#alnceramicsubstrate

Ceramic substrate refers to copper foil directly bonded to alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate surface (single or double sided) at high temperature on a special process plate. The ultrathin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent soft brazing and high adhesion strength, and can be etched into a variety of graphics like PCB board, with great current-carrying capacity. Therefore, ceramic substrate has become the basic material of high power electronic circuit structure technology and interconnection technology. Purpose: High-power semiconductor module; Semiconductor cooler, electronic heater; Power control circuit, power mixing circuit. Intelligent power module; High frequency switching power supply, solid state relay. Automotive electronics, aerospace and military electronics components. Solar panel module; Telecommunications private exchange, receiving system; Laser and other industrial electronics. Features: Strong mechanical stress, stable shape; High strength, high thermal conductivity, high insulation; Strong binding force, anti-corrosion. Excellent thermal cycle performance, cycle times up to 50,000, high reliability. And PCB board (or IMS substrate) can be etched out of a variety of graphic structure; No pollution, no pollution. Ceramic Substrate Use temperature range -55℃ ~ 850℃; Thermal expansion coefficient is close to silicon, simplifying the production process of power module.