The new Portfolio of plastic-packaged radiation-hardened devices brings space-grade solutions to missions in medium/geosynchronous Earth orbit (MEO/GEO) with longer lifetime requirements, and small satellites (smallsats) and higher density electronics, while reducing size, weight, and power (SWaP) costs. These ICs will help customers to reduce their electronics footprint and cost without compromising performance.
For more information, visit: https://components101.com/news/new-radiation-hardened-plastic-portfolio-for-meo-and-geo-applications












