R&S and Realtek Semiconductor have validated what is considered industry’s first testing solution for upcoming Bluetooth LE HDT feature.
Rohde & Schwarz and Realtek Semiconductor have demonstrated the industry’s first test solution for Bluetooth LE High Data Throughput (HDT), marking a key step toward next-generation wireless connectivity.
We are grateful for the close collaboration with Realtek Semiconductors on the upcoming Bluetooth LE features to demonstrate the unique capabilities of the CMP180 over the entire product life cycle. Our experience in wireless device testing and this early cooperation with Realtek allow us to provide best-in-class test solutions for our customers. said, Goce T., Vice President of Mobile Radio Testers at Rohde & Schwarz,
Bluetooth LE High Data Throughput is a key enabler for the next wave of immersive audio and seamless connectivity experiences. By combining our RTL8922D Wi Fi/Bluetooth combo chip and RTL8773J Bluetooth audio SoC with the CMP180 test platform from Rohde & Schwarz, we can help our customers bring HDT ready products to market faster, with proven performance from R&D through mass production. said, Yee-Wei H., Vice President and Spokesman at Realtek Semiconductor Corp.
