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TSMC strengthens foundry dominance with 71% market share in Q2 driven by AI demand
October 15, 2025 /SemiMedia/ — Taiwan Semiconductor Manufacturing Co. (TSMC) expanded its leadership in the global pure-play foundry market, capturing 71% of total market share in the second quarter of 2025, according to Counterpoint Research. The figure marks a three-point rise from the previous quarter and a six-point increase year-on-year. Counterpoint reported that the overall foundry market…
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Xiaomi XRING O1 Chip Revealed: 10-Core CPU, 6-Core NPU, and 3nm TSMC Process
Introduction On May 22, Xiaomi unveiled its first in-house smartphone chipset, the XRING O1, alongside the launch of the Xiaomi 15S Pro. Built using TSMC’s advanced 3nm N3E process, this chip puts Xiaomi in the same league as Apple and Qualcomm, who also use this leading-edge node for flagship silicon. Key Specifications of XRING O1 photo by gizguide The XRING O1 is a compact yet powerful…
Samsung's 3nm process will be coming next year, but not for everyone
Samsung’s 3nm process will be coming next year, but not for everyone
The big picture: Samsung’s upcoming 3nm-class lithography process will be their first to use gate-all-around (GAA) transistor technology. In the face of concerns raised about if the company will have GAA designs out in time to keep pace with competitor TSMC, it insists that its first iteration of the technology will begin mass production in 2022. Samsung’s public roadmap was presented recently…
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