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The 76th annual IEEE (ECTC) will be held from May 26-29, 2026 at the JW Marriott & The Ritz-Carlton Grande Lakes Electronic Packaging.
IEEE ECTC 2026 will spotlight the latest breakthroughs in electronic packaging, advanced semiconductors, chiplets, and AI-driven integration technologies shaping the future of electronics.
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The IEEE Electronic Components and Technology Conference (ECTC), has extended the deadline for the Student Innovation Challenge for ECTC.
2026 IEEE Electronic Components and Technology Conference (ECTC) is set to bring together industry experts, researchers, and innovators to explore the latest advancements in electronic components, packaging, and technology.
The premier technical conference and product exhibition for the world’s semiconductor packaging industry ECTC 2026.
Student Innovation Challenges have been announced for the 76th ECTC 2026, offering emerging engineers and researchers a platform to showcase creative solutions, cutting-edge ideas and breakthrough technologies in electronics and materials.
The 2026 IEEE Electronic Components and Technology Conference the premier technical conference and product ECTC 2026 Call for Papers.
