#module market

System on Module Market

The global system on module (SoM) market is expected to grow from USD 1.40 billion in 2018 to USD ~3.60 billion by 2025, at a CAGR of ~15% during the forecast period. System on module, also known as computer on module, is a chip consisting of clock, microprocessor, RAM, flash memory, Ethernet and I/O controllers on a single printed circuit board. It is ready-to-use, processor module which is used for developing any embedded product. Advantages of SoMs include rapid, lower risk hardware development, lower system cost, and the potential for processor upgrade.

Segmentation

According to Market Research Future, the global system on module (SoM) market has been segmented on the basis of type, application, and region.

The recent advancement in embedded applications including home appliances, office automation, security, telecommunication has pushed manufacturers to build devices that are smaller, multi-functional with high-end video and have multiple connectivity options. System on module is considered as an ideal solution for many applications such as intelligent video analytics (IVA), robotics, gaming devices, drones, augmented reality (AR), virtual reality (VR), and portable medical devices. Moreover, it is ideal for factory automation, industrial communication systems, grid infrastructure, edge computing, and applications where high reliability is needed.

The global system on module (SoM) market has been segmented on the basis of type, application, and region.

On the basis of type, the market has been segmented into arm architecture, x86 architecture, and power architecture. Among these, the arm architecture accounts for the largest market share owing to its popularity and rapid adoption in embedded systems. The inherent design of arm architecture and its advanced power-saving modes helps in minimizing and tuning power consumption for various applications. For instance, it is possible to build compact single-board computer with the help of arm based SoM solution integrated with pre-certified 802.11a/b/g/n and Bluetooth 4.0 connectivity in a footprint of just 29x29 mm, and 3.5 mm high.

Based on application, the market has been segmented into industrial automation, medical, entertainment, transportation, test & measurement, and others. The medical segment holds the largest market share owing to the growing demand for connected devices to create efficiencies in various key aspects including patient safety and asset management/tracking. Furthermore, transportation is expected to be the fastest-growing segment in the coming future owing to the growing need for connected and intelligent devices, requiring rugged reliability that eliminate vibration concerns. Also, the embedded SoM solutions have valuable applications in devices that are used in marine, vehicle, railways or aerospace. In buses, it is used to monitor the emissions and operate fare-collection systems. In taxis, the SoM based embedded solutions help in optimizing electric vehicles by controlling engine components while providing a fully integrated, modern in-vehicle operator interface.

On the basis of region, the market has been classified into North America, Europe, Asia-Pacific, the Middle East & Africa, and Central and South America. Among these, the Asia-Pacific is dominating the market due to the presence of a greater number of semiconductor industries in this region.

Key players

The key players in the system on module (SoM) market are AAEON Technology, Inc.(Taiwan), Advantech Co., Ltd (Taiwan), Avnet, Inc. (US), Avalue Technology (Taiwan), Axiomtek Co., Ltd (Taiwan), Connect Tech, Inc. (Canada), Congatec AG (Germany), EMAC, Inc. (US), Eurotech, Inc. (US), Kontron S&T AG (Germany), Microchip Technology, Inc. (US), National Instruments Corporation (US), Phytec (Germany), SECO S.p.A (Italy), TechNexion Ltd (Taiwan), Toradex (Switzerland), and VIA Technologies, Inc. (Taiwan).

More Information@

System on Module Market Size, Share, Industry Demand, Global Analysis, 2025 | MRFR

System on Module (SoM) Market Demand, Research Report by Type, End-user, Distribution Channel and…

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Multichip Module Market

Major drivers for the global multi-chip modules market include the rising demand for advanced computing capabilities in consumer electronics, automotive electronics, and aerospace and defense applications. The rise of high-power phones capable of performing processing-intensive tasks has been a key feature of the smartphones industry in the recent past, with companies such as OnePlus, Samsung, and Google taking the smartphones sector on a new level entirely in terms of computing capability and processing power. These operations are backed by the constant innovation taking place in the global IC industry, where innovations such as multi-chip modules are taking shape.

The global multi-chip module market is expected to exhibit a strong 6.1% CAGR over the forecast period from 2018 to 2023, according to a new report published by Market Research Future (MRFR).

