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MediaTek launched the 4nm Dimensity 7300 and Dimensity 7300X high-end mobile device processors today. Best-in-class power economy and performance make Dimensity 7300 chipsets ideal for AI-enhanced computing, faster gaming, better photography, and effortless multitasking. Dimensity 7300X supports twin displays for flip-style foldable devices.

Both MediaTek Dimensity 7300 chipsets have 2.5GHz octa-core CPUs with 4X Arm Cortex-A78 and A55 cores. 4nm reduces A78 core power consumption by 25% over Dimensity 7050. To speed up gaming, the CPU combines the most recent Arm Mali-G615 GPU with a number of MediaTek HyperEngine optimisations. The Dimensity 7300 series provides 20% quicker FPS and 20% more energy efficiency than competing options. The new chips optimise 5G and Wi-Fi game connections, use clever resource optimisation, support Dual-Link True Wireless Stereo Audio and Bluetooth LE Audio technology to significantly improve gaming experiences.

According to MediaTek’s Wireless Communications Business Deputy General Manager Dr. According to Yenchi Lee, “The MediaTek Dimensity 7300 chips will help integrate the newest AI and connectivity technologies consumers can stream and game seamlessly. “Furthermore, the dual display capability of the Dimensity 7300X allows OEMs to create creative new form factors.”

With compatibility for a 200MP primary camera and a premium-grade 12-bit HDR-ISP, the MediaTek Imagiq 950 is another enhanced photographic feature available with the Dimensity 7300 chipsets. New hardware engines provide accurate noise reduction (MCNR), face detection (HWFD), and video HDR in the Dimensity 7300. This allows users to take beautiful pictures and videos in any kind of lighting. Compared to the Dimensity 7050, live focus and photo remastering are 1.3X and 1.5X faster, respectively. In addition, 4K HDR video may be recorded with a dynamic range that is more than 50% broader than competing solutions, allowing users to capture more detail in their recordings.

The MediaTek APU 655 doubles the performance of the Dimensity 7050 while also greatly increasing the efficiency of AI tasks. Also, in order to reduce memory requirements for larger AI models and more effectively use memory bandwidth, the Dimensity 7300 chips support new mixed precision data types.

The Dimensity 7300 SoCs enable global HDR standards and remarkably detailed WFHD+ displays with 10-bit true colour thanks to MediaTek’s built-in MiraVision 955. This improves media streaming and playing. Additionally, OEMs find it simpler to satisfy the expanding market demand for cutting-edge form factors thanks to the Dimensity 7300X’s specialised support for dual display flip phones.

Dimensity 7300 and Dimensity 7300X important features

With MediaTek’s own optimisations and a full suite of R16 power-saving advancements, MediaTek 5G UltraSave 3.0+ technology offers 13–30% more power efficiency than competing options in typical 5G sub-6GHz connectivity settings.

Supporting 3CC carrier aggregation up to 3.27Gb/s 5G downstream speed, which enables better downlink rates in suburban and urban settings.

Support for multi-band Wi-Fi 6E allows for dependable and quick multi-gigabit wireless access.

Users will have more options with dual 5G SIM capability and dual VoNR.

This was addressed by MediaTek’s Dimensity 7300 series in May 2024. The Dimensity 7300 and 7300X chipset series boosts high-end to smartphone and foldable device performance, energy efficiency, and AI.

Constructed for Rapidity and Effectiveness

A powerful octa-core CPU powers the Dimensity 7300. This combo is ideal for gaming and multitasking with four 2.5 GHz Arm Cortex-A78 cores. Four Arm Cortex-A55 cores, which are energy-efficient, complement these and guarantee dependable performance for daily use. In comparison to the Dimensity 7050, this combination represents a major advancement.

The advanced 4nm manufacturing process is a feature of the 7300 series. This corresponds to a 25% decrease in power usage over the 6nm technique utilised in earlier generations. Users will benefit from longer battery life as a result, while manufacturers can create sleeker devices without compromising functionality.

Superpower in Graphics

Immersive mobile experiences require strong visuals. The Dimensity 7300 has an Arm Mali-G615 GPU to fix this. This graphics processor runs even the most demanding games smoothly, and MediaTek’s HyperEngine technology stabilises the network and efficiently manages resources. MediaTek says the 7300 series is appealing to mobile gamers due to its 20% higher frame rates (FPS) and energy economy.

AI Gains Strength

AI is increasingly changing the smartphone experience, enabling intelligent assistants, better photography, and facial recognition. The Dimensity 7300 uses the MediaTek APU 655, following this trend. This AI processing unit doubles the efficiency of the Dimensity 7050, resulting in a notable performance boost. New mixed precision data types, which enable more effective memory bandwidth utilisation and lower memory requirements for larger AI models, are also supported by the 7300 series. Future smartphones will be able to incorporate even more advanced AI features thanks to this.

Gorgeous Images

For a fascinating mobile experience, a stunning display is essential; a strong processor is only half the story. This demand is met by the Dimensity 7300 series, which supports powerful screens. With the ability to support WFHD+ resolutions at frame rates of up to 120 Hz, these chipsets guarantee fluid and visually spectacular images. For an even smoother user experience, the 7300 series also supports Full HD+ screens at an even higher refresh rate of 144Hz.

Concentrate on Take Pictures

Users now place a greater value on mobile photography, and the Dimensity 7300 series delivers. The chip has MediaTek’s Imagiq 950 image signal processor (ISP), which provides sophisticated photographic features. With the 12-bit HDR pipeline supported by this ISP, detailed information and brilliant colours may be captured. Furthermore, the Imagiq 950 enables features like video HDR, face detection, and precise noise reduction, guaranteeing beautiful images and movies in a range of lighting scenarios. The 7300 series stands out for its ability to enable dual simultaneous video capture, which allows for the development of more imaginative content.

A Set of Chips for Foldables

A 7300 variation called the Dimensity 7300X goes one step farther by being designed with foldable cellphones in mind. One essential component of these cutting-edge gadgets is dual display compatibility, which this chipset provides. Manufacturers may design foldable phones with seamless experiences on both the cover and main displays thanks to the 7300X.

Mobile’s Future

Mobile processing power has advanced significantly with the release of the Dimensity 7300 series. This chipset family, with its emphasis on efficiency, performance, AI capabilities, and support for cutting-edge technologies like foldable devices and high refresh rate screens, is positioned to have a significant impact on the direction of mobile technology. The Dimensity 7300 series offers makers a strong and adaptable foundation to develop next-generation smartphones that offer outstanding user experiences as smartphones continue to advance.