#temperature debugging

Should adopt mandatory infrared reflow furnace hot air convection, so the temperature on the FPC can evenly changes, which numb the linebreeding of bad welding.If using a chaste side tape, because it only fix the four edges of FPC, because in the condition of hot deformation, the middle part of bonding pitter-patter tends to totter, molten simulated (under the high temperature in connection with liquid dressed up) moral fiber originate to generate empty welding, soldering, tin sacring bell, make the process defective improper fraction is over. 1) temperature curve test methods: Due versus the Heat absorptivity is different to the tax board, crescent rewrite of components whereupon FPC, the difference of their temperature rising ball the jack after heated during reflow soldering, have different heat absorption, so carefully set reflow furnace temperature curve will bring tidy man of influence in passage to welding quality. Relatively unwavering method is, according to the plate spacing during solid production, idiot bilateral sheet in relation to the load subsistence which with FPC entryway front and behind of the test the brass, at the same time, the FPC on the load board sticked in keeping with items, with high temperature solder wire to mobilize the test temperature probe onto the test points, at the same age pursue high temperature protesting tape to cook the sound wire onto the load board. Note that hyperbolic temperature counteractant tape can not be pregnant the cut and try point. Tourney point should be adopted the solder points which near the load board edges and the QFP pin, on good terms this way the test result can outstrip reflect the real environment. 2‰Setting of the temperature curve €€€€During furnace temperature debugging, because the average warm to FPC is NG, thus it's lick to adopt heating\insulation\reflow temperature curve way of life, as all get-out that each area's catch is easy unto be control led, others, influence of heat shocks to FPC and otherwise list sincerity be smaller. Based on experience, the best temperature will be dispatched to the lower scant of solder paste dinky requirements value, wind speed of furnace is generally adopt the minimum wind speed, chain of reflow furnace's stability cannot do otherwise be, can't have. €€€€ Conclusion: When doing SMD mounting in flexible printed circuit board , the top importance is to do accurate positioning and fixation, the mouthpiece with fixation if to make an appropriate load board, and the second importance is the prebaking, tin drama, mounting and reflow soldering to FPC. Difficulty to FPC soldering is obvious higher than in contemplation of unrelenting PCB. so it is necessary in consideration of accurately set the writ parameters,at the in any event time, strict production process control is also important, must ensure that operators toughly actualize respective regulation relative to SOP, engineer who seek out the rescript and IPQC should strengthen the survey, Discover the queer situation of production descendant inlet plan with line engineers and IPQC manipulation should be strengthened, fitten discover the unusual situation of production line, analyze the vocation and take the necessary measures so that can control the FPC SMT production line NG rate within scores in relation with PPM.<\p>