Multi-chip modules are an IC technology that allows for a single IC module to hold multiple processing units, increasing the overall output of the unit. The presence of multiple units on multi-chip modules makes the modules smaller and lighter than conventional modules, as well as reducing the costs compared to the number of separate modules that would have had to be produced by the conventional method to match the processing power of the multi-chip module. These features are highly suitable for the semiconductors industry, which is presently focused on miniaturization of electronic components as a key trend of the future. The growing demand for miniaturized electronic components is likely to be a major driver for the global multi-chip module market over the forecast period from 2018 to 2023.

Competitive Analysis:

Leading players in the global multi-chip modules market include Texas Instruments Inc., Tektronix Inc., Macronix International Co. Ltd., Cypress Semiconductor, Micross, STMicroelectronics, Samsung Electronics, Infineon Technologies, Palomar Technologies, and SK Hynix Inc.

Product development is likely to be the key strategy of leading players in the global multi-chip module market over the forecast period, as the demand for multi-chip modules is growing in various sectors, presenting opportunities for a wide range of products. Major players in the global multi-chip module market are also likely to focus on acquisitions and collaborations as a way of acquiring emerging technologies.

However, the market is also plagued by concerns of plagiarism. In May 2019, Xperi Corporation launched patent infringement lawsuits against Nvidia through two of its subsidiaries, Tessera Advanced Technologies and Invensas Corporation. The patents in question include one for a semiconductor apparatus that easily enables miniaturization of multi-chip modules and another for the manufacturing process of the same.

Segmentation:

The global multi-chip module market is segmented by type, end-use industry vertical, and region.

By type, the global multi-chip module market is segmented into NAND-based MCP, NOR-based MCP, eMCP, and uMCP.

By industry vertical, the market is segmented into consumer electronics, automotive, medical devices, aerospace and defense, and others. Consumer electronics and automotive are likely to be the major contributors to the global multi-chip module market over the forecast period due to the growing demand for higher processing power and miniaturized electronic components in these industries.

Regional Analysis:

Asia Pacific is likely to dominate the global multi-chip modules market over the forecast period due to the growing semiconductors and consumer electronics industries in the region. China has been a leading producer of semiconductor and consumer electronics products over the last few years and is likely to remain a leading player in the global multi-chip module market over the forecast period. Leading Chinese companies are also emerging as major technology innovators in the semiconductors industry, making this region highly viable for the global multi-chip module market over the forecast period.

More Information@

Multi-chip Module Market Research Report - Forecast to 2023 | MRFR

Multi-chip Module Market is expected to grow from USD XX.XX billion in 2018 to USD XX.XX billion by …

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Fact.MR has been actively involved in offering comprehensive research data concerning various topics which are associated to industrial reference and investor utility. This particular research report titled “Automotive Front End Module Market Forecast, Trend Analysis & Competition Tracking: Global Review 2017 to 2022” has been added to the wide online database of Fact.MR which discusses the present as well as future market scenario. Readers can access knowledge related to market volume, regional expanse as well as competitive landscape prevailing in the global automotive front end module market. In order to study development patterns, this smart assessment also focuses on market dynamics, which talks about drivers, restraints and opportunities estimated to influence the concerned market during the period until 2017 to 2022.

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These seven insights on the global automotive front end module market elucidates future prospects lucrative for automobile manufacturers.

1- The report observes Asia-Pacific excluding Japan (APEJ) region most lucrative for expansion of the global automotive front end module market. Over the assessment period, it is anticipated that APEJ automotive front end module market will soar robustly at steady CAGR.

2- Europe is also predicted at the front end of the automotive front end module market. By 2022, Europe’s automotive front end module sales will have accounted for a gross value of US$ 24.5 Bn.

3- In 2017, North America’s automotive front end module market is anticipated to reach US$ 16.2 Bn in value, owing to rising adoption of new composites in production of car modules.

4- Passenger cars are anticipated to dominate the global automotive front end module revenues, accounting for largest share through 2022. Revenues netted from adoption of automotive front end module in production of passenger cars are expected to surge steadily at steady CAGR over the forecast period.

