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Embedded networking platforms used in aerospace, defense, industrial automation, and space applications face a unique challenge: they must deliver high-speed, reliable communication between electronic systems in environments where size, weight, and power (SWaP), are tightly constrained. Standard commercial networking gear simply isn't designed for this. So, as mission-critical systems grow more data-intensive, the demand for compact, high-throughput, and standards-compliant networking hardware has never been higher. This blog explains what makes the VNX+ Ethernet Switch architecture an essential technology for modern rugged deployments.

What Is a VNX+ Ethernet Switch?

A VNX+ Ethernet Switch is a managed Layer 2/Layer 3 switch module built specifically for these embedded, size-constrained VNX+ deployments. Unlike commercial switches, it integrates directly into a compact form-factor (VITA 90) system, routing all I/O and power through a standardized high-density connector interface. The result is a rugged switch that fits into mission-critical platforms without compromising on networking capability. By combining Layer 2 & Layer 3 routing, and precision timing into a single VNX+ module, engineers can design more capable systems with fewer discrete components and reduce integration complexity.

Understanding the VITA 90 Standard and Why Compliance Matters

Any serious discussion of embedded networking modules must include the VITA family of standards, which defines mechanical and electrical specifications that allow modules from different vendors to interoperate within the same system. A VITA-90 Compliant Ethernet Switch adheres to the ANSI VITA 90.0 specification, the VNX+ Base Standard which governs how I/O signals and power are routed through a 400-pin SEARAY™ connector. This standardization is critical for two reasons:

Interoperability Across Vendors

When a VNX+ switch module conforms to an open standard, system integrators are not locked into a single-vendor ecosystem.

Predictable Signal Integrity

The 400-pin connector architecture ensures that all I/O signals travel over a defined, validated interface.

Layer 2 and Layer 3 Capabilities: What the Switch Actually Does

A managed switch supporting both Layer 2 and Layer 3 operation is a substantially more capable device than a simple unmanaged switch.

Traffic Management

Layer 2+ operation also includes multicast and broadcast storm control, flooding control, and flexible link aggregation using information from Layer 2 through Layer 4. Rapid Spanning Tree Protocol (RSTP) and MSTP ensure loop-free topologies, while multi-protocol support spans IEEE 802.1d, IEEE 802.1w, IEEE 802.1s, and IEEE 802.1x.

Layer 3+ Software Support Includes

Hardware and software-based IPv6 L3 static routing, RFC 2328 OSPFv2 dynamic routing, IEEE 1588 Precision Time Protocol (PTP), RADIUS accounting and port and queue policers.

Thermal Management Considerations

Port Configuration

The module provides 8 GigE ports via MDIO, two 10GbE SFI ports available either through the 400-pin connector with zero-aperture or via MT optical interfaces with a 320-pin half-aperture connector, along with a single RS232 console.

Scalable Port Expansion

Three QSGMII ports for 8, 12-port expansion with optional expansion module.

Power Envelope

The module operates on +3.3 Vdc and +5 Vdc inputs, consuming between 15 and 20 watts, consistent with what is available on most embedded computing backplanes.

Conclusion

In summary, the combination of rugged build, standards compliance, multi-layer networking capability, and compact dimensions makes the VNX+ switch architecture suitable for mission-critical applications in environments where standard commercial networking hardware cannot meet the environmental, SWaP or reliability requirements.

Explore Rugged Networking Solutions with Trident SFF

Modern defense, aerospace, and industrial environments demand computing systems that can operate reliably under extreme heat, vibration, dust, shock, and unpredictable field conditions. This is where rugged hybrid COTS computers become essential. Designed for tactical edge deployments, these systems combine high-performance processing with ruggedized architecture to support mission-critical operations in the harshest environments

In this blog we’ll explore about Hybrid COTS Computers deliver rugged, high-performance embedded computing for defense and aerospace applications, enabling AI processing, edge computing, COTS-based scalability, SWaP -optimization, and reliable operation in extreme environments.

What Is a Hybrid COTS Computer?

A Hybrid COTS Computer is a rugged embedded computing platform that combines commercially available hardware technologies with military-grade reliability and customization.

Traditional defense systems often relied on proprietary hardware, which increased development costs and slowed deployment cycles. Hybrid COTS systems overcome these limitations by integrating high-performance commercial processors, GPUs, storage devices, and communication interfaces into ruggedized architectures suitable for defense and aerospace applications.

Why Small Form Factor Systems Matter in Defence and Aerospace

Modern defense systems increasingly demand compact and lightweight computing architectures without sacrificing performance.

Space Optimization

Military vehicles, airborne systems, and portable tactical equipment often operate in space-constrained environments. Compact embedded systems help integrators deploy advanced computing capabilities within limited installation areas.

Flexible Deployment

Compact rugged systems can be integrated into:

Ground vehicles

Aircraft mission systems

UAV platforms

Naval systems

Mobile command centers

Surveillance equipment

Their flexibility allows engineers to use standardized architectures across multiple deployment scenarios.

