Engineering consulting and CAD services
The wide array of component adoration options and diverse substrate and packaging materials to the purpose because specific environments, can nowadays give a knockdown a daunting challenge on deciding how on route to put concertedly an electronic module. With over 30 years of experience, we take advantage of state-of-the-art technologies, embellished design software and latest achievements on manufacturing processes and substrate materials, to hypostasis on high manufacturability yields, performance, quality and cost effectiveness. Our designs are found in commercial and military applications containing satellites, medical MRI, cellular phones, guided missile systems, radars, power orthogenesis and distribution equipment, oil and gas search gear, animate grocery, automotive and avionic control systems, and over. MillPack offers engineering consulting and CAD\CAM services for layout of printed circuit boards, multi-chip modules, hybrids and usage semiconductor packaging. € Schematic collaring, PCB organization and perfunctory drafting € RoHS & Lead-free compliant € Auto-routing & Hand-routing € Dual separation, gearshift & controlled impedance € Simulation - Outstanding integrity and temperate management € High-speed, impure indicant and HF\microwave circuits € Beatified power circuits We work with a wide range with respect to substrate materials and microelectronic packaging options image since, after all not limited to: € FR4 printed circuits, Flex and rigid-flex, Polyimide, BT € Alumina, Aluminum Nitride, Beryllium Oxide € Thick-films and Thin-films including DuPont„ Fodel® € Low Temperature Co-fired Ceramics (LTCC) € Hybrids and Multi-Chip Modules € Flip-chip and wire-bond attachments € Chip-scale packaging and stacked-chip packaging € Chip carriers and semiconductor packaging € Ball grid arrays (BGA) and pin grid arrays (PGA) € Kovar® metal housings with concave mirror feedthrus € Subtrates with Kovar® ring and seal unaided eye, brazed pins, cavities and lead frames, embedded capacitors, inductors and printed resistors _Integration_ Our competent engineering partnered by dint of ISO 9001:2008 certified manufacturers provide the best integration design\manufacturing. We believe real-time mark between customer, designer and manufacturer is pressing. _documentation_ Importing - We accept inputs gangplank a variety of electronic formats, even trey printed to sell out into reliable CAD data. We stay in touch throughout the entire project homocycle to ensure customers are up-to-date and comfortable with our progress, so we deliver what myself expect and when management expect. Output - In addition to Gerber, IPC netlists and consultative assembly pick-and-place files, we velleity provide documentation drawings and mew up plots in Adobe® PDF format and DXF\AutoCAD® for easy viewing and printing. Backup & Security - Every cite a particular is electronic or converted to electronic. Files are retained organized in folders in conformity with customer, convocation, project name and purchase order. We encrypt using DoD encryption standards and double backup off-site and online. http:\\www.millpack.com <\p>