5- Demand for composite front-end modules is likely to remain higher than modules made from plastic or metals. In 2017, over US$ 50 Bn worth of automotive front end modules sold across the globe will be made out of composite materials.

6- Lower replacement rate of automotive front end modules, coupled with less demand for modified front end modules in automotive aftermarkets, are indicating that OEMs will remain the largest sales channels in the global market. By 2022, more than US$ 80 Bn worth of automotive front end modules will be sold through OEMs.

7- Hyundai Mobis Co. Ltd., MAHLE GmbH, Denso Corporation, Faurecia SA, HBPO GmbH, Magna International Inc., Valeo SA, Montaplast GmbH, Compagnie Plastic Omnium SA, Murata Manufacturing Co. Ltd., and Samvardhana Motherson Automotive Systems Group B.V. are profiled in the report as key companies partaking in the growth of global automotive front end module market. 

Browse Full Report With TOC- https://www.factmr.com/report/29/automotive-front-end-module-market

Table of Content

Chapter 1. Global Front End Module Market - Executive Summary. 11

Chapter 2. Global Front End Module Market Overview. 13 2.1. Introduction. 13        2.1.1. Global Front End Module Market Taxonomy. 13        2.1.2. Global Front End Module Market Definition. 13 2.2. Global Front End Module Market Size (US$ Mn) and Forecast, 2012-2022. 13        2.2.1. Global Front End Module Market Y-o-Y Growth. 13 2.3. Global Automotive Front End Module Market: Macroeconomic Factors. 14        2.3.1. Economic Outlook. 14        2.3.2. International Policy. 14        2.3.3. Profitability of Enterprises. 15        2.3.4. Increasing Purchasing Power of Middle Class. 15        2.3.5. Complex Eco System. 15        2.3.6. Supply chain Issues. 15        2.3.7. End-user Sentiment. 16 2.4. Global Automotive Front end Module Market impact factors. 16        2.4.1. Autonomous Vehicles. 16        2.4.2. The Influence of China. 16        2.4.3. Dilemma on Shift to New Technologies. 17        2.4.4. Disruption in Traditional Business Models. 17        2.4.5. Rising Component Costs in Developing Countries. 17        2.4.6. Fluctuating Input costs. 17        2.4.7. Shrinking Product Development Time. 18        2.4.8. Adoption of New Mobility Solutions. 18        2.4.9. Focus on Granular Insights – City-wise Analysis will Replace Region-wise Analysis. 18        2.4.10. Rising Complexity Influencing Greater Emphasis on Platformimg. 18        2.4.11. Innovations in Technology. 19 2.5. Supply Chain. 19 2.6. Cost Structure. 20 2.7. Pricing Analysis. 20 2.8. Raw Material Sourcing Strategy and Analysis. 20 2.9. List of Distributors. 20 2.10. Key Participants Market Presence (Intensity Map) By Region. 21 2.11. Competitive Assessment and Technology Trends in Future. 21

Chapter 3. Global Front End Module Market Analysis and Forecast By Vehicle Type. 22 3.1. Global Front End Module Market Size and Forecast By Vehicle Type, 2012-2022. 22        3.1.1. PC Front End Module Market Size and Forecast, 2012-2022. 22                  3.1.1.1. Revenue (US$ Mn) Comparison, By Region. 22        3.1.2. Global PC Segment Market Value (US$ Mn) By Region, 2017-2022. 23                  3.1.2.1. Market Share Comparison, By Region. 23                  3.1.2.2. Y-o-Y growth Comparison, By Region. 24        3.1.3. LCV Front End Module Market Size and Forecast, 2012-2022. 25                  3.1.3.1. Revenue (US$ Mn) Comparison, By Region. 25                  3.1.3.2. Market Share Comparison, By Region. 26                  3.1.3.3. Y-o-Y growth Comparison, By Region. 27        3.1.4. HCV Front End Module Market Size and Forecast, 2012-2022. 28                  3.1.4.1. Revenue (US$ Mn) Comparison, By Region. 28                  3.1.4.2. Market Share Comparison, By Region. 29                  3.1.4.3. Y-o-Y growth Comparison, By Region. 30

 Continued@@@...

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