Tessolve, a leading global provider of semiconductor system and silicon solutions for next-generation products,with Intel Foundry.
Tessolve and Intel Foundry have joined forces to enable EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging technology, empowering chipmakers to build high-performance, heterogeneous semiconductor solutions for AI, data centers, automotive, and next-generation computing.
“Over the past two decades, Tessolve has grown into a trusted engineering partner for many of the world’s leading semiconductor companies.”, said Srini Chinamilli, Co-Founder & CEO, Tessolve. “Intel Foundry’s EMIB, combined with our end-to-end capabilities across the semiconductor value chain, allows us to further expand our offerings for Intel Foundry customers.”