Open Architecture Improves Scalability

One of the biggest advancements in embedded computing is the adoption of open architecture standards such as COM Express (COMe).

Why Is High-Performance Processing Critical for Modern Embedded Systems?

High-performance processing has become a fundamental requirement for modern embedded systems managing massive volumes of data across tactical defense networks. As military platforms evolve toward advanced sensor fusion, multi-domain communication, and real-time data acquisition, embedded computing systems must process information rapidly and reliably without operational delays.

Why I/O Flexibility Matters

Rugged embedded platforms must support multiple interfaces to meet evolving mission requirements in defense and aerospace applications. Essential interfaces include Ethernet connectivity for tactical networking, display outputs for mission visualization, serial communication for subsystem integration, and high-speed data transfer for real-time data processing. Support for navigation and communication modules such as GPS, Wi-Fi, and cellular connectivity further enhances operational capability. Expansion technologies like Mini PCIe and XMC provide scalable flexibility, enabling customized mission configurations and integration of specialized defense and avionics interfaces

Fanless Cooling and Reliability in Harsh Environments

Traditional cooling systems may struggle in environments exposed to dust, vibration, and extreme conditions. Conduction-cooled fanless systems improve reliability by removing moving parts, resulting in better durability, lower maintenance, quieter operation, and stronger resistance to harsh environments. These advantages make them ideal for aerospace and defense applications.

Technical Specification

Processor - Intel® Xeon®)

Memory - Up to 64 GB

Storage - Up to 1980GB with M.2 SATA Interface

Dimensions - 8.55x10.25x4.33 inches (Standard Configuration)

Weight(Standard) - ~10.60 lbs. (*Configuration Dependent)*

Power Input - 28 VDC @ 45-80 Watts (*Configuration Dependent)*

I/O - Standard and Build Options Available

Conclusion

Hybrid COTS Computers play a critical role in modern defense and aerospace applications by delivering reliable performance in demanding environments. Their compact form factor, scalable architecture, and advanced processing capabilities support mission-critical operations where durability and efficiency are essential. Designed to withstand harsh conditions such as vibration, extreme temperatures, and electromagnetic interference, these systems enhance operational reliability while reducing maintenance requirements. As defense technologies continue to evolve, Hybrid COTS Computers provide the flexibility, performance, and resilience needed for next-generation aerospace and military platforms.

Looking for advanced rugged embedded computing solutions?

As embedded computing systems grow more powerful and architecturally complex, validating their performance before deployment becomes critical. For developers and system integrators working with the VNX+ ecosystem, a structured lab test environment is a prerequisite for reliable product development and qualification. This blog explains what a VITA 90 test platform is, how it fits into the development workflow, and what capabilities engineers should look for when evaluating a system or a module.

What Is VNX+?

VNX+ is a small form factor embedded computing standard governed by the VITA 90 family of specifications. It defines the mechanical, electrical, and interface characteristics for a range of module types—including single board computers (SBCs), GPU processing boards, power supply units (PSUs), and power filter boards, complying with VITA 90 as the base standard.

What Is a VITA 90 Test Platform?

A VITA 90 test platform is a lab benchtop system designed to evaluate, develop, and test VNX+ modules. Its primary purpose is to give engineers a controlled environment where modules can be individually stress-tested before being integrated into a final system design.

A dedicated test platform, like the VNX+ Lab Test Bench TJ3 provides the necessary infrastructure to bring up and validate modules efficiently.

Core Functions of a VNX+ Test Platform

A well-designed test environment for VNX+ modules performs several functions central to the development process:

Module Hosting:

It provides physical slots conforming to the VNX+ 19mm profile, accommodating SBC, GPU, PSU, and filter modules simultaneously.

Power Management

It supports both native VNX+ power subsystems and alternative sources such as a standard ATX connector or external SMPS PSU — ensuring development can continue even when dedicated VNX+ PSU modules are unavailable.

I/O Accessibility

All module I/Os are routed to inudstrial connectors, enabling engineers to interface with external modules.

PCIe Interfacing

PCIe lanes from SBC modules can be routed to a PCIe MUX device, enabling integration testing with external peripherals or modules.

Storage Provision

Provision for mSATA SSD modules allows operating systems to be loaded directly onto the test bench, enabling complete testing.

Power Architecture Flexibility

One of the distinguishing characteristics of a capable VNX+ test platform is its flexibility in power input. Since VNX+ module development often occurs in phases, the test platform must support fallback power options.

Typical power input options include a DC power jack and an ATX connector. Bypass jumpers allow engineers to route raw input power directly to the VNX+ PSU, or to bypass both the filter and PSU modules entirely if external SMPS-derived outputs are preferred. This approach ensures the platform remains usable across all stages of development.

