Jun 22
⚡ 400G → 800G → 1.6T. Optical modules need better thermal management. AlN delivers.
With the rapid development of AI computing power, cloud computing, and data center networks, optical communication systems are continuously
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⚡ 400G → 800G → 1.6T. Optical modules need better thermal management. AlN delivers.
With the rapid development of AI computing power, cloud computing, and data center networks, optical communication systems are continuously
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96 Alumina (Al2O3) Substrates
Innovacera’s 96 Alumina (Al₂O₃) Substrates combine high density, superior thermal conductivity, and excellent dielectric strength, making them an ideal choice for electronic and energy applications. With outstanding resistance to high temperature, acid, and alkali corrosion, these substrates ensure stable performance even in demanding environments. Their precision machining and customizable sizes provide reliable solutions for thick and thin film resistors, low-power LEDs, and energy storage systems.
Innovacera’s 96 Alumina (Al₂O₃) Substrates combine high density, superior thermal conductivity, and excellent dielectric strength, making th
Uses and Characteristics of Ceramic Substrate
Ceramic substrate refers to copper foil directly bonded to alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate surface (single or double sided) at high temperature on a special process plate. The ultrathin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent soft brazing and high adhesion strength, and can be etched into a variety of graphics like PCB board, with great current-carrying capacity. Therefore, ceramic substrate has become the basic material of high power electronic circuit structure technology and interconnection technology. Purpose: High-power semiconductor module; Semiconductor cooler, electronic heater; Power control circuit, power mixing circuit. Intelligent power module; High frequency switching power supply, solid state relay. Automotive electronics, aerospace and military electronics components. Solar panel module; Telecommunications private exchange, receiving system; Laser and other industrial electronics. Features: Strong mechanical stress, stable shape; High strength, high thermal conductivity, high insulation; Strong binding force, anti-corrosion. Excellent thermal cycle performance, cycle times up to 50,000, high reliability. And PCB board (or IMS substrate) can be etched out of a variety of graphic structure; No pollution, no pollution. Ceramic Substrate Use temperature range -55℃ ~ 850℃; Thermal expansion coefficient is close to silicon, simplifying the production process of power module.
Aluminum Nitride Ceramic Substrate Read the full article
Active Metal Brazed (AMB) Ceramic Substrate
AMB (Active Metal Brazing) is for joining ceramics that are not wetted by 'conventional' brazes. Applying active metal like titanium is added to the braze alloy, to achieve a chemically reacts with the surface of the parent ceramic. Due to the coefficient of thermal expansion of Al2O3 (7.1 ppm/K), Si3N4 (2.6 ppm/K), and AlN (4.7 ppm/K) is close to that of silicon (4 ppm/K), Direct Bond Copper (DBC) and AMB are suitable substrates for robust packaging of bare dice since such assemblies. AMB is a promising thick film technology that can be applied to Power Electronics, Automotive Electronics, Home Appliances, Aerospace, and Others. INNOVACERA provides DBC, DPC, and AMB technology for customized ceramic substrates, welcome to consult more.
Active Metal Brazed (AMB) Ceramic Substra Read the full article
Global Active Metal Brazed (AMB) Ceramic Substrate Market
Global Active Metal Brazed (AMB) Ceramic Substrate Market to reach USD 1.52 billion by 2027. The global Active Metal Brazed (AMB) Ceramic Substrate Market is valued at approximately USD 1.07 billion in 2020 and is anticipated to grow with a healthy growth rate of more than 5.45% over the forecast period 2021-2027. AMB Ceramic Substrate is a type of soldering in which metal is brazed to ceramic without metallization. increasing government initiatives in the automotive sector, increasing demand for medium and high voltage systems, and Increasing demand for home and electronic appliances are factors contributing to the market growth.
Global Active Metal Brazed (AMB) Ceramic Substrate Market AMB Advantage: The combination is achieved by a chemical reaction between ceramic and active metal solder paste at high temperatures, so its bonding strength is higher and reliability is better contributing to the market growth. Disadvantage: The reliability of the AMB process depends largely on the composition of active filler metal, the brazing process, the brazing layer structure, and many other key factors Application: Ceramic coppered substrate for packaging IGBT modules for electric vehicles and motor vehicles Read the full article
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Process Comparison of the Ceramic Substrate
The ceramic substrate is a kind of circuit board. It has a thermal expansion coefficient close to that of semiconductors and high heat resistance. It is suitable for products with high heat generation (high-brightness LED, solar energy), and its excellent weather resistance is more suitable for harsh outdoor environments. Because it has the characteristics of lead-free, non-toxic, and good chemical stability, it will not cause harm to environmental protection, so it is more and more widely accepted by the public. Due to different processes, the ceramic substrate is mainly divided into DBC (Direct Bonded Copper), DPC (Direct Plated Copper), AMB (Active Metal Brazing), and Thick film. We will introduce each of the processes and the advantages, disadvantages of each process. DBC (Direct Bonded Copper) It is composed of the ceramic substrate, bonding layer, and conductive layer. It refers to the special process of copper foil directly bonding to alumina or aluminum nitride ceramic substrate surface at high temperature. The advantages are as below: - The copper layer is thick; - The processing is fast; - The price is cheap; - Can make multilayer; - Suitable for large area consumption; - High thermal conductivity; - High adhesion strength; - Excellent soft brazing; - Excellent electrical insulation The disadvantages are as below: - Can not pass through the hole; - Poor accuracy; - Low flatness (surface roughness); - Suitable for the device in the large distance of the product, can not be done in the precise occupation. DPC (Direct Plated Copper) Mainly by evaporation, magnetron sputtering and other surface deposition process to carry on the substrate surface metallization, first under the condition of vacuum sputtering, titanium, and then is copper particles, the plating thickness, then finish making line with ordinary PCB craft, and then to plating/electroless deposition way to increase the thickness of the line, the preparation of DPC way contains vacuum coating, wet deposition, Exposure development, etching, and other processes. The advantages are as below: - In terms of shape processing, DPC ceramic plate needs to be cut by laser, the traditional drilling and milling machine, and punch machine can not be accurately processed, so the combined force and line width are also finer. - The crystal performance of the metal is good; - The flatness is good; - The line is not easy to fall off; - The line position is more accurate, the line distance is smaller, reliable, and stable, can be through the hole and other advantages. The disadvantages are as below: It can only make a thin plate (thickness AMB (Active Metal Brazing) It is a method to realize the bonding of ceramic and metal by reacting a small number of active elements Ti and Zr in filler metal with ceramics to form a reaction layer that can be wetted by liquid filler metal. The advantages are as below: The combination is achieved by the chemical reaction between ceramic and active metal solder paste at high temperatures, so its bonding strength is higher and reliability is better. The disadvantages are as below: The reliability of the AMB process depends largely on the composition of active filler metal, brazing process, brazing layer structure, and many other key factors. Thick film Thick film technology is straight on ceramic substrate printed graphics, then direct sintering process. The advantages are as below: - The bonding force with ceramic is much greater than that of the DPC process; - It is direct printing of graphics, no etching, and copper plating process, so the cost will be lower; - It is a one-time forming, so the flatness is smoother than that of the DPC. The disadvantages are as below: Because the thick film process is printed, it is generally not too thick. Due to different product requirements, different materials have a certain impact on the conductivity of the film. So it is hard to say which process is best, it depends on the customer’s application and usage, customer could choose each of the processes according to their requirements. Should you have more interests, pls feel free to contact us at any time. Read the full article