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As the demand for global wireless connectivity accelerates, Wi-Fi continues to dominate as the backbone of IoT, smart home, industrial automation, and consumer electronics ecosystems. Recognising this need, T2M IP, a global leader in Wireless RF IP cores, offers a comprehensive and silicon-proven Wi-Fi RF IP in 22nm, designed to deliver high-performance wireless connectivity while reducing integration complexity and time-to-market.

Wi-Fi RF IP in 22nm for modern SoCs T2M IP’s Wi-Fi offering spans across IEEE 802.11 standards, including Wi-Fi 4 (802.11n), Wi-Fi 6/6E RF in 22nm (802.11ax), and Wi-Fi 7 RF in 22nm (802.11be), enabling support for a wide spectrum of applications—from ultra-low-power IoT sensors to high-throughput multimedia devices.

Built for Performance, Power, and Portability Whether it’s enabling smart security cameras to stream 4K video or optimising battery life in wearable fitness trackers, T2M’s Wi-Fi RF IP is optimised for: - Low power consumption with advanced power gating and sleep modes - High throughput with support for multi-user MIMO (MU-MIMO), OFDMA, and 1024-QAM - Interference robustness for operation in crowded environments - Configurable bandwidth (20/40/80/160 MHz) and multi-band operation (2.4 GHz, 5 GHz, and 6 GHz) The architecture of the 22nm RF IP is scalable and adaptable to a range of process nodes, ensuring compatibility with modern SoC design needs. Silicon-Proven and Market-Deployed T2M’s Wi-Fi RF IP cores are not just theoretically robust—they’re proven in silicon and successfully deployed in mass-market devices.

Wi-Fi + Bluetooth + Coexistence Support Recognising the importance of wireless coexistence in multi-protocol environments, T2M also offers Wi-Fi + BLE combo RF IP in 22nm with advanced coexistence algorithms and shared antenna support, ideal for devices with size and power constraints.

Key features include:

- Concurrent WiFi 2G/5G (5G band only) and BLE or

- Concurrent WiFi 2G/5G/6G and BLE or

- Non-concurrent WiFi 2G/5G (5G band only) and BLE (small area)

- Ultra low power IoT with high performance

- Cost effective client device with high integration

- Shared RF front-end for cost optimization

- Integrate high-efficiency PA to perform high output power with low power consumption

This makes the solution ideal for compact IoT modules, smartphones, and wearables that require seamless coexistence between Bluetooth LE and Wi-Fi.

Turnkey Wireless IP + Expert Support T2M IP not only delivers a robust wireless IP portfolio but also provides turnkey integration support through its expert engineering team. Services include: - Architecture and implementation guidance - RF design collaboration - Post-silicon validation and certification support With decades of wireless and semiconductor expertise, T2M IP positions itself not just as an IP vendor but as a strategic technology partner.

Conclusion: Future-Ready Wireless IP for a Hyperconnected World As device makers and SoC developers face increasing complexity in delivering fast, secure, and reliable wireless connectivity, T2M IP’s Wi-Fi IP solutions stand out as comprehensive, customizable, and production-ready.

By delivering silicon-proven IP cores backed by deep integration support, T2M empowers semiconductor companies to innovate faster and deliver differentiated connected products—whether for consumer, industrial, or automotive markets. For more information on T2M IP’s wireless solutions or to request a datasheet/demo, contact us at [email protected]

T2M IP, a global leader in semiconductor IP cores and advanced connectivity solutions, has announced the availability of its partner’s cutting-edge Dual-Band Wi-Fi 7 RF Transceiver IP Core. Featuring an integrated Front-End Module (FEM), this next-generation IP solution is optimized for both consumer and industrial applications and is now available for licensing in TSMC’s 22nm ULL process.

Designed to meet the growing demands of bandwidth-hungry and latency-sensitive applications, the new Wi-Fi 7 RF Transceiver IP core supports a broad range of high-performance use cases—from set-top boxes and smart TVs to AR/VR headsets, streaming devices, automotive infotainment systems, and industrial IoT applications. The integration of the FEM simplifies system design, reduces bill of materials (BoM), and enhances RF performance, making it a highly attractive solution for chipmakers developing the next wave of wireless SoCs.

Wi-Fi 7: The Future of Wireless Connectivity

As wireless data consumption continues to surge, Wi-Fi 7 (IEEE 802.11be) is set to become a game-changer in the world of connectivity. Offering data rates well into the multi-gigabit range, ultra-low latency, and significantly improved spectral efficiency, Wi-Fi 7 enables truly seamless connectivity across an array of smart devices.

The T2M IP partner’s transceiver IP fully complies with the Wi-Fi 7 standard and includes backward compatibility with Wi-Fi 6/6E. Supporting both 1024-QAM and 4096-QAM modulation schemes, this IP core delivers highly efficient and high-throughput wireless communications. The advanced modulation enables higher data rates within the same spectrum, resulting in better performance in environments crowded with competing wireless signals—such as smart homes, public venues, and industrial facilities.

Optimized for Performance and Efficiency

One of the core highlights of this IP solution is its compact design and power efficiency. Engineered for minimal die area, the transceiver operates with ultra-low power consumption, making it especially suitable for battery-powered and thermally constrained devices like wearables and AR/VR headsets.

In addition to superior RF performance, the IP core includes built-in features for robust interference mitigation, seamless roaming, and reliable data transmission in dynamic environments. These capabilities ensure high-quality connectivity for mobile and embedded systems that must operate in varying and often challenging RF conditions.

Tri-Band Support and Scalability

The transceiver IP supports operation across the 2.4GHz, 5GHz, and 6GHz bands, providing full tri-band coverage for maximum flexibility and network performance. This tri-band support enables a broader range of applications and ensures compatibility with existing Wi-Fi infrastructure, while also future-proofing devices for emerging Wi-Fi 7 deployments.

Currently, the IP supports bandwidths of up to 80MHz, which is suitable for a wide range of high-speed applications. Looking ahead, the roadmap includes support for 160MHz bandwidth by Q2 2025, which will further elevate the performance of multi-user MIMO and OFDMA (Orthogonal Frequency-Division Multiple Access) technologies. This scalability makes the IP ideal for building flexible, future-ready wireless SoCs that can evolve alongside the Wi-Fi standard.

Accelerating Next-Gen SoC Development

With the introduction of this highly integrated Wi-Fi 7 RF Transceiver IP core, T2M IP and its partner aim to accelerate innovation in the semiconductor industry. By providing a complete, production-ready IP solution that balances high performance, power efficiency, and small footprint, T2M IP enables SoC developers to meet tight design schedules and get their products to market faster.

This IP is particularly beneficial for Access Point applications, including home and enterprise routers, where enhanced range, bandwidth, and throughput are critical. Integrating this solution into next-generation SoCs will empower OEMs to deliver faster, smarter, and more reliable wireless experiences to users worldwide.

Availability and Licensing

The Dual-Band Wi-Fi 7 RF Transceiver IP Core is now available for immediate licensing. Interested parties can reach out to T2M IP for more information on licensing models, deliverables, and pricing details.

About T2M IP

T2MIP is the global independent semiconductor technology experts. Semiconductor Interface IP Cores are available for immediate licensing.