PCIe Communication and MUX Architecture

In systems with multiple SBC modules, PCIe lane communication becomes important. A test platform that incorporates a PCIe MUX device allows engineers to select which SBC's PCIe lanes are active at a given time. By toggling a MUX select control signal, PCIe lanes from either SBC-1 or SBC-2 can be routed to a shared PCIe expansion connector, ensuring that only one SBC is connected to the PCIe expansion interface at any moment.

Thermal Management Considerations

VNX+ modules operating under sustained workloads generate significant heat. A test platform intended for performance evaluation should support active cooling—typically through an optional fan assembly—to maintain thermal stability during extended test runs. Adequate airflow not only protects the modules under test but also ensures that performance benchmarks are not skewed by thermal issues.

Conclusion

In conclusion, a VITA 90 test platform is an essential tool for any team working within the VNX+ ecosystem. By providing flexible power options, full I/O access, PCIe expansion capability, and multi-module hosting, it dramatically reduces the time and risk associated with embedded system development. As VNX+ adoption grows, having a purpose-built test environment becomes not just beneficia —but foundational to development success.

H3: Trident SFF offers purpose-built solutions for VNX+ module development and validation.

Read on our website: https://trident-sff.com/blogvnx.html

Modern defense, aerospace, and industrial applications are placing increasing pressure on embedded computing platforms. Systems must now operate reliably in extreme temperatures, under vibration, in electromagnetically hostile environments—all while managing growing data workloads and shrinking size, weight, and power (SWaP) constraints.

Meeting these demands requires a new generation of computing architecture, one that is modular, scalable, and built to an open standard. That is precisely the problem the VNX+ system was designed to solve.

What Is the VNX+ Standard?

VNX+ also referred to as VITA 90 is an open embedded computing standard developed under the VITA (VMEbus International Trade Association) standards body. It defines a specification for small-form-factor, rugged, modular computing systems built around a 19mm module.

Core Architecture: How a VNX+ System Is Structured

A typical VNX+ system is built around a modular backplane—a central bus that allows individual functional modules to be inserted, removed, and replaced independently. Each module slot follows the 19mm dimension defined by the standard, keeping the overall system compact while allowing meaningful functional density.

The key module categories in a VNX+ architecture include:

Power Supply Unit (PSU)—handles input voltage regulation and distribution to other modules

EMI Filter Module—provides electromagnetic interference filtering at the system input

Single Board Computer (SBC)—the primary compute element, typically based on a high-performance 11th Gen Intel® Core™ i7-1185GRE Processor

GPU/AI Accelerator Module—dedicated processing for inference, image processing, or signal workloads

Holdup Module—ensures uninterrupted power during input transients

I/O Carrier Module—provides connectivity interfaces such as PCIe, RS-422, CAN, USB, and serial

Ethernet Switch Module—enables multi-port Gigabit networking within and outside the chassis

Why the VITA 90 Standard Matters

Open standards like VITA 90 exist for good reasons. In defense and aerospace procurement, proprietary systems create long-term dependency on a single vendor, complicate maintenance and upgrades, and increase lifecycle costs.

With a VNX+ system:

System integrators can source compliant modules from multiple vendors

Upgrades to individual modules do not require platform redesign

Qualification and certification efforts are reduced because the base architecture is already standard-compliant

Interoperability with other VITA-family systems is maintained

The VITA 90 standard also specifies environmental and electrical compliance thresholds, which align closely with MIL-STD requirements — making VNX+ platforms well-suited for defense certification pathways including MIL-STD-810H, MIL-STD-461G, MIL-STD-704F/1275F

SWaP Optimization: The Design Principle Behind VNX+

One of the defining characteristics of the VNX+ standard is its intentional focus on size, weight, and power. Legacy rugged computing form factors—while capable—were often large, heavy, and power-hungry by today's standards. VITA 90 platforms are purpose-designed for constrained platforms: unmanned aerial vehicles (UAVs), ground vehicles, naval systems, and airborne pods where every gram and watt is accounted for.

The 19mm module and compact backplane geometry allow capable multi-module systems to fit within enclosures that would be considered remarkably small for their processing throughput. Conduction-cooled (fanless) thermal design further reduces mechanical complexity and eliminates moving parts that could fail in harsh conditions.

Customization and Third-Party Module Integration

A key advantage of the VNX+ ecosystem is that the standard is open. System designers are not confined to a fixed module set from a single manufacturer. Compliant third-party VNX+ modules—whether custom I/O boards or domain-specific systems—can be integrated into a VNX+ chassis as long as they conform to the VITA 90 mechanical and electrical specification.

Conclusion: A Platform Designed for How Defense and Industry Operate

The VNX+ system represents a mature, thoughtful response to the realities of modern embedded computing in demanding environments. By standardizing the modular architecture, VITA 90 gives engineers a reliable foundation that balances performance, compactness, modularity, and ruggedness in a way that proprietary or one-off designs cannot.

Explore VNX+ compliant systems designed for your mission requirements at Trident SFF.