Cadence, introduced the AuraStack AI Super Agent on Cadence Allegro AI Studio, the world’s first agentic AI platform for PCB.
Cadence has introduced AuraStack AI for PCB and advanced packaging, empowering engineering teams to accelerate design cycles, optimize workflows, and improve productivity with AI-driven intelligence. As semiconductor complexity continues to grow, solutions like AuraStack AI are helping engineers deliver faster, smarter, and more efficient electronic system designs.
“The next era of AI infrastructure—spanning data centers, automotive, aerospace and physical AI—will be defined not only by silicon, but by the systems that connect, power and cool it,” said Michael Jackson, corporate vice president of R&D for System Design and Analysis at Cadence. “As hyperscale data centers deploy massive AI clusters and other industries advance increasingly intelligent, high-performance systems, engineering teams face growing complexity in PCB and advanced package design. Agentic AI orchestration, combined with trusted EDA and SDA tools, enables customers to move from manual iteration to intelligent, automated design realization.”
