protection, realize that the method to inlay passive component is buried by printing the technology in ink jet, will improve these situations greatly.
Print and bury the application which is inlaid the passive component in ink jet, refer to the ink printer and spray using as relevant ink such as the electrically conductive printing ink of the passive component inside the PCB on the position presumed directly, punish or dry / deal with by sintering through UV light, thus form, bury the intersection of PCB and product to inlay the passive component.
The passive component that said herein refers to the resistance, electric capacity and inductor (have already develop to bury and inlay the active component now, if capsulate systematically) . Because of the development in high density and high frequency of the electronic product,etc., in order to try hard to reduce cross talk (inductive reactance, capacitive reactance) When distortion, noise,etc. that bring, need increasingly many passive component. Meanwhile, because there is more and more passive number of elements, the area not merely taken is larger and larger in proportion, and its bonding pad is more and more, have already become maximum factors of industry's electronic product failure rate. In addition, the passive component of surface mounting is formative the loop and two-shot interference of production,etc., these factors are threatening the reliability of the electronic product more and more seriously. So, bury and inlay the passive component in PCB to improve the electrical performance of electronic product and reduce the failure rate, have already begun to become one of the main products that PCB produces.
About principle and method to inlay passive component are buried in PCB. Generally speaking, bury and inlay the resistance, electric capacity and inductive passive component, except that the public electric capacity is put between the electricity / stratum, place multi-layer PCB on bilaminar reciprocal and bilaminar (n-1) mostly while being other Have.
Used as conducting resin of resistance (ink) of the resistance Inner laminarization (already etched) utilizing the printing unit of ink jet to spray to PCB On the position already presumed, both ends on its bottom have etched wire (open a way) Connecting, through toasting, measuring, then press in PCB board.
The same, is used as capacitive conducting resin of electric capacity (ink) Utilize the ink printer to spray on the copper foil in the preset position, drying and/or sintering, spray and have one layer and include electrically conductive printing ink such as silver, drying again and/or sintering, then laminate (inversion comes over) , etching, not only form the electric capacity but also form the circuit of internal layer.
In electronic product and electronic device, use the quantity of the inductor, much less compared with resistance and electric capacity. Same, utilize ink printer the intersection of conductivity and ink(form radial deflection terminal) , the inductance material ink forms the dielectric layer of high inductance, spray the electrically conductive printing ink to form the coil on the dielectric layer of high inductance again.
The electron technology of the whole print is brought PCB industrial change and progress
The application in PCB of printing technology of electronic ink jet of the whole print mainly behaves in three aspects: Application in the figure is shifted; In the application that is buried and inlaid in the passive component; In the whole print electron forming the circuit and connecting directly (including capsulating the respect) Application of China. The application brings improving and progress for PCB industry.
Advisor of Chinese printed circuit employer's organization The money of forest is stopped up
Look from the prospects of application and development at present and in the future, the electronic ink jet printing technology of the whole print is in mainly behaving in three major the following in application in PCB: Application in the figure is shifted; In the application that is buried and inlaid in the passive component; In the whole print electron forming the circuit and connecting directly (including capsulating the respect) Application of China. The application will bring revolutionary change and progress to PCB industry.
Employ in PCB figure is shifted: Mainly reflect it in 4 aspects
The application in PCB figure is shifted of printing technology of ink jet is mainly in 4 respects such as erosion resistance, resisting plating, solder resistance and character. Because it is basically the same to print and form the resist pattern and resist and plate the technological process of the figure in ink jet, and print formative solder resistance figure and character figure and is very close in ink jet, so, are divided into and formed erosion resistance (resist and plate) below Figure and forming solder resistance / two parts of character figure to comment briefly.
1.In the application forming erosion resistance / resisting and plating in the figure
Adopt digital ink printer directly resist (resist, etch the ink) Spray to the internal layer (or the skin) In plate making, can get acid or alkaline resisting the etchant figure, through UV (ultraviolet ray) After photo-curing, can etch and go the membrane, thus get the circuit figure that internal layer,etc. required. The same, it is basically the same to resist the course of plating the figure.
Win erosion resistance / resist and plate the figure by printing technology and craft of digital ink jet, have not only reduce the fabrication process of the photographic plate but also avoided the course exposed and developed, its advantage brought is the space saving and space, has reduced material consumption (especially film and apparatus,etc.) obviously ,Shortened products production cycle, reduced environmental contamination, lowered costs. At the same time, the more important thing is to raise position degree and inter-lamination of the figure it to the location degree (especially dispelled the dimensional change of the film and is exposed the size deflection brought to the location,etc.) obviously ,Improve quality and raise the product percent of pass as to the multi-layer pcb board, it is extremely favorable. Have imaging (LDI) more direct with laser it The same, can shorten PCB production cycle, improves product quality, it is technical important reform and progress of PCB industry.
Adopt the figure printed in digital ink jet and transfer technology, it processes the process minimumly (insufficient tradition is technical 40%) ,Used apparatuses and materials are minimum, production cycle is the shortest, therefore, energy-conserving emission reduction has the most prominent result, the environmental contamination and cost are the lowest.
2.Application in forming solder resistance / character figure
The same, adopt direct pairs of solder resist (solder resistance ink) digital ink printers Or the character ink is sprayed to PCB in plate making directly, part after UV photo-curing, get final required solder resist figure and character figure.
