Oct 7, 2021
2.5D Packaging Technology
 Offering Silicon wafer manufacturing process including 5nm, 7nm, 12nm, 16nm, 2.5D packaging technology, ASIC/SoC Physical Design, SoC Micro architecture.
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2.5D Packaging Technology
 Offering Silicon wafer manufacturing process including 5nm, 7nm, 12nm, 16nm, 2.5D packaging technology, ASIC/SoC Physical Design, SoC Micro architecture.
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