#siliconphotonics

“We work closely with our foundry partners to design and manufacture innovative PASICs to support the advancement of AI technology,” said Adam Carter, CEO of OpenLight. “We are pleased to collaborate with Advantest as part of this ecosystem. Their leadership in test will allow us to offer sophisticated solutions that deliver customer value and address demands for high-volume manufacturing.”

LightPath Technologies, Inc.

The demand for faster and more efficient data transmission is pushing communication technology beyond traditional electronics. Silicon photonics and optical integrated circuits (ICs) are emerging as key enablers of high-speed communication by transmitting data using light instead of electrical signals, enabling significantly higher bandwidth, lower latency, and improved energy efficiency. As data centers, AI workloads, and next-generation telecom networks continue to scale, photonic technologies are poised to transform how information moves across chips, servers, and global communication infrastructure.

“Following the announcement of its new silicon photonics technology in February 2025, ST is now entering high-volume production for leading hyperscalers. The combination of our technology platform and the superior scale of our 300 mm manufacturing lines gives us a unique competitive advantage to support the AI infrastructure super-cycle,” said fabio gualandris, President, Quality, Manufacturing & Technology, STMicroelectronics.nv “Looking ahead, we are planning and executing on capacity expansions to enable more than quadrupling of production by 2027. This fast expansion is fully underpinned by customers’ long-term capacity reservation commitments.”

OpenLight showcased its latest silicon photonics innovations designed to power next-generation AI, cloud, and hyperscale data center networks. The demonstrations highlighted heterogeneously integrated photonic integrated circuits (PICs) with built-in lasers, modulators, and amplifiers, enabling ultra-high-speed optical connectivity and scalable architectures for 3.2T and beyond data transmission. These advancements aim to deliver higher bandwidth, improved energy efficiency, and production-ready optical interconnect solutions to support the rapidly growing demands of AI infrastructure.

OpenLight showcased its latest silicon photonics innovations designed to power next-generation AI, cloud, and hyperscale data center networks. The demonstrations highlighted heterogeneously integrated photonic integrated circuits (PICs) with built-in lasers, modulators, and amplifiers, enabling ultra-high-speed optical connectivity and scalable architectures for 3.2T and beyond data transmission. These advancements aim to deliver higher bandwidth, improved energy efficiency, and production-ready optical interconnect solutions to support the rapidly growing demands of AI infrastructure.

The partnership underscores the two parties’ shared commitment to enabling scalable photonic infrastructure capable of meeting tomorrow’s computing demands. said, Sébastien Dauvé, CEO of CEA-Leti.

“Following the announcement of its new silicon photonics technology in February 2025, ST is now entering high-volume production for leading hyperscalers. The combination of our technology platform and the superior scale of our 300 mm manufacturing lines gives us a unique competitive advantage to support the AI infrastructure super-cycle,” said fabio gualandris, President, Quality, Manufacturing & Technology, STMicroelectronics. “Looking ahead, we are planning and executing on capacity expansions to enable more than quadrupling of production by 2027. This fast expansion is fully underpinned by customers’ long-term capacity reservation commitments.”