AMD Is Already Looking Past Zen 6
A new report claims AMD’s future Zen 7 architecture could use TSMC’s upcoming A14 manufacturing node along with more advanced chip packaging technology. Even though Zen 7 is still years away, the leak suggests AMD is continuing its push toward smaller process nodes and more complex multi-chip designs to improve performance and efficiency.
The article points to advanced packaging as a major part of AMD’s long-term strategy, not just raw transistor scaling. Technologies involving stacked chips, improved interconnects, and modular layouts are becoming increasingly important as traditional manufacturing gains slow down. AMD has already leaned heavily into chiplet designs with recent Ryzen and EPYC processors, so this direction isn’t surprising.
Nothing is finalized yet, but the report shows how far ahead companies like AMD and TSMC plan their roadmaps. By the time Zen 7 actually arrives, the competition between AMD, Intel, and ARM-based systems will probably look very different from today’s desktop CPU landscape.
Observation: Computer hardware news now regularly sounds like people discussing experimental spacecraft materials from the future. “Advanced packaging on A14 nodes” barely even registers as strange anymore.
