Applications of the Boron Nitride

1. Metal forming release agent and lubricant for metal drawing.

2. Special electrolysis and resistance materials at high temperature.

3. High-temperature solid lubricants, extrusion anti-wear additives, additives for the production of ceramic composites, refractories, and anti-oxidation additives, especially in the case of corrosion resistance of molten metals, thermal reinforcement additives, high-temperature insulation materials.

4. Additives for heat sealing desiccant and plastic resin.

5. Pressed boron nitride products with various shapes can be used for high temperature, high pressure, insulation, and heat dissipation parts.

6. Thermal shielding materials in aerospace.

7. Under the participation of catalyst, it can be transformed into cubic boron nitride, such as diamond, by high temperature and high-pressure treatment.

8. Structural materials for atomic reactors.

9. The nozzle of aircraft and rocket engine.

10. Insulators for high voltage, high frequency, and plasma arc.

11. Packaging materials to prevent neutron radiation.

12. Superhard materials made from boron nitride can be made into high-speed cutting tools and bits for geological exploration and oil drilling.

13. Separating rings for continuous casting steel metallurgically, flow grooves for amorphous iron, strippers for continuous casting aluminum.

14. Do all kinds of evaporation boats, such as capacitor film aluminum plating, picture tube aluminum plating, display aluminum plating and so on.

15. All kinds of fresh aluminum plated packaging bags.

16. All kinds of laser anti-counterfeiting aluminum plating, trademark gilding materials, all kinds of tobacco labels, beer labels, packaging boxes, cigarette packaging boxes aluminum plating and so on.

17. The cosmetics used for lipstick are nontoxic, lubricate and glossy.

Future prospects of boron nitride

Because of the high hardness of iron and steel materials, a lot of heat will be produced during processing. Diamond tools are easy to decompose and react with transition metals at high temperature. C-BN materials have good thermal stability and are not easy to react with iron group metals or alloys. It can be widely used in precision machining and grinding of iron and steel products. In addition to excellent wear resistance, c-BN also has excellent heat resistance. It can also cut heat-resistant steel, ferroalloy, quenched steel and so on at a considerable high cutting temperature. It can also cut high hardness cold rolls, carburized and quenched materials and Si-Al alloy with very serious tool wear. In fact, tools and abrasives made from sintered c-BN crystals have been used in high-speed and precision machining of various cemented carbide materials.

C-BN, as a wide band gap semiconductor material, has a high thermal conductivity, high resistivity, high mobility, low dielectric constant, high breakdown electric field, dual doping, and good stability. It is called the third generation semiconductor material after Si, Ge and GaAs together with diamond, SiC, and GaN. Our common feature is a wide band gap, which is suitable for making electronic devices used in extreme conditions. Compared with SiC and GaN, C-BN and diamond have more excellent properties, such as wider band gap, higher mobility, higher breakdown electric field, lower dielectric constant, and higher thermal conductivity. Obviously, as an extreme electronic material, C-BN is better than diamond. However, as a semiconductor material, diamond has its fatal weakness, that is, the n-type doping of diamond is very difficult (the resistivity of n-type doping can only reach 102 cm, far from meeting the device standard), while c-BN can achieve double-type doping. For example, in the process of high temperature and high-pressure synthesis and thin film preparation, P-type semiconductors can be obtained by adding Be, and n-type semiconductors can be obtained by adding S, C, Si, etc. Therefore, c-BN is the most excellent third-generation semiconductor material. It can not only be used to fabricate electronic devices operating in high temperature, high frequency, high power, and other extreme conditions, but also has a wide range of applications in deep ultraviolet luminescence and detectors. In fact, Mishima et al. first reported that c-BN light-emitting diodes made under high temperature and high pressure can work at 650℃ and emit visible blue light under forwarding bias. Spectral measurements show that the shortest wavelength is 215 nm. C-BN has the same thermal expansion coefficient as GaAs and Si, high thermal conductivity and low dielectric constant, good insulation and chemical stability, making it a heat sink material and insulation coating for integrated circuits. In addition, hexagonal boron nitride tube has negative electron affinity and can be used as cold cathode field emission materials. It has a wide range of applications in large area flat panel display.