#solderpaste

Electronic components such as PCBs have increasingly become ubiquitous with all industry today, from smartphones to automobiles. And without proper soldering of these electronic components, much of the technological advancement of today may not have been possible. For analysing enterprise-wide soldering process and performance, data is needed. Industry 4.0 provides the platform for this.

Large-scale soldering equipment such as those in SMT, wave and reflow soldering along with pick-and-place robots have already moved to Industry 4.0 with documented data for greater control. However, transitioning hand soldering to Industry 4.0 poses a challenge.

Hand Soldering

Hand soldering, which is still required for certain specialty, irregular, or heat-sensitive components, has become more challenging, requiring highly skilled soldering technicians, improved process controls, and advanced hand-soldering tools and equipment. Manual rework, repair and replacement is required for issues such as bridging, tombstoning, slump, solder paste beading, insufficient solder, and damaged components from larger automated soldering equipment.

Working with exceedingly small components which are packed closely in high-density PCBs needs highly skilled soldering, often under a microscope or a camera, using specialised tools such as ultra-fine soldering tips, tweezers and handpieces.

Besides, high-power industrial electronics and high-frequency telecommunication devices need to be hand soldered.

Upgrading to Industry 4.0 using Industrial IoT Solutions in India is the need of the hour for hand soldering for greater visibility and traceability.

Metcal’s path-breaking solutions for Hand Soldering

Metcal, which had already answered the challenges in hand soldering with many path-breaking innovations such as SmartHeat and Connection Validation, now brings the CV-IOT Gateway for greater process control and traceability.

SmartHeat technology in the cartridge involves a non-heating core surrounded by an outer heating layer of magnetic alloy. When a high frequency current is passed over the heater the outer layer heats up causing the magnetic properties to be lost. This results in the migration of current to the non-heating copper core which in turn leads to the restoration of magnetic properties. This process is repeated cyclically till the Solder Joint is complete.

Connection Validation (CV) is another innovation from Metcal which eases the soldering process for the operator by indicating when a joint is complete using a closed loop feedback mechanism in the form of an audible and a visual alert. Joint completion is achieved after Solder Event Detection, Preliminary Validation, Liquidus Detection, and Intermetallic Compound (IMC) Calculation.

Metcal’s CV systems employ a patented chip-in-cartridge technology whereby a small microchip in each heater cartridge passes information to the CV unit on the tip temperature rating, tip geometry, lot number, and more, allowing managers to allow and restrict specific cartridges on each system and protect the system from non-conforming cartridges.

When accessible enterprise-wide in Industry 4.0, this information helps in better decision-making to improve productivity, efficiency and quality. An IoT gateway device is required for this.

Metcal’s CV IOT Gateway

The Metcal CV IOT Gateway device when connected to the CV System and a Computer, provides a range of information on each solder joint such as:

Timestamp

Station name and type (Lead or Lead-Free)

IP Address

MAC Address

PCB number for traceability

Cartridge part number, type, serial number and lot number

Temperature scale (C/F)

Station port used

Joint count

Idle temperature

CV validation result

Tip temperature during soldering

This brings Hand Soldering into Industrial IoT Solutions in India, allowing decision makers to improve business and plan better using the vast repertoire of information now available.

In the electronics manufacturing industry, achieving a consistent and high-quality soldering process is crucial. One of the key elements in ensuring proper soldering is using well-mixed solder paste. Solder paste mixers play an essential role in maintaining uniformity, improving soldering efficiency, and reducing defects in electronic assemblies. In India, the demand for reliable solder paste mixers has been increasing due to the rapid growth of the electronics and semiconductor industries.

What is a Solder Paste Mixer?

A solder paste mixer is a specialized machine designed to evenly mix solder paste, ensuring a consistent blend of solder particles and flux. Proper mixing eliminates air bubbles, reduces viscosity inconsistencies, and enhances the overall performance of the solder paste.

Types of Solder Paste Mixers

There are different types of solder paste mixers available in India, each catering to specific industry needs:

Rotational Solder Paste Mixers – Uses centrifugal force to mix solder paste without introducing air bubbles.

Vacuum Solder Paste Mixers – Removes air from the paste while mixing, ensuring a void-free consistency.

Planetary Solder Paste Mixers – Provides simultaneous rotation and revolution for thorough mixing.

Manual and Automated Solder Paste Mixers – Manual mixers are used for small-scale operations, while automated mixers are preferred in high-volume manufacturing.

Benefits of Using Solder Paste Mixers

Using a solder paste mixer offers several advantages:

Uniform Mixing: Ensures consistent distribution of solder particles and flux.

Improved Soldering Quality: Reduces defects like voids, poor adhesion, and solder ball formation.

Increased Productivity: Saves time compared to manual mixing methods.

Cost Efficiency: Reduces waste and improves yield rates.

Minimized Air Bubbles: Enhances solder joint reliability.

Choosing the Right Solder Paste Mixer in India

When selecting a solder paste mixer in India, consider the following factors:

Mixing Technology: Choose between rotational, vacuum, or planetary mixers based on your needs.

Capacity and Speed: Ensure the mixer can handle your production volume efficiently.

Automation Level: Opt for fully automated mixers for large-scale operations.

Compatibility: Ensure the mixer is suitable for different solder paste formulations.

Brand and Warranty: Choose a reliable manufacturer that offers technical support and warranty.

Why Choose Ascomp Inc. for Solder Paste Mixers?

Harmful contaminants such as solder and adhesive residues, flux, and dust and debris from other manufacturing processes and handling are often formed during the course of electronics manufacture, and the primary purpose of cleaning is to remove these contaminants at regular intervals. This ultimately leads to increased lifetime of the electronic product by ensuring good surface resistance and by preventing current leakage due to PCB failure.

With the constantly evolving cleaning market to meet the demands of the ever-expanding electronics industry, it is of paramount importance that the level of cleanliness required be clearly defined. A correct method must then be used to ensure that the level of cleanliness achieved meets the standard specified by the electronics engineer.

When to perform cleaning

There are many stages where cleaning is required:

Before stencilling and soldering to remove contaminants from the previous production stages

After stencilling to remove excess solder/adhesive

After soldering to remove corrosive flux residues and any excess solder

How is cleaning performed

Precise application of solder is often achieved using a stainless steel stencil over the printed circuit board. Once the circuit design has been finalised, it is mostly purchased as a set of a stencil and many PCBs (a single stencil can be used on thousands of PCBs). The solder is applied on the stencil through which it flows precisely onto the PCB below.

The ultimate goal of cleaning is to remove unwanted residue from the surface and under components. This is achieved by considering selection of components, board material compatibility, placement and defining solder mask in the Design Phase. The cleaning agent must be according to the solder alloy and flux composition with proper heat exposure. The Cleaning Agent must be selected with reuse, environmental, temperature, use rate and Health and Safety considerations in mind. Any Cleaning Machine used must perform proper fluid management, give a good throughput and consume less energy.

Types of cleaning in electronics manufacturing

Proper cleaning can be categorised into PCB Cleaning, Stencil Cleaning and Maintenance Cleaning.

PCB cleaning This can be further categorised into inline and batch aqueous sprays for in-air cleaning, ultrasonic and batch immersion cleaning, manual PCB and benchtop cleaning and vapour degreasing.

While inline washers use high flow, energy and deflective forces, batch cleaning machines are designed to wash, rinse and dry assemblies of smaller footprint. In ultrasonic and batch immersion cleaning, the product being washed is completely immersed in the cleaning agent using either ultrasonic energy or spray-under-immersion forces. Manual PCB and benchtop cleaning is required in rework and repairs to production assemblies and after hand placement of BGAs, connectors or other surface mount components and this is achieved by using an aerosol can or a pump dispenser and ensuring the right cleaning chemistry. In vapour degreasing, the engineered cleaning fluid is a blend of solvents which behave like an azeotrope to produce a constant boiling system at a specific temperature range.

Stencil cleaning

According to some estimates, up to 70% of solder defects are attributed to the stencil printing process. Stencil cleaning is categorised into under-stencil wiping to remove soils, ultrasonic cleaning to remove trace levels of solder paste from stencil openings, solvent-based cleaning to clean wet solder paste, adhesives and flux residues from stencils, mis-printed PCBs, wave soldering pallets, tools and fixtures, spray-in-air aqueous wash/rinse to rapidly dissolve the solder paste, hand-held stencil cleaning to remove trace levels of solder paste from the apertures, and misprint cleaning to address misprints due to issues such as clogged apertures, stencil out of alignment and solder paste rheology shifts.

Maintenance cleaning