Full Series of China's Fudan Micro Storage Chips
In fields with high requirements for storage reliability such as industrial automation and automotive electronics, selecting a storage device that adapts to the scenario and has stable performance directly determines the operational safety and service life of terminal equipment. As a backbone enterprise in the domestic semiconductor industry, Fudan Micro has been deeply engaged in the research and development of storage chips for many years, building a product matrix covering SPI NOR Flash, EEPROM, NAND Flash and other categories, fully complying with industrial-grade and automotive-grade temperature standards. With rich interface types, flexible packaging options and stable performance, it has become a trusted choice for hardware engineers. As a professional hardware procurement platform, ICGOODFIND incorporates the entire series of high-quality storage products from Fudan Micro into its spot inventory system, providing one-stop procurement guarantee for R&D and mass production.
SPI NOR Flash: High-Speed Compatibility for Multi-Scenario Data Storage
Fudan Micro's SPI NOR Flash series products take "high-speed transmission, wide-voltage adaptation and diverse packaging" as their core advantages, covering the full capacity range from 1Mbit to 1Gbit, perfectly matching the code storage and data caching needs of different scenarios such as industrial control, consumer electronics and smart hardware. This series supports various serial interfaces including SPI, Dual SPI, Quad SPI and QPI. Some high-end models also support DTR (Double Data Rate) mode, with a maximum frequency of up to 166MHz, which can quickly respond to data read and write requests and improve equipment operation efficiency.
In terms of adaptability, the product voltage range covers 1.1V-3.6V, including 2.3V-3.6V general-purpose models for conventional scenarios and 1.65V-2.0V low-voltage models for low-power equipment, which can accurately match different power supply design schemes. In terms of temperature grade, the entire series supports industrial-grade standards (-40β~+85β to -40β~+125β), and some models can be extended to meet automotive-grade requirements, ensuring stable operation even in high-temperature factory workshops and complex on-board environments. The packaging forms are also diverse, including SOP, TSSOP, USON, TDFN, CSP, BGA, etc., covering everything from conventional through-hole mounting to micro patch mounting, adapting to different PCB layout space requirements.
Selection Guide & Recommended Models
Combined with scenario requirements and mass production stability, the core recommended models and key parameter matching points are as follows:
Conventional Industrial Control Scenarios (Capacity: 1Mbit-16Mbit): Recommend FM25F01C (1Mbit) and FM25Q16B (16Mbit), both in mass production status (M), supporting SPI/Dual SPI/Quad SPI interfaces. The 2.3V-3.6V voltage adapts to general industrial power supply schemes, and the SOP package is easy to solder. The temperature grade of -40β~+85β (I3) meets most industrial environments. Matching points: Prioritize confirming whether the capacity meets the code storage requirements and whether the interface type is compatible with MCU pins.
Low-Power Smart Hardware Scenarios: Recommend FM25W04 (4Mbit) and FM25W16A (16Mbit), with a voltage range of 1.65V-3.6V adapting to battery-powered supplies, supporting Quad SPI/QPI high-speed transmission, and USON/CSP micro-packages saving PCB space. Matching points: Focus on verifying the matching degree between the voltage range and low-power design, and whether the package size meets the product miniaturization requirements.
High-Speed Transmission Scenarios (e.g., AI Modules): Recommend FM25LQ16I3 (16Mbit) and FM25LQ32I3 (32Mbit), supporting DTR mode with a maximum frequency of 133MHz. The low voltage of 1.65V-2.0V adapts to high-end computing modules. Matching points: Confirm whether the device supports DTR mode and whether the frequency is synchronized with the main control clock.
Automotive Electronics Scenarios: Prioritize models that support automotive-grade temperatures (Grade A1: -40β~+125β). Contact the manufacturer for details on automotive certification. It is recommended to pay attention to customized models of the FM25Q series adapted for on-board use. Matching points: Must meet automotive-grade temperature requirements, and prioritize SOP/TDFN packages resistant to vibration.
EEPROM Series: Full Interface Coverage, Precise Adaptation to Industrial/Automotive Scenarios
Fudan Micro's EEPROM products are subdivided into three interface types: IIC, SPI and Microwire. At the same time, industrial-grade and automotive-grade dedicated models are launched, with capacities ranging from 1Kbit to 2Mbit, specifically solving small-capacity data storage problems in industrial control and automotive electronics, such as equipment parameter preservation and sensor data caching.
The entire industrial-grade EEPROM series supports 1MHz-3.4MHz transmission frequency, with a voltage range of 1.1V-5.5V and a temperature resistance of -40β~+125β, which can resist harsh conditions such as electromagnetic interference and voltage fluctuations in industrial environments. Automotive-grade models have passed automotive certification, focusing on the reliability requirements of on-board electronic systems, adapting to scenarios such as body control and on-board sensors, ensuring that data is not lost in on-board environments such as high and low temperatures and vibration. It is worth mentioning that this series also provides diverse packaging, from PDIP8, SOP to micro CSP packaging, which can meet the compact design requirements of different on-board and industrial equipment. Although Microwire interface models have small capacities (1Kbit-4Kbit), they are still widely used in traditional industrial control equipment due to their 2MHz stable transmission and wide-voltage characteristics.
Selection Guide & Recommended Models
Recommendations are classified by interface type and application scenario, prioritizing mass production models. The core matching points focus on interface compatibility, voltage range and temperature grade:
IIC Interface Industrial-Grade Scenarios: For small capacities (2Kbit-4Kbit), recommend FM24C02H and FM24C04J, which are stable in mass production. The 1.7V-5.5V voltage adapts to most industrial power supplies, with optional SOP/TDFN packages. For medium and large capacities (32Kbit-128Kbit), recommend FM24C32D and FM24C128D, supporting 1MHz transmission and CSP packages adapting to micro devices. Matching points: Confirm whether the IIC address is configurable and whether the transmission frequency does not exceed the upper limit supported by the main control.
SPI Interface Industrial-Grade Scenarios: Recommend FM25N128AI3 (128Kbit) and FM25N256AI3 (256Kbit), in mass production status, with a voltage of 1.7V-5.5V and a temperature resistance of -40β~+125β (Grade I1), suitable for harsh industrial environments. Matching points: The SPI clock frequency must be β€20MHz to ensure timing matching with the main control.
Microwire Interface Traditional Industrial Control Scenarios: Recommend FM93C46A (1Kbit), FM93C56A (2Kbit) and FM93C66A (4Kbit), all in mass production, with stable 2MHz transmission. PDIP/SOP packages adapt to the upgrading of old equipment. Matching points: Confirm the compatibility of the Microwire timing protocol.
Automotive-Grade Scenarios: For IIC interfaces, recommend FM24C16DA1 (16Kbit) and FM24C32DA1 (32Kbit), mass-produced automotive-grade (Grade A1), with SOP/TSSOP packages resistant to vibration. For SPI interfaces, recommend FM25080A1 (8Kbit) and FM25640A1 (64Kbit), with complete automotive certification, adapting to body control modules. Matching points: Must verify AEC-Q100 Grade1 certification, and the voltage range matches the on-board 12V to 1.7V-5.5V power module.
NAND Flash: Large Capacity and High Reliability for High-Definition Storage Needs
For large-capacity storage scenarios, Fudan Micro has launched two major series: SPI NAND Flash and PPI NAND Flash, with capacities ranging from 512Mbit to 8Gbit, mainly adapting to devices that require massive data storage such as industrial monitoring, on-board entertainment and smart terminals. SPI NAND Flash supports SPI, Dual SPI and Quad SPI interfaces, with a maximum frequency of 120MHz, and has a built-in 8bit ECC error correction function, which can effectively improve the accuracy of data storage and avoid data errors caused by transmission interference. PPI NAND Flash is compatible with the ONFI 1.0 protocol, supports 40MHz transmission frequency, and uses BGA and TSOP48 packages, suitable for industrial-grade equipment with high requirements for storage capacity and stability.
The voltage range of this series of products is 1.7V-3.6V, supporting industrial-grade wide-temperature design. Some models can meet automotive-grade temperature requirements, and at the same time have low-power characteristics, which can balance large-capacity storage and equipment battery life requirements. It is an ideal storage solution for industrial Internet of Things and on-board smart systems.
Selection Guide & Recommended Models
Focusing on large-capacity storage scenarios, recommendations are based on interface type and power consumption requirements. Core matching points: capacity, ECC function, interface protocol and temperature grade:
SPI NAND Industrial Monitoring Scenarios: For low capacity (512Mbit), recommend FM25S005B, which is stable in mass production. The 8bit ECC error correction ensures data reliability, the TDFN package is compact, and the 2.7V-3.6V voltage adapts to industrial power supplies. For medium and large capacities (1Gbit-4Gbit), recommend FM25S01B (1Gbit) and FM25S04B (4Gbit), with a maximum frequency of 120MHz, supporting Dual SPI/Quad SPI, suitable for high-definition monitoring video storage. Matching points: Confirm whether the main control supports the SPI NAND controller, and the ECC error correction capability must match the requirements of the storage die.
Low-Power SPI NAND Scenarios: Recommend FM25LS005B (512Mbit) and FM25LS01B (1Gbit), with a voltage of 1.7V-1.95V adapting to battery-powered equipment. The 85MHz frequency meets conventional transmission, and the DND package saves power consumption. Matching points: Focus on verifying the matching between the voltage range and low-power design, and confirm whether the standby current meets the requirements.
PPI NAND Industrial Large-Capacity Scenarios: Recommend FM29F02 (2Gbit) and FM29F08 (8Gbit), compatible with the ONFI 1.0 protocol, 40MHz transmission, BGA/TSOP48 packages adapting to industrial servers, with a temperature grade of -40β~+105β. Matching points: Confirm whether the motherboard supports the PPI interface, and the package size must match the reserved space on the PCB.
DDR Supporting Storage: Adapting to High-End Computing Power to Help Equipment Performance Upgrade
To meet the supporting needs of high-end computing power equipment such as DDR4/DDR5, Fudan Micro has launched dedicated storage modules, supporting I2C/I3C interfaces, with a maximum transmission frequency of 12.5MHz, voltage adapting to 1.0V/1.8V, and using micro TDFN packages, specifically for auxiliary data storage and control of DDR memory. Although this series of products is still in the R&D or small-batch production stage, it fills the gap in domestic supporting storage for high-end computing power equipment and will play an important role in industrial servers, high-end industrial computers and other scenarios in the future.
Selection Guide & Recommended Models
Focusing on DDR memory supporting scenarios, prioritize mass production models. Core matching points: DDR version, interface type and voltage range:
DDR4 Supporting Industrial Scenarios: Recommend FM34C04D and FM34C04DN (both 4Kbit), stable in mass production, IIC interface 1MHz transmission, voltage 1.7V-3.6V, TSOP/TDFN packages adapting to DDR4 memory modules, suitable for industrial servers and high-end industrial computers. Matching points: Confirm compatibility with the IIC communication protocol of the DDR4 memory controller.
DDR5 Supporting High-End Computing Power Scenarios: Recommend FMSPD5118 (8Kbit), supporting I2C/I3C interfaces, with a maximum frequency of 12.5MHz, voltage 1.0V/1.8V adapting to DDR5 memory power supply, and TDFN package miniaturization. Matching points: It is necessary to verify compliance with the JEDEC SPD5118 hub standard, and the temperature grade matches the working environment of industrial servers (-40β~+85β).
ICGOODFIND: One-Stop Procurement Guarantee for Fudan Micro Storage Products
When selecting Fudan Micro storage products, hardware engineers often face problems such as "complex selection", "unstable supply sources" and "low efficiency of bulk procurement". ICGOODFIND specifically solves these pain points by incorporating the entire series of Fudan Micro storage products into its officially authorized supply system, covering all popular models such as SPI NOR Flash, EEPROM and NAND Flash, ensuring that each product is original and authentic, and can provide original factory traceability certificates and test reports.
In terms of services, ICGOODFIND's technical team can assist engineers in selection, accurately recommending suitable models according to project scenarios (industrial/automotive/consumer), capacity requirements and interface types. For R&D prototyping, small-batch spot goods are always available, and delivery can be arranged on the same day after confirmation, without delaying the prototype verification progress. In the mass production stage, it can provide full-order matching services. In addition to Fudan Micro storage chips, it can also synchronously complete other components such as resistors, capacitors and main controls to achieve unified delivery, saving the communication cost of docking with multiple suppliers. Especially for the recommended models in the above selection guide, ICGOODFIND has sufficient spot goods and can provide original factory traceability certificates to ensure the stability and consistency of bulk procurement.
