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DDIC suppliers consider price hikes as wafer and packaging costs rise
March 31, 2026 /SemiMedia/ — TrendForce said rising wafer, packaging and material costs are putting pressure on display driver IC (DDIC) suppliers, with some companies starting talks with panel makers about possible price increases. Wafer fabrication makes up about 60% to 70% of DDIC costs, while packaging and testing account for roughly 20%. Prices for foundry services have moved higher due to…
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