YXLON International is pleased to declare the most recent innovation advances to their business sector driving FeinFocus item go
This arrangement is a great deal more exact than past variants, due, to some degree, to the nature of outline and building in the new controller get together, permitting littler and less thick components to be imaged than it was beforehand conceivable. This new innovation delivers unfathomably prevalent laminography results, when contrasted with different frameworks which rotate the indicator or use sub-par controllers.
The assessment of a mind boggling get together or segment with "Micro3Dslices" including the programmed investigation of the cut by-cut pictures now takes under 40 seconds for every part, because of these improvements. By method for the virtual turn hub, the district of interest can be picked anytime on the vast review zone and "Micro3Dslices" can begin instantly, giving steady investigation aftereffects of most noteworthy accuracy and quality. Semicon and Wafer examinations additionally advantage significantly utilizing the enhanced mapping innovation and exact imperfection markings bolster the simple sorting of damaged parts, another key necessity for this requesting market.
This new innovation likewise offers a colossal jump forward for a wide range of 2D imaging and the precision and repeatability for a wide range of assessment schedules and in addition examinations in the field of hardware applications, including QFN review. The model will be displayed surprisingly at the SMT show in Nuremberg, Germany.











