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CEA-Leti, the coordinator of the FAMES Pilot line, has achieved a major milestone for next-generation chip stacking fully functional.
CEA-Leti has achieved a major R&D breakthrough with its 400 °C CMOS processing for the FAME-S pilot line — paving the way for next-generation 3D integration in semiconductor manufacturing.
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FAMES Pilot Line invites chip industry proposals for a groundbreaking EU initiative, advancing semiconductor innovation through open-access
