May 21
Asahi Kasei has developed a new PSPI film based on its extensive experience in producing liquid PSPIs used for buffer coatings and passivati
Asahi Kasei has developed a new photosensitive polyimide film designed for semiconductor panel-level packaging, supporting the industry’s push toward higher performance, miniaturization, and advanced chip integration. The innovation is expected to enhance packaging efficiency and reliability for next-generation semiconductor applications across AI, automotive, and high-performance computing sectors.
