#based-on-emerging

Samsung starts production of 3D DDR4 DRAM modules

Samsung has started producing 64GB DRAM modules for servers based on emerging DDR4 (double-data rate 4) memory using 3D “through silicon via” (TSV) package technology. The 64GB capacity is the largest for DRAM modules yet, which will improve application performance because data will be kept in memory longer so that bits don’t have to be transferred as often between DRAM and other components such …