#highpowerpcb

Hitech’s Capabilities for Copper Based Substrate Manufacturing

Looking for high-performance metal core PCBs with exceptional thermal conductivity and precision engineering? Hitech Circuits has you covered with expert prototyping and small-batch production!

Key Capabilities: • Single / Double side PCBs, up to 1500 × 480 mm • Board thickness: 0.2mm–4.5mm, copper: 18–240μm • Min. hole size: 0.2 mm, hole position tolerance: ±0.075 mm • Fine punching: round holes ≥1.0mm, square slots ≥0.8×0.8mm • V-CUT board thickness: 0.6–3.2mm, angle deviation: ±0.5°

Thermal Performance: • Copper base up to 401 W/(m·K) • Insulation layer up to 38 W/(m·K) • Thermoelectric separation tech: up to 398 W/(m·K) — perfect for ultra-high heat flux designs

Precision & Finish: • Impedance control: within ±8% • Surface finishes: ENIG, ENEPIG, HASL, OSP, and more • Solder mask colors: Green, White, Blue, Red, Matte Black

Production & Delivery: • Capacity: 10,000 m²/month • Lead time: 5–7 days (prototype), 10–14 days (mass production)