Ceramic PCB
We are a professional ceramic pcb manufacturer, supplier from China, we mainly supply high quality Alumina (Al2O3) Ceramic PCB, Aluminum Nitride (AIN) Ceramic PCB board and IGBT Ceramic PCB. Our ceramic printed circuit boards features of high pressure, high insulation, high temperature, and high reliable and minor volume electronic products, Hitech is your best choice for ceramic PCB boards and needs.
What is ceramic pcb board Ceramic PCB boards are actually made of electronic ceramics as the basic material and can be made into various shapes. Among them, ceramic circuit boards have the most outstanding high temperature resistance and high electrical insulation characteristics. The advantages of low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability, and similar thermal expansion coefficient to components are also very significant.
Different types of ceramic pcb Ceramic PCBs are widely used in power electronics, electronic packaging, hybrid microelectronics, and multi chip modules due to their excellent thermal conductivity and airtightness. But not everyone is clear about the classification. Many manufacturers believe that ceramic PCBs are both expensive and fragile when they hear about them. Yes, this is indeed a drawback of ceramic PCBs, but not all ceramic PCBs are like this. Today, we will introduce different types of ceramic PCBs to you.
Al2O3 ceramic PCB Al2O3 ceramic PCB ( alumina ceramic PCB) refers to various ceramic PCBs with Al2O3 as the main raw material and an Al2O3 content of more than 75%. It has a rich source of raw materials, with advantages of low price, high mechanical strength and hardness, good insulation performance, good heat shock resistance, good chemical resistance, high dimensional accuracy, and good adhesion to metals. It is a ceramic substrate material with good comprehensive performance. Currently used Al2O3 ceramic substrates, the content of Al2O3 accounts for 85% to 99.5%. Among them, 96% Al2O3 ceramic PCB is widely used in the production of thick film circuit substrates and chip devices. The thermal conductivity of Al2O3 at room temperature is 29W/(mĀ·K), which is close to the thermal conductivity of steel; with the increase of Al2O3 content, the electrical insulation performance and thermal conductivity of Al2O3 ceramic PCB will increase, but At the same time, it will also lead to an increase in the firing temperature, an increase in energy consumption, a large loss of kiln furniture, and an increase in manufacturing costs.
SiC ceramic PCB The thermal conductivity of SiC ceramic PCB is very high, ranging from 100 to 490 W/(m Ā· K) at room temperature, which is related to the purity of SiC crystals. The higher the purity, the greater the thermal conductivity; Good antioxidant properties, decomposition temperature above 2500 ā, can still be used in an oxidizing atmosphere at 1600 ā; The coefficient of thermal expansion is also low, close to silicon, and has good electrical insulation performance; The Mohs hardness of SiC is 9.75, second only to diamond and cubic boron nitride, and it has high mechanical strength. SiC ceramics have strong covalent bonding properties and are difficult to sinter. Usually, a small amount of boron or alumina is added as a sintering aid to increase density. Experiments have shown that beryllium, boron, aluminum, and their compounds are the most effective additives that can increase the density of SiC ceramics to over 98%.
BeO ceramic PCB BeO has a brazed structure, in which oxygen ions are arranged in a hexagonal close packed manner to form a hexagonal lattice. Typical oxides are usually ionic compounds, but BeO has strong covalent bonds with an average molecular weight of only 12. Due to its excellent electrical performance, luminescence and photochemical properties, high mechanical strength, low dielectric loss, etc., it has become one of the materials of concern to people.
AlN ceramic PCB AlN ceramic PCB (aluminum nitride ceramic) is a new type of high thermal conductivity ceramic packaging material. It has been extensively studied in the 1990s and gradually developed. It is currently generally considered to be a promising electronic ceramic packaging PCB. AlN material has high thermal conductivity, excellent dielectric properties, high electrical insulation strength, stable chemical properties, strong corrosion resistance, and good mechanical properties. In particular, its thermal expansion coefficient matches with silicon, which makes it an ideal semiconductor packaging substrate materials and have been widely used in integrated circuits, microwave power devices, millimeter-wave packaging, high-temperature electronic packaging and other fields.
Usages and applications of ceramic printed circuit boards Ceramic printed circuit boards have a wide range of applications and can be used in the LED field, solar panel components, high-power power semiconductor modules, semiconductor refrigerators, electronic heaters, power control circuits, power hybrid circuits, smart power components, high-frequency switching power supplies , solid state relays, automotive electronics, communications, aerospace and military electronic components.
Advantages of ceramic PCB boards Higher thermal conductivity More matching thermal expansion coefficient Stronger and lower resistance metal film The solderability of the substrate is good, and the use temperature is high Good insulation Low high frequency loss High-density assembly is possible It does not contain organic ingredients, is resistant to cosmic rays, has high reliability in aerospace and has a long service life The copper layer does not contain an oxide layer and can be used for a long time in a reducing atmosphere
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