#chipet

Intel publicizes new 3D Lakefield chips for foldable and ultra-thin laptops

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Intel at this time unveiled its new processors meant for ultra-thin and hybrid laptops. The firm has been engaged on these for a very long time now, below the codename Lakefield. The chips use the corporate’s Foveros 3D packaging expertise to mix completely different chip architectures and reminiscence into one processor.

This permits Intel to stack completely different parts of the…