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Global 300mm fab equipment spending set to rise, AI drives semiconductor investment
April 6, 2026 /SemiMedia/ — According to SEMI, global 300mm wafer fab equipment spending is expected to grow strongly over the next several years, reaching $133 billion in 2026, up 18%, and $151 billion in 2027, up 14%. The increase is driven by strong demand for AI chips in data centers and edge devices, alongside regional efforts to localize supply chains and strengthen semiconductor…
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China’s Nvidia Surge Meets a Hard Reality
TSMC, Bottlenecks, and the Limits of AI Scale When demand is no longer the constraint Over the past weeks, reports have emerged that Chinese technology firms have placed extraordinarily large orders for Nvidia’s H200 AI accelerators. The scale is striking: estimates suggest demand running into the low millions of units for 2026 delivery, far exceeding Nvidia’s current inventory and near-term…
Asia controls 75% of global chip capacity, set to keep lead in next five years
September 26, 2025 /SemiMedia/ — Asia holds more than 75% of the world’s semiconductor manufacturing capacity and is expected to maintain its dominance in the next five years, Moody’s Corporation said on Thursday. The region’s leadership spans logic, memory and discrete/analog/other chips, driven by cost efficiency, a strong ecosystem and advanced expertise. According to Moody’s, Taiwan and…
Global 300mm fab capacity to hit record by 2028 as chipmakers accelerate advanced node expansion
June 26, 2025 /SemiMedia/ — Global semiconductor manufacturing is set to maintain strong growth momentum, with 300mm fab capacity projected to grow at a 7% CAGR from late 2024 through 2028, reaching a record 11.1 million wafers per month, according to SEMI’s latest report. A key driver of this expansion is the rapid build-up of advanced node capacity (7nm and below), which is expected to surge…