Obtain solder resistance and character figure by printing technology and craft of digital ink jet, have obviously improved the solder resistance of PCB products and position precision of the character figure, for improving PCB board quality and raising the product percent of pass, it is extremely favorable.
Employ in burying and inlaying the passive component: Produce more high-grade products
At present, the method to inlay passive component is buried, it is including resistance type / electric capacity type to mostly adopt and cover the copper foil board (CCL) Or screen print the method of associated ink,etc. to realize, but these methods, not merely there are many but complicated technological processes, it is long, there are many apparatuses to take a large number of spaces, and the deflection of properties of product is great, it is very difficult to produce the high-grade products. Consume energy greatly when the more important thing is to processing, it is great to produce pollution too, is unfavorable to enviromental protection, realize that the method to inlay passive component is buried by printing the technology in ink jet, will improve these situations greatly.
Print and bury the application which is inlaid the passive component in ink jet, refer to the ink printer and spray using as relevant ink such as the electrically conductive printing ink of the passive component inside the PCB on the position presumed directly, punish or dry / deal with by sintering through UV light, thus form, bury the intersection of PCB and product to inlay the passive component.
The passive component that said herein refers to the resistance, electric capacity and inductor (have already develop to bury and inlay the active component now, if capsulate systematically) . Because of the development in high density and high frequency of the electronic product,etc., in order to try hard to reduce cross talk (inductive reactance, capacitive reactance) When distortion, noise,etc. that bring, need increasingly many passive component. Meanwhile, because there is more and more passive number of elements, the area not merely taken is larger and larger in proportion, and its bonding pad is more and more, have already become maximum factors of industry's electronic product failure rate. In addition, the passive component of surface mounting is formative the loop and two-shot interference of production,etc., these factors are threatening the reliability of the electronic product more and more seriously. So, bury and inlay the passive component in PCB to improve the electrical performance of electronic product and reduce the failure rate, have already begun to become one of the main products that PCB produces.
About principle and method to inlay passive component are buried in PCB. Generally speaking, bury and inlay the resistance, electric capacity and inductive passive component, except that the public electric capacity is put between the electricity / stratum, place multi-layer PCB on bilaminar reciprocal and bilaminar (n-1) mostly while being other Have.
Used as conducting resin of resistance (ink) of the resistance Inner laminarization (already etched) utilizing the printing unit of ink jet to spray to PCB On the position already presumed, both ends on its bottom have etched wire (open a way) Connecting, through toasting, measuring, then press in PCB board.
The same, is used as capacitive conducting resin of electric capacity (ink) Utilize the ink printer to spray on the copper foil in the preset position, drying and/or sintering, spray and have one layer and include electrically conductive printing ink such as silver, drying again and/or sintering, then laminate (inversion comes over) , etching, not only form the electric capacity but also form the circuit of internal layer.
In electronic product and electronic device, use the quantity of the inductor, much less compared with resistance and electric capacity. Same, utilize ink printer the intersection of conductivity and ink(form radial deflection terminal) , the inductance material ink forms the dielectric layer of high inductance, spray the electrically conductive printing ink to form the coil on the dielectric layer of high inductance again.
The passive component is prosperous to rebound Every distributor will put up windward driving next year
(China's strong electronic WorldNet's exclusive report) The passive component is prosperous to rebound, sell quotient representation from stock, in the second half of this year, have already adjusted the operation project actively. Under the circumstances that the passive component industry will recover continuously, the relevant products operation of the passive component will relatively grow up this year next year. The newest stock quotations of Shenzhen reveal, the passive component market demand is still prosperous at present, extend will it be the end November the intersection of demand and prosperous tendency this, some the intersection of experience and distributor predict passive the intersection of component and outloading make expected slack period light too next the first season. It is reported, because 3C products grow up fast, the passive component manufacturer produces and sells in order this year, the price and state between supply and demand have not met with under the disruptive situation, the camp of market of passive component accepts and still has the tendency to raise up at to the end of 2005, not only a scene of happy expression of outloading of market, the quotations of the stock reveal MLCC products even supply the hard-to-get sign. Passive component, until big factory amalgamate effect, camp it accepts to be passionate very, spot market every distributor make a profit, follow up synchronously this year. Under growing up in market demand and Taiwanese, Japanese manufacturer have not obviously expanded and produced the situation, the owner predicts, the passive component industry will behave not low-key next year. Distributor pointed out the experience, the global development in economy rate grew up continuously in 2005, in addition, consuming hot sales of electronic product such as MP3 player, PSP, GPS, intelligent mobile phone, help the lasting heat of market demand of the passive component to hold in place with a net. It is reported, the passive component is in the second half of this year the price is stopped steadily, except that consuming electronic products such as LCD TV,etc. presented the multiple to the passive component demand in the past and grew up, Taiwan and Japanese leading firm has not obviously expanded producing, passive component industry to exactly combine intensively this year, and tacit understanding,etc. of beating the price down instead among the same trade, it is the price that stops the main reason to fall. The quotations of the stock reveal, include the depreciation tendency of price of two large passive components such as the chip resistance, ceramic electric capacity of multilayer has already become steady at present. (Editor: He Jing) Welcome contribution and offer the news clue, welcome your criticism and suggestion! Tel.: 0755-83291727 Postbox: [email protected]