#surface-mount

Selective soldering involves attaching specific components to printed circuit boards (PCBs) and molded modules, a method particularly useful for items susceptible to heat damage from standard reflow ovens or wave soldering found in conventional surface-mount technology (SMT) or through-hole assembly techniques. Typically, this method is applied after an initial SMT oven reflow phase. The components targeted for selective soldering are often nestled among others already soldered via a surface-mount reflow method. This demands high precision in the selective soldering process to prevent damage to the surrounding elements.