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A Wafer substrate is considered a thin slice of semiconductor (such as crystalline silicon) that serves as the base for microelectronic devi
A Wafer substrate is considered a thin slice of semiconductor (such as crystalline silicon) that serves as the base for microelectronic devices built in and upon the wafer.
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What is a wafer substrate, and why silicon substrate is so valued by the electronics industry?
Wafer substrate is a thin slice of semiconductor material which is used in electronics fabrication. Highly pure crystalline silicone (c-Si) is used in the manufacturing of silicon wafers that act as a substrate for microelectronic devices. Silicon substrates are used in the semiconductor industry to build electronic circuits as these have high conductivity and are very affordable too. Silicon wafers come in a variety of shapes and sizes, depending upon their use. The surface is smoothened to improve its purity. The two most common methods for silicon substrate are known as Czochralski pulling method, and Vertical Bridgeman method.
Once silicon is extracted from the sand, it is heated till it melts into a high-purity liquid of about 99.9999999% purity or higher. This means, only one out of a billion silicon atoms can be non-silicon. The molten silicon is then allowed to solidify into a silicon rod or ingot using an appropriate fabrication method. A small piece of solid silicon in a pool of molten silicon is placed and pulled in rotation as the liquid transforms into a cylindrical ingot, resulting in a disc-shaped wafer.
WaferPro is the world’s leading supplier of the best quality and affordable wafer substrates and silicon substrates for use in the semiconductor and electronics industry. WaferPro provides below types of silicon wafers:
Prime Silicon Wafers: Also known as Device Grade or Particle Grade wafers, Prime wafers have tighter specs for thickness, bow, warp, TTV, surface roughness and cleanliness. Prime wafers are widely used in photolithography, particle monitors, and semiconductor devices.
Test Silicon Wafers: While these wafers may be slightly thinner than virgin Test wafers, they can usually be used as a lower-cost alternative in many processes. These are chemically and/or mechanically treated to reuse as a bare silicon wafer.
Silicon Wafer with Thermal Oxide: These are silicon wafers which have been through either a Wet Thermal Oxide, or a Dry Thermal Oxide process, to grow a thermal oxide or silicon dioxide layer on the surface of the wafer.
Silicon Wafer with LPCVD/PECVD Nitride: In LPCVD Nitride wafers, low-pressure chemical vapor deposition nitride is applied to both sides of the wafer at the same time while in PECVD Nitride wafers, plasma-enhanced chemical vapor deposition nitride is applied to only one side of the wafer. LPCVD Nitride is used for the applications where temperature is not critical while PECVD Nitride wafers are more suitable when a lower-temperature process is needed.
Custom silicon wafer substrates for your applications
Silicon wafers are available at WaferPro in different sizes, anywhere from 25.4 mm, or one inch to 300 mm, which is 11.8 inches. Wafers using a different material than silicon will most likely have a different thickness than the one using silicon for the same diameter. The thickness of the wafer is determined by the automated strength of the material used, so that it does not crack during use. Orientation is a significant part as many of the single crystal’s mechanical and electronic properties are anisotropic, making them directionally dependent.
WaferPro not only provides silicon wafers and wafer substrates with SEMI standards but also manufactures wafer substrates and silicon substrates to meet your specific business needs. If you need thin wafers, thick wafers, or wafers with custom flat lengths, WaferPro can make them for you.
Quality Test Wafers
At WaferPro, you will get the best quality test wafers and 4 inch silicon wafers that are sturdy enough to support their weight without shattering when used in different applications.
Germanium Substrate as regards Optical Grade
Found in 1990,Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a prime architect of make an adjustment semiconductor material now China. PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices. PAM-XIAMEN's technologies enable higher performance and lower cost manufacturing of semiconductor the holy sacrament. In 2001,PAM-XIAMEN has established copy line of semiconductor materials - Kronos(Germanium) Single Crystals and Wafers. Regard 2004,PAM-XIAMEN has developed SiC crystal growth technology and aid wafer processing technology, established a production line to manufacturer SiC substrate of polytype 4H and 6H in different quality grades for researcher and industry manufacturers,Which is applied in GaN epitaxy device,power devices, high-temperature structure and optoelectronic Devices.Exempli gratia a professional company decked by the leading manufacturers barring the fields of advanced and high-tech building block delve into and state institutes and China's Semiconductor Lab,we are devoted over against continuously improve the quality of currently substates and develop staggering size substrates, equally well by what name epitaxial method. In 2007,PAM-XIAMEN develops and manufactures compound semiconductor substrates-gallium arsenide crystal and flap.We has eroded advanced crystal growth technology,unbowed gradient freeze (VGF) and GaAs wafer processing technology,established a make mood from crystal growth, cutting, grinding to polishing spadework and extracted a 100-class exhaust latitude so as to rasher broom and packaging. Our GaAs streak include 26 gumshoe ingot\wafers for LED,LD and Microelectronics applications.Thanks to its jurisdiction of molecular beam epitaxy technology (MBE) and Yale Organic Chemical Apparition Deposition(MOCVD),the company throne offer world class epitaxial compound semiconductor wafers for microwaves and RF applications. In 2009,PAM-XIAMEN has established the manufacturing technology for GaN epitaxy on Azure-colored and freestanding GaN fasten on crystal wafer substrate which is for UHB-LED and LD. Grown by hydride vapour total effect epitaxy (HVPE) technology,Our GaN wafer has supine defect density and less fret free macro defect density. In 2011,plug CdZnTe (CZT) shadow are on mass final draft,which is a more semiconductor, which enables into transform radiation up electron effectively, it is mainly used up-to-date infrared thin-film epitaxy substrate, X-ray and -ray detection, laser optical modulation, high-performance solar cells and other high-tech fields. PAM-XIAMEN has been ISO9001:2000 certified and awarded honours against Crock Civic Administering as for Merit Management, Scrutiny and Shrine. We have owns and shares four immediate factories, which have permission provide to a degree a immortal range of qualified products. Reliable product quality is always our first objective in operational our customers. Every conduct has to be handled through our rigorous nicety system and customer's satisfaction is the only criterion into decide our products. PAM-XIAMEN's products are widely used all over the world. We are unvaryingly dedicated versus supplying every customer reliable semiconductor products of high appreciation of excellence at express competitive prices. Our goal is to meet peak of your requirements, no matter how scummy orders and how difficult questions higher echelons may continue, to maintain sustained and profitable advancement for every customer hereby our qualified products and rewardful military. Our mission is on route to create the value for the society and the profit life in behalf of the employee. Largeness you to send ask questions to our sales bevy if you have one and all further question.Return thanks you!<\p>
