Desk Sputter Coater DST3
Specification of the DST3, magnetron sputtering system
http://bit.ly/2QPdePk
Ultimate Vacuum: Less than 2x10-6 torrIndependent sputtering control rate for each cathode to produce fine grain structuresAutomatic control of sputtering power independent of pressureAutomatic control of the cathode's temperatures to protect the lifetime of the magnetsData is rapidly registered by using fully automatic touch screen controlPrecision Mass Flow meter (MFC) to fine control of vacuum and pressure in reactive sputteringRecords and plots coating parameters graphs.Transfers curves and deposition process data by a USB port to PC0-1000 mA DC power supply utilities: 220V- 50HZ- 16ABox Dimensions: 50 Cm H x 60 Cm W x 47 Cm D Shipping Weight:100kg Β (pump, rack, and box)Ion sputtering system options and AccessoriesThe DST3 has the flowing options and accessories:Thermal evaporation insertHigh current power supplyQuartz crystalSpare glassSputtering targetsThermal source materials
DST3 High Vacuum, Triple Target, Magnetron Desk Sputter Coater
The Desk Sputter Coater DST3 is a desktop, triple target, turbo molecular-pumped vacuum sputter coater, suitable for magnetron sputtering of the semiconductors, dielectrics and (oxidizing & noble) metals. The system also can be fitted by an evaporation source for thermal evaporation process. The sputtering machine model DST3 is equipped with a large chamber and triple water - cooled cathodes which make it suitable for both sputtering a single large diameter specimen and co-sputtering a small diameter specimen. Magnetron sputtering process caused Desk Sputter Coater DST3 produces dens thin films with very good adhesion.
According to the state of the cathodes, DST3 is available in two models:
DST3 β A (Angled Cathodes):
The DST3-A is equipped with three angled cathodes with a common focal point. It can sputter from two or three targets simultaneously or independently to form alloys or multilayer deposition respectively.
Features
High vacuum turbo pump 300 l/s
Diaphragm backing pump
Full range vacuum gauge
Three 2β water - cooled sputtering cathodes
Large chamber suitable for large specimen sputtering depositions
Target selection for multilayer thin films
Co-sputtering to form alloy films
Two Quartz crystal monitoring system for real-time thickness measurement (1 nm precision)
Manual or automatic Timed and Thickness deposition
Intuitive touch screen to control the coating process and rapid data input
User-friendly software that can be updated via the network
Equipped with the electronic shutter
Equipped with a rotary sample holder with the ability to tilt in direction of cathodes
500 Β°C substrate heater
300 V DC substrate bias voltages
Unlimited sputtering time without breaking the vacuum
two-year warranty
Ion sputtering in the clean vacuum environment
The vacuum chamber of the sputtering system is cylindrical Pyrex with 300 mm OD and 200 mm H. Β The sputter coater is fitted with an internally mounted 300 L/s turbomolecular pump, backed by a diaphragm pump. It introduces a clean vacuum without oil contamination which normally exists with an ordinary diffusion pump.
Specification of the DST3, magnetron sputtering system
Ultimate Vacuum: Less than 2x10-6 torr
Independent sputtering control rate for each cathode to produce fine grain structures
Automatic control of sputtering power independent of pressure
Automatic control of the cathode's temperatures to protect the lifetime of the magnets
Data is rapidly registered by using fully automatic touch screen control
Precision Mass Flow meter (MFC) to fine control of vacuum and pressure in reactive sputtering
Records and plots coating parameters graphs.
Transfers curves and deposition process data by a USB port to PC
0-1000 mA DC power supply
Utilities: 220V- 50HZ- 16A
Box Dimensions: 50 Cm H x 60 Cm W x 47 Cm D
Shipping Weight:100kg Β (pump, rack, and box)
Ion sputtering system options and Accessories
The DST3 has the flowing options and accessories:
Thermal evaporation insert
High current power supply
Quartz crystal
Spare glass
Sputtering targets
Thermal source materials