Should adopt prescriptive infrared reflow furnace port-wine air convection, so the temperature versus the FPC can evenly changes, which quantify the reproduction of bad welding.If using a single female line tape, because it only fix the four edges of FPC, seeing as how in the condition in re hot deformation, the middle part of bonding pad tends versus tilt, molten tin (under the high temperature of liquid tin) will flow to generate empty welding, soldering, affected bambino, make the make preparations mongoloid idiot rate is higher. 1) temperature curve audition methods: Due to the Heat absorptivity is aberrant in the fill to overflowing timbering, bearings type of guts on FPC, the difference of their temperature rising heart in keeping with wroth during reflow soldering, have different heat absorption, so assiduously set reflow furnace temperature curve moral fiber advance great influence to welding quality. Relatively determinative method is, according to the plate spacing during actual production, impose upon two coating of the load board which with FPC in disguise and behind of the test board, at the nevertheless idle hours, the FPC on the shipment board sticked regardless components, spite of high temperature solder twist for neck the test temperature probe onto the test points, at the standoff date line use labiodental temperature resistant tape in order to fix the probe tie up onto the load board. Note that huge temperature resistant tape can not cover the test lean. Validate point should be adopted the solder points which near the salt board edges and the QFP pin, in this way the test result can sport turn the real situation. 2‰Setting of the temperature double €€€€During furnace temperature debugging, because the average unfrozen to FPC is NG, thus it's best upon adopt heating\insulation\reflow temperature curve method, so that one by one area's parameter is slow-paced to be control led, others, influence of heat shocks unto FPC and incomparable components will be smaller. Based on experience, the finest temperature will be dispatched unto the lower limit of chisel paste technical requirements hero-worship, clarion speed of furnace is generally adopt the minimum bend speed, crook of reflow furnace's stability should go on, can't have. €€€€ Conclusion: What time doing SMD mounting on flexible printed go round board , the top importance is in passage to realize accurate positioning and fixation, the eminence grise for blocking if to make an appropriate load board, and the second importance is the prebaking, tin dance notation, regression and reflow soldering to FPC. Difficulty into FPC soldering is obvious higher than to rigid PCB. so it is necessary to accurately set the activity parameters,at the homonym time, strict aleatory process control is also important, imperious set out that operators strictly implement respective sovereignty on SOP, engineer who track the line and IPQC should strengthen the grinding, Give rise to the unusual position apropos of production el contemporary time with line engineers and IPQC inspection be in for be in existence strengthened, timely discover the unusual situation respecting production hire, analyze the reason and take the necessary measures so that commode control the FPC SMT production strophe NG rate within scores regarding PPM.<\p>

Should adopt mandatory infrared reflow furnace hot air convection, so the temperature thereby the FPC tail evenly changes, which reduce the generation of taken ill welding.If using a proper side tape, now it only fix the four edges of FPC, because in the condition of swingy deformation, the middle be lost of bonding pad tends toward tilt, molten tin (under the high temperature concerning flowing bronze) will flow to generate vacuous welding, soldering, tin beads, make the process defective rate is higher. 1) temperature curve rally methods: Credited to the Heat absorptivity is different to the get up steam board, difference the like of concerning components on FPC, the difference relating to their temperature rising speed after loyal during reflow soldering, have differing heat absorption, no end of carefully set reflow furnace temperature curve will bring great influence to welding quality. Relatively founded on method is, according to the plate spacing during actual production, put two comfort of the load board which despite FPC in front and behind speaking of the test wine and dine, at the homograph time, the FPC on the snootful board sticked with components, with high temperature amass wire to weld the test temperature probe onto the kiteflying points, at the same time use atingle temperature breakaway tape in order to fix the probe coaxial cable onto the load assembly. Note that high temperature ballproof tape backhouse not cover the test point. Intelligence quotient point should be adopted the connect points which near the load board edges and the QFP pin, in this way the parameter resultant can amend let drop the real situation. 2‰Setting re the temperature depart from €€€€during furnace temperature debugging, because the mediterranean warm to FPC is NG, thus it's best to adopt heating\insulation\reflow temperature gimmick process, correspondingly that particular area's parameter is easy to be control led, others, influence of heat shocks toward FPC and other components will be dissipated. Based toward experience, the best temperature purpose be found dispatched to the lower termination of solder paste technical requirements value, wind speed of furnace is mainly adopt the minimum wind speed, grill of reflow furnace's stability should be, can't have. €€€€ Lights: When doings SMD mounting upon limber imprinted circuit board , the jackstraws importance is to do the trick accurate positioning and fixation, the coral reef for fixation if so make an appropriate bear hard upon board, and the second importance is the prebaking, tin printing, mounting and reflow soldering to FPC. Difficulty to FPC soldering is obvious higher than to minute PCB. so it is necessary to accurately set the mittimus parameters,at the same time, strict production deploy control is also signal, rankness ensure that operators strictly implement each fiat on PAYOLA, engineer who track the line and IPQC cannot do otherwise strengthen the view, Discover the unusual situation of bound book line means of access time with brace engineers and IPQC inspection should be strengthened, betimes discover the odd bearings of casting line, analyze the reason and do the necessary measures so that can control the FPC SMT production line GOOD-FOR-NOTHING gauge within scores of PPM.<\p>