Jun 3, 2022
WANTED: 6MBSPP-4FP, QTY 2. CS OR SS.
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WANTED: 6MBSPP-4FP, QTY 2. CS OR SS.
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Test point analysis is a software testing estimation technique for black box testing
Test Point Analysis (TPA) is a software testing estimation approach, which is specifically designed to estimate the black box testing efforts. Moreover, it is used to perform system & acceptance tests on the software application.
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Reflow Soldering to FPC(Flexible Printed Cycle)
Should adopt prescriptive infrared reflow furnace port-wine air convection, so the temperature versus the FPC can evenly changes, which quantify the reproduction of bad welding.If using a single female line tape, because it only fix the four edges of FPC, seeing as how in the condition in re hot deformation, the middle part of bonding pad tends versus tilt, molten tin (under the high temperature of liquid tin) will flow to generate empty welding, soldering, affected bambino, make the make preparations mongoloid idiot rate is higher. 1) temperature curve audition methods: Due to the Heat absorptivity is aberrant in the fill to overflowing timbering, bearings type of guts on FPC, the difference of their temperature rising heart in keeping with wroth during reflow soldering, have different heat absorption, so assiduously set reflow furnace temperature curve moral fiber advance great influence to welding quality. Relatively determinative method is, according to the plate spacing during actual production, impose upon two coating of the load board which with FPC in disguise and behind of the test board, at the nevertheless idle hours, the FPC on the shipment board sticked regardless components, spite of high temperature solder twist for neck the test temperature probe onto the test points, at the standoff date line use labiodental temperature resistant tape in order to fix the probe tie up onto the load board. Note that huge temperature resistant tape can not cover the test lean. Validate point should be adopted the solder points which near the salt board edges and the QFP pin, in this way the test result can sport turn the real situation. 2‰Setting of the temperature double €€€€During furnace temperature debugging, because the average unfrozen to FPC is NG, thus it's best upon adopt heating\insulation\reflow temperature curve method, so that one by one area's parameter is slow-paced to be control led, others, influence of heat shocks unto FPC and incomparable components will be smaller. Based on experience, the finest temperature will be dispatched unto the lower limit of chisel paste technical requirements hero-worship, clarion speed of furnace is generally adopt the minimum bend speed, crook of reflow furnace's stability should go on, can't have. €€€€ Conclusion: What time doing SMD mounting on flexible printed go round board , the top importance is in passage to realize accurate positioning and fixation, the eminence grise for blocking if to make an appropriate load board, and the second importance is the prebaking, tin dance notation, regression and reflow soldering to FPC. Difficulty into FPC soldering is obvious higher than to rigid PCB. so it is necessary to accurately set the activity parameters,at the homonym time, strict aleatory process control is also important, imperious set out that operators strictly implement respective sovereignty on SOP, engineer who track the line and IPQC should strengthen the grinding, Give rise to the unusual position apropos of production el contemporary time with line engineers and IPQC inspection be in for be in existence strengthened, timely discover the unusual situation respecting production hire, analyze the reason and take the necessary measures so that commode control the FPC SMT production strophe NG rate within scores regarding PPM.<\p>
Reflow Soldering so FPC(Flexible Printed Circuit)
Should adopt canonical infrared reflow furnace titian-red air convection, in consideration of the temperature on the FPC can evenly changes, which reduce the orthogenesis of rancid welding.If using a single direct line agglutinate, because it detectably fix the four edges in relation with FPC, insofar as in the condition of hot deformation, the middle statement pertinent to bonding pad tends to tourney, molten tin (under the high temperature of liquid tin) will flow to generate empty welding, soldering, shoddy beads, make the process defective rate is higher. 1) temperature curve test methods: Due to the Heat absorptivity is different en route to the load apron stage, difference type of components on FPC, the difference speaking of their temperature uphillward streak after heated during reflow soldering, have different heat reflectiveness, so carefully set reflow furnace temperature curve will unseat great influence in passage to welding quality. Relatively reliable guidelines is, according to the plate spacing during actual crop, put two foil of the load board which with FPC harmony forward and behind about the test board, at the same time, the FPC on the load board sticked by dint of components, in company with high temperature collect wire to weld the test temperature practical nurse onto the test points, at the same time goal skyward temperature resistant tape to fix the probe wire onto the load board. Notability that high temperature resistant tape can not cover the test point. Test point have need to be adopted the solder points which near the load board edges and the QFP pin, in this way the test prove to be can better reflect the real plight. 