#xpoint

Intel has given a lot of information on its Architecture day like as -Intel ‘Tiger Lake’ CPUs, Xe Graphics, 10nm ‘SuperFin’ Process, Software, and More Detailed

The flood of announcements comes a few weeks before Tiger Lake is expected to launch

Starting with the 11th Gen ‘Tiger Lake' CPUs, which are expected to be announced as early as the first week of September, Intel disclosed that a combination of microarchitectural and manufacturing process improvements will allow for a much wider range of frequencies than the current 10th Gen ‘Ice Lake' processor series. This should allow CPU cores to scale up or down farther than before to accommodate power-saving and performance goals.

YoYofficer Announces XPoint; First Plastic YoYo

Our friends at YoYofficer have finally made the jump to plastic! Their first plastic yoyo, the XPoint, should be hitting stores soon and it looks like a solid player. Check out specs below, as well as a new video from Ilya Shaposnikov featuring the XPoint. Yoyofficer XPoint Specs: Diameter: 58mm Width: 44mm Weight: 64g Gap:4.3mm Bearing: Size C – Both Narrow & Centering Retail Price: $13.9 USD  …

Les composants 3D Xpoint sont attendues dans les SSD Optane pour commencer. (crédit : D.R.)

Censée remplacer la DRAM comme les composants NAND flash, la mémoire non volatile 3D Xpoint développée par Intel et Micron est toujours à la recherche du bon positionnement sur le marché du stockage et des serveurs.

Révolutionnaire, la technologie 3D Xpoint d’Intel et Micron entend bien secouer les positions établies sur le marché de la mémoire en apportant des composants de grande capacité et à la vitesse fulgurante. Mais un an après son annonce, les deux fabricants de puces en sont encore à chercher le meilleur moyen d’assurer le succès de leur nouvelle classe de mémoire et de stockage qui se veut plus rapide, plus dense et plus durable que la DRAM classique et la NAND flash. 

Si Intel affirme que la 3D Xpoint est 10 fois plus dense que la mémoire, la société a montré qu’elle était jusqu’à 10 fois plus rapide que les SSD classiques. Les premiers SSD 3D Xpoint commercialisés sous la marque Optane seront disponibles en fin d’année. Les barrettes mémoire DIMM 3D Xpoint non-volatiles arriveront quant à elles l’année prochaine seulement, a indiqué le CEO d’Intel Brian Krzanich lors de présentation des résultats trimestriels cette semaine.

Premières unités livrées pour test 

Des SSD 3D XPoint ont déjà été livrés en test aux premiers clients, principalement des fournisseurs de services cloud, pour les inciter à adopter cette technologie. Mais Intel tente encore de comprendre comment exploiter et vendre cette technologie qui peut remplacer la mémoire, la flash ou les deux composants à la fois selon les cas de figure.

La plus grande capacité et des temps d’accès plus rapides que les SSD pourraient être attrayants pour les joueurs, et apporter le niveau de performances qu’ils attendent, souligne Brian Krzanich. « Vous pouvez précharger en cache le prochain niveau de votre jeu et le charger ensuite presque instantanément » a-t-il dit. Les premiers SSD Optane cibleront donc les PC haut de gamme comme les plates-formes de jeu et les ordinateurs de bureau. Ils seront également disponibles pour les ordinateurs portables et les baies de stockage, indique le CEO.

15 To max pour l’instant 

Intel proposera des SSD de 1 To avec une épaisseur de 1,5 millimètre pour les ordinateurs portables et les tablettes, et jusqu’à 15 To avec les modèles 2,5 pouces. Ils seront compatibles avec les interfaces NVMe et PCI-Express sur les PC et les Mac compatibles. Le fondeur doit encore convaincre les fournisseurs de serveurs et de baies de stockage qui ont massivement investi sur la NAND flash et qui passent aujourd’hui au NVMe en mode fabric. « Nous avons commencé à expédier des unités d’échantillonnage aux clients afin de les laisser essayer et comprendre ce qu’ils pourront faire avec. Il s’agit des grands fournisseurs de services cloud computing », a déclaré Brian Krzanich.

Facebook collabore par exemple avec Intel sur 3D Xpoint dans le cadre de son Open Compute Project. Ces entreprises sont susceptibles de travailler à l’intégration des Optane avec Lightning, la plate-forme de stockage open source JBOF ((just a bunch of flash). La technologie 3D Xpoint pourrait être exploitée avec les SGBD et les grandes applications, qui génèrent et traitent beaucoup de données en général. Plus la capacité mémoire est importante, plus les données sont traitées rapidement. L’arrivée de la 3D Xpoint pourrait éventuellement conduire à des changements dans la conception des serveurs avec des châssis spécialisés et découplés gorgés de DIMM pour offrir une très grande capacité mémoire aux applications in-memory telles que SAP HANA.

Un marché prometteur la DIMMM 

Si Intel est incapable aujourd’hui d’estimer la taille du marché pour la 3D Xpoint, les barrettes DIMM reposant sur cette technologie pourraient rapidement remplacer la mémoire volatile qui ne peut pas conserver les données. « Quand je pense d’où viendront les grands volumes, ce sera le form factor DIMM », a déclaré Brian Krzanich.

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Technology 3D XPoint - high performance and exceptional reliability

In relation to technology in general, and memory technology in particular, there are many different specifications that need to pay attention. 3D XPoint technology offers many advantages for certain applications related to high performance. The examples presented below, to help visualize these benefits.

Intel and Micron * represent a new memory technology 3D XPoint

• Intel and Micron * begin production of a new class of non-volatile memory for the first time in 25 years. • 3D XPoint ™ technology provides a thousand times higher data rate memory, compared with the standard NAND. • The company has developed a unique composite materials and a special architecture, which can increase the density of components by 10 times compared to conventional memory. July 28, 2015 – Intel Corporation and Micron Technology, Inc. * technology provided 3D XPoint ™, which is a nonvolatile memory capable of increasing the speed of the various devices, applications and services that require fast access to large volumes of data. Memory 3D XPoint allows you to create a new category of storage devices for the first time to market for NAND flash in 1989

The development of devices with advanced networking capabilities and new digital services has led to a significant increase in the volume of data. For practical use of information created, you must create the resources for its storage and rapid analysis, making it difficult for service providers and system developers, who are forced to maintain an optimal balance of cost, power and performance in the design of new storage devices. 3D XPoint technology combines the advantages of manufacturing technologies of memory available in the market. It is characterized by high performance and density components, low-power and affordable price. This technology is up to 1 thousand. Times faster and has up to one thousand. Times longer service life compared with memory NAND. In addition, it has a 10 times higher density of components compared with the conventional memory.

“For several decades, the company looked for ways to reduce latency when the CPU to the data to increase the speed of analysis of information, – said Rob Crook (Rob Crooke), senior vice president and general manager, Non-Volatile Memory Solutions Group Corporation Intel. – A new class of non-volatile memory 3D XPoint can solve this problem and increase the speed of data storage systems. ”

“One of the most important issues in the world of modern computing technology is the long time it takes for the processor to access the data in the storage system, – said Mark Adams (Mark Adams), president of Micron *. – A new class of non-volatile memory is a revolutionary technology that provides fast access to large volumes of data and allows you to create entirely new applications. ”

The digital world is evolving rapidly, with 4.4 zettabytes of digital information created in 2013, to a projected 44 zettabytes by the end of 2020. Technology 3D XPoint allows you to turn this enormous amount of data into useful practical information for a nanosecond. For example, retailers can use the new development in order to promptly detect signs of fraud in financial transactions; Researchers in the field of medicine will be able to real-time processing and analysis of larger amounts of data to accelerate the complex scientific problems, including the human genome analysis and monitoring of the disease course.

The benefits of high-speed 3D XPoint can increase user comfort when working with a PC. Volatility of the new technology also allows its use for different applications to store data with low latency: the data is not erased after switching off the device.

The new architecture for advanced memory technology Based on 10 years of research and development, technology 3D XPoint was created from the ground up to meet the demand in the non-volatile, high-speed, long-life and high-capacity storage solutions at an affordable price. The technology uses a new class of non-volatile memory which significantly reduces delays, enabling to store a larger amount of data close to the processor.

The innovative cross-architecture creates a three-dimensional “chessboard” on which a memory cell located at the intersection of numerical lines and bit lines, which allows for an independent right to perform addressing. As a result, data can be written and read in small sizes, which leads to faster and more effective process of reading / writing.

Features Technology 3D XPoint: • Phillips structure – Perpendicular wires combined 128 billion memory cells. Each memory cell stores one bit of data. This allows for high speed and high density. • Stratification – In addition to the location in the cross-shaped structure, memory cells arranged in several layers. The original technology allows you to store 128 GB on a single die for the two layers of memory. Future generations of technology will increase the number of layers to scale capacity. • Use the selector – Access and read or write in the memory cells are made by changing the voltage directed to each selector. This eliminates the need for the transistors, which increases capacity and reduces the cost. • High-speed cell – Due to the small size of the cells, high-speed selectors, low latency and fast recording cell can switch state faster than any non-volatile memory technology.

Trial delivery of products based on the technology 3D XPoint for individual customers will begin later this year. In addition, Intel and Micron * developing its own products based on this technology.

  The speed of technology 3D XPoint Memory Technology 3D XPoint to 1 thousand. Times faster than memory NAND. • The average travel time to work of the US population would be reduced from 25 minutes to 1.5 seconds. • Flight from San Francisco to Beijing would take about 43 hours instead of 12. • The Great Wall could be built in 73 days instead of 200 years.

The delay hard drives and NAND memory is measured in microseconds and memory 3D XPoint – in nanoseconds (one billionth of a second).

In the time it takes the hard drive to overcome the basketball court, memory NAND overcome the marathon distance, and 3D XPoint can circumnavigate the globe.

If we compare the data storage on a computer travel: • Hard drives could carry you from New York to Los Angeles for 4 days (4000 km). • During this time, SSDs could take you to the moon (386,000 km). • During this time, the memory 3D XPoint could take you to Mars and back (about 450 million kilometers).

The reliability of the technology 3D XPoint 3D XPoint provides up to one thousand. Times longer life compared to NAND. • If 3D XPoint was machine oil of your car, you have the oil changed every 1 to 4.8 million km (120 journeys around the world, or one trip around the Sun).