Xiaomi XRING O1 Chip Revealed: 10-Core CPU, 6-Core NPU, and 3nm TSMC Process
Introduction On May 22, Xiaomi unveiled its first in-house smartphone chipset, the XRING O1, alongside the launch of the Xiaomi 15S Pro. Built using TSMC’s advanced 3nm N3E process, this chip puts Xiaomi in the same league as Apple and Qualcomm, who also use this leading-edge node for flagship silicon. Key Specifications of XRING O1 photo by gizguide The XRING O1 is a compact yet powerful…













