#sicmosfet

ROHM Co., Ltd. has introduced a new top-side cooling package for SiC MOSFETs, designed to improve thermal management, increase power density, and support the growing demands of next-generation power electronics applications.

“High-power system design is fundamentally challenged by the need to balance efficient thermal management with robust high-voltage isolation,” said Paul Wheeler, VP & GM of the SiC Business Unit at Navitas Semiconductor. “The UHV-TO-247-4-ISO package overcomes critical thermal and isolation challenges, delivering power module–class performance in a compact discrete form factor. As a highly efficient building block, it empowers system designers to unlock the full potential of GeneSiC TAP SiC MOSFET technology in next-generation applications such as immersion-cooled and liquid-cooled power electronics.”

ROHM Co., Ltd. is driving the next generation of AI data center power infrastructure with its SiC MOSFET technology, now adopted in Battery Backup Units (BBUs) for AI servers as the industry transitions toward advanced HVDC architectures. As AI workloads continue to surge, efficient power conversion and energy management have become critical to supporting high-density computing environments.

ROHM Co., Ltd. is driving the next generation of AI data center power infrastructure with its SiC MOSFET technology, now adopted in Battery Backup Units (BBUs) for AI servers as the industry transitions toward advanced HVDC architectures. As AI workloads continue to surge, efficient power conversion and energy management have become critical to supporting high-density computing environments.

Vishay Intertechnology, Inc. introduces 1200 V SiC MOSFET SOT-227 modules that boost power efficiency and thermal performance for high-voltage applications. These next-gen power modules enable more efficient energy conversion in EVs, industrial drives, and renewable systems—helping designers achieve higher performance with reduced losses.

#NoMIS_Power is set to launch rugged 3.3 kV SiC MOSFETs via its DOE-backed chip-scale packaging initiative—delivering scalable, high-voltage solutions for AI data centers, energy storage, solar/wind farms, and high-power conversion systems.