Top Posts Tagged with #2.5d packaging

ASE raises 2026 capex to $10.5 billion as advanced packaging demand accelerates

July 31, 2026 / SemiMedia / — ASE Technology Holding has raised its 2026 capital expenditure budget from $8.5 billion to approximately $10.5 billion as demand for advanced packaging and semiconductor testing continues to exceed expectations. Of the additional $2 billion, around $1 billion will be allocated to manufacturing facilities and another $1 billion to production equipment. Most of the…

#2.5D packaging #3D packaging #Advanced packaging #AI chips #artificial intelligence #ASE Technology #Electronic components #LEAP #Semiconductor CapEx #Semiconductor testing

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