Why SIP packaging technology market prospects are so high ?
Compared to system integration on printed circuit boards, SIP maximizes system performance, eliminates re-packaging, shortens development cycles, reduces costs, and increases integration. Compared with SoC, SIP also has the characteristics of high flexibility, high integration, short design cycle, low development cost, and easy access.
The SIP package integrates other components such as passive components and antennas into a single package for a more complete system function. From the point of view of application products, SiP technologies are more suitable for low-cost, small-area, high-frequency and high-speed, and short-lived electronic products, especially power amplifiers (PA), global positioning systems, Bluetooth, portable product markets such as image sensing module and memory cards. These characteristics also make these products highly applicable to industrial applications, Internet of Things, mobile phones and smartwatches. There are also very broad markets in the fields of smart bracelets and smart glasses.
At present, when intelligent hardware manufacturers design smart wearable devices, the main challenge is how to put all the required functions into a very small space. Taking smart glasses as an example, in the hardware design phase, it is necessary to consider the characteristics and integration methods of main components such as wireless communication, an application processor, storage memory, photographic lens, micro-projection display, sensor, microphone, etc., while also evaluating component integration. The use of the SIP system miniaturization design can simplify system design is key for meeting their design criteria. It can increase the portability of the product while adding a lot more functions without changing the appearance.
At present, the global output of packaging capacity alocated to these types of packaging accounts for only 10% of the total value of integrated circuits, but the emergence of SIP technologies are likely to break the current industrial structure of integrated circuits since changing the package is only an issue at the subsequent processing plant. In the future integrated circuit industry, there may be a group of entities that combine design capabilities and packaging processes that maximize value of their products and profits of their own brands. When the SIP technology is mastered by a packaging company, the output value of the packaging industry has significant potential moving forward