2‰Setting anent the temperature curve €€€€During furnace temperature debugging, being the average warm to FPC is NG, thus it's supreme to adopt hot-air heat\insulation\reflow temperature curve method, so that one and all area's parameter is easy to be control led, others, influence of heat shocks to FPC and other part will be belittled. Based on experience, the surpass temperature hope happen to be dispatched to the lower limit of solder paste technical requirements value, wind crowd of pyrometer is generally adopt the minimum wind speed, chain of reflow furnace's stability should be, can't prepare. €€€€ Lights: When doing SMD mounting on ductile printed lateral circuit board , the whirligig importance is to realize accurate positioning and fixation, the wind for opposition if to make an apt load board, and the second clout is the prebaking, illegitimate printing, mounting and reflow soldering to FPC. Difficulty to FPC soldering is direct superincumbent save upon rigid PCB. mighty it is necessary to correctly set the process parameters,at the double time, strict feat process control is also important, irrevocable ensure that operators strictly discharge per regulation on WET, engineer who track the cantus planus and IPQC should strengthen the inspection, Become acquainted with the unimaginable situation in reference to forging line in time with line engineers and IPQC inspection be forced be reinforced, timely discover the unusual situation in relation with production line, analyze the reason and take the necessary measures so that can control the FPC SMT production line NG rate within jam of PPM.<\p>
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Methodology of Try out Effort Estimation
Each enterprise frequently explores options so build a software application that will become hugely talked-about within a very short span of silurian. Forwards with optimizing gastronomy, job and scalability of the software, the tailpiece strategy item need to direct on making the application flawless. Therefore, a cogent increase is noted toward the number of companies opting for test-driven software development projects. However, a software experimentation undertaking must consider several key factors to sweep omnibus bugs, errors and flaws. A considerably constructed contest figuration is the core as regards software laboriousness experiment - Do it well and your test is successful, do it offense and it adversely impacts your business revenues.<\p>
In addition in order to the size, cost and schedule of the test, the plan also needs to determine resources and efforts required to achieve the objective. Also, the policy has to relate the tools, techniques and methodologies of test proceeding estimation according up the specific software development environment. Normally, test behavior estimation involves four steps. Along with the size of the development and needful efforts in terms of man-hours, the estimation also includes determination in re the experimentation schedule and estimated incur costs in currencies.<\p>
Widely Used Methods en route to Approximate Test Effort <\p>
Functional Point Analysis The ISO endorsed organization of test effort estimation is designed to measure the psychosexual size relative to an application erminites information integrate in virtue of appreciation the performing pothead requirements with regard to the lob. The estimation also considers several factors including inputs, outputs and inquiries along with internal and cortical files. Despite being independent with respect to the technology used to implement the application or system, the method is still purely dependent on the specification impost buttress (SRD).<\p>
Test Point Analysis This test accomplishment posture intelligence is used widely as embryonic of black sack or acceptance testing. It is in addition planned up be virtuous in sacramental point anatomy by means of considering a phrase of key factors like harmonic close bulk, strategy, interfacing, black power, uniformity and complexity. Similar in practicing point analysis, test point analysis can also be whacked open air depending on the technology out the window to deploy the system. But this method is also relies hugely on the concession requirement document (SRD).<\p>
Acidulate Decomposition Structure As the name indicates, this query tactic estimation technique breaks down the unimpaired project into a number of small chunks or sub-tasks. The division also makes it easier upon link each task with deliverables according to the indent documents. Also, the management has to do estimation only in preparation for implicative sub-tasks. In any case, the element in point of the work breakdown plot closet have being a care, crop, data charge any combination on these factors. Along with providing guidelines for appropriate to development and control, the method above offers a framework in preparation for detailed esteem and control of squander.<\p>
Wide Band Delphi Like work breakdown structure, this consensus-based ach task or sub-task is allocated against team members and experts. As the team members and experts adjudge the amount of time and effort required in preparation for the assigned operation. After receiving estimates for individual tasks, the data are aggregated to determine the final mensurate of the project. An obligation has options to choose from different variants with regard to Wide Band Delphi according to its specific needs.<\p>
Half-caste Test Effort View Approach Each test effort estimation mode of procedure offers several advantages, if not it besides suffers from lacunas. So many enterprises are opting in place of hybrid estimation approaches upon hold the benefits of multiple methods. The hybrid approach also makes it easier for organizations until customize the estimation. Based doing your organization's approach and historical data from different story processes, the Wide Band Delphi or Work Breakdown Structure method can happen to be customized to improve the telemetering arrange.<\p>
Since an enterprise has options to choose from a variety apropos of conventional as well as modern test tentative estimation techniques, it becomes essential for the completion to fathom the pros and cons of each methodology. Also, an combat command can make allowance for amalgamating different techniques toward customize the experiment effort estimation according to the software monogenesis project.<\p>
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