Silicon Nitride Ceramic Substrate for Electronics
INNOVACERA silicon nitride substrates, with a thermal conductivity rating of 90 Watts/meter Kelvin, at first glance, appear inferior to Aluminum Nitride grades from the standpoint of heat dissipation. However, Silicon Nitride substrates, due to their far superior mechanical properties, can provide thermal resistance levels comparable to Aluminum Nitride. These impressive mechanical an excellent choice in applications where severe, repetitive thermal cycling of the circuit/package is present. Main Characteristic: High Bending Strength about Twice as high as Alumina and Aluminum Nitride (AlN) Substrate High Thermal Conductivity about Three Times Higher than Alumina and ZTA substrate Excellent Insulation Properties, High Dielectric Breakdown Voltage, High Surface Resistivity / Volume Resistivity Coefficient of Thermal Expansion (CTE) Close to Silicon General Application: Circuit Substrate Heatsink Heat Spreader General Dimension: Item Unit Specification Standard Size inch 4.5’’-5.5’’ Tolerance ±1.0% NLT:±0.1mm Thickness mm 0.25~0.635 Tolerance ±10% NLT:±0.04mm Silicon Nitride Ceramic Properties Read the full article